本論文研究利用一組推導出來的熱源-薄膜-基板系統之數學解析解(analytical solution)，利用這組解析解，本研究開發出三種可應用於不同膜厚範圍之薄/厚膜熱傳導性能(thermal conductivity)量測方法。並且利用這些量測方法，量測估算出金屬-介電層之界面熱阻(metal-dielectric interfacial thermal resistance)。在創新量測方法研究開發方面，首先在50 nm~2 μm膜厚範圍內，本論文研究發展出一種我們稱為平行線法(parallel-strip method)的創新量測方法，同時我們量測了三種不同製程所沉積的SiO2薄膜，同時與先前之文獻值比較，結果相當吻合。在2μm ~10μm膜厚範圍內，我們修正了平行線法的部份關係式，發展出另一個薄膜量測法，並且針對電化學沉積技術(electroposition process)所沉積之Bi-Te與Sb-Te熱電薄膜(thermoelectric thin-film)進行量測。同時也針對熱電薄膜結構易碎的限制，研究出一種測試樣品製備的方法，結果成功量測出三種不同製程參數所成長的熱電薄膜。在膜厚10 μm ~1000 μm厚膜方面，我們使用相同的數學解析解，推導出一種我們稱為膜厚差異法(thickness difference method)之創新方法。該方法針對SU8厚膜進行量測，同時與文獻值比較，結果非常吻合。而在金屬-介電層之界面熱阻量測方面，我們使用平行線法，針對一種三明治薄膜結構(sandwiched film structure)進行量測。結果量測出五種不同金屬，Cr、Ti、Al、Ni、Pt，與PECVD SiO2之界面熱阻值，並研究證實連續二流體理論模型(the continuum two-fluid model)，無法完整解釋金屬-介電層界面熱阻之發生機制，同時該項研究也嘗試利用TEM觀察，與簡單的模擬估算，提出一種導因於界面不完美熱接觸之界面熱阻成因解釋。

Many methods for the measurement of the thermal conductivity of thin films have been reported in the previous scientific literatures. Because each class of thin-film structure presents an almost unique set of experimental impediments to overcome, no particular measurement method has become universally accepted. Therefore, different strategies and many techniques are needed for developing a simple, convenient and reliable measurement method for each class thin-film.
In this study, we had derived a set of mathematical analytical solution from a complete heater-film-substrate system model. Based on the analytical solutions, we had successfully developed three novel methods for three different thickness ranges of thin/thick film. In the range of film thickness between 50 nm to 2 μm, a novel method, called parallel-strip method, had been developed and three types of SiO2 been measured in that work. The measured results agree with that of the previous literatures. In the range between 2 μm to 10 μm, a modified parallel-strip method had been developed and four types of thermoelectric thin films fabricated by electrodeposition process had been measured, also an epoxy resin layer, substitute for SiO2 to serve as the dielectric layer, were introduced to the sample preparing process. For thick-film of 10 μm to 1000 μm in thickness, a novel method, called thickness difference method, had been built. The method is very simple because derived from a concise semi-empirical correlation. SU8 thick film had been tested by using the novel method and yielded a quite accurate result compared with the previous literatures.
By using parallel-strip method and a sandwiched film structure, metal-dielectric interfacial thermal resistance had also been studied in this work. A metal layer of thickness about 10 nm, including Cr (chromium), Ti (titanium), Al (aluminum), Ni (nickel) and Pt (platinum), is sandwiched between two PECVD SiO2 layers of thickness 100 nm. The estimates, 10-10~10-9 m2 K/W, calculated with a continuum two-fluid model are significantly smaller than the measured values, ~10-8 m2 K/W. The continuum two-fluid model, which according to the phenomena of electron-phonon nonequilibrium near the interface in a metal, cannot explain completely the cause of this metal-dielectric interfacial thermal resistance. From photographs of the TEM cross section, we argue that defects at an interface likely play an important role in the magnitude of the interfacial thermal resistance.

