本文主要探討玻璃-陶瓷(可結晶玻璃, CG)與玻璃+陶瓷(多相陶瓷, CFG)之雙層介電材料系統共燒時的應力發展。使用同步照相的方法記錄試片燒結時的曲率變化，並以黏性模型分析共燒過程中不匹配應力(mismatch stress)的大小，結果顯示共燒時所產生的不匹配應力遠小於燒結驅動力(sintering potential)。因此，不匹配應力對於燒結的緻密性並無顯著的影響，亦不會造成共燒缺陷，如脫層、破裂...等。
此外，將熱機械分析儀所量測的應變率差帶入應力方程式中計算，可以發現其數值和由曲率計算之不匹配應力相似。

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