1 R. Baierlein, Thermal Physics, Cambridge University Press, Cambridge, UK, 2001
2 G. Chen, Nanoscale Energy Transport and Conversion, Oxford University Press, New York, USA, 2005
3 D.M. Rowe, Thermoelectrics Handbook: Macro to Nano, CRC Press, Florida, USA, 2005
4 簡恆傑, "薄膜熱傳導性能量測方法", 先進微系統與構裝技術, 25, pp.57-67, 2007
5 D. G. Cahill, W. K. Ford, K. E. Goodson et al., "Nanoscale Thermal Transport", J. Appl. Phys., 93, pp.793-818, 2003
6 J. E. Graebner, J. A. Mucha, L. Seibles et al., "The Thermal Conductivity of Chemical-Vapor-Deposited Diamond Films on Silicon", J. Appl. Phys., 71, pp.3143-3146, 1992
7 Y. C. Tai, C. H. Mastrangelo, and R. S. Muller, "Thermal Conductivity of Heavily Doped Low-Pressure Chemical Vapor Deposited Polycrystalline Silicon Films", J. Appl. Phys., 63, pp.1442-1447, 1988
8 E. P. Visser, E. H. Versteegen, and J. P. Enckevort, "Measurement of Thermal Diffusion in Thin Films Using a Modulated Laser Technique: Application to Chemical-Vapor-Deposited Diamond Films", J. Appl. Phys., 71, pp.3238-3248, 1992
9 J. E. Graebner, S. Jin, G. W. Kammlott et al., "Anisotropic Thermal Conductivity in Chemical Vapor Deposition Diamond", J. Appl. Phys., 71, pp.5353-5356, 1992
10 G. Chen, C. L. Tien, X. Wu et al., "Thermal Diffusivity Measurement of GaAs/AlGaAs Thin-Film Structures", J. Heat Transfer, 116, pp.325-331, 1994
11 S. Govorkov, W. Ruerman, M. W. Horn et al., "A New Method for Measuring Thermal Conductivity of Thin Films", Rev. Sci. Instrum., 68, pp.3828-3834, 1997
12 E. Jansen and E. Obermeier, "Thermal Conductivity Measurements on Thin Films Based on Micromechanical Devices", J. Micromech. Microeng., 6, pp.118-121, 1996
13 O. W. K□ding, H. Shurk, and K. E. Goodson, "Thermal Conduction in Metallized Silicon-Dioxide Layers on Silicon", Appl, Phys. Lett., 65, pp.1629-1631, 1994
14 G. Pompe and K. Schmidt, "Vapour-Deposited Lead Films and Their Transport Characteristics at Low Temperatures", Phys Stat Sol., A31, pp.37-46, 1975
15 T.Yao, "Thermal Properties of AlAs/GaAs superlattices", Appl. Phys. Lett., 51, pp.1798-1800, 1987
16 D. G. Cahill, "Thermal Conductivity Measurements from 30K-750K: The 3 Omega Method", Rev. Sci. Instrum., 61, pp.802-808, 1990
17 D. G. Cahill, "Heat Transport in Dielectric Thin Films and at Solid-Solid Interfaces", Microscale Thermophys. Eng., 1, pp.85-109, 1997
18 J. H. Kim, A. Feldman, and D. Novotny, "Application of the Three Omega Thermal Conductivity Measurement Method to a Film on a Substrate of Finite Thickness", J. Appl. Phys., 86, pp.3959-3963, 1999
19 C. E. Raudzis and F. Schatz, "Extending the 3ω Method for Thin-Film Analysis to High Frequencies", J. Appl. Phys., 93, pp.6050-6055, 2003
20 T. Yamane, N. Nagai, S. Katayama et al., "Measurement of Thermal Conductivity of Silicon Dioxide Thin Films Using a 3ω Method", J. Appl. Phys., 91, pp.9772-9776, 2002
21 N. W. Ashcroft and N. D. Mermin, Solid State Physics, Brooks/Cole, Toronto, 1976
22 M. P. Marder, Condensed Matter Physics, WILEY-interscience, New York, 2000
23 李雅明, 固態電子學, 全華科技圖書股份有限公司, 台北市, 2002
24 閻守勝, 固態物理概論: fundamental of solid state physics, 五南圖書出版股份有限公司, 臺北市, 2006
25 B. S. Chandrasekhar, 凝態 Everywhere (Why Things Are the Way They Are), 天下文化, 台北, 2000
26 C. Kittel, Introduction to Solid State Physics, John Wiley & Sons. Inc, 1996
27 W.M. Rohsenow and H.Y. Choi, Heat Mass and Momentum Transfer, Prentice Hall, Englewood Cliffs, NJ, 1961
28 M. I. Flik, B. I. Choi, and K. E. Goodson, "Heat Transfer Regimes in Microstructures", J. Heat Transfer, 114, pp.666-674, 1992
29 C. J. Glassbrenner and G. A. Slack, "Thermal Conductivity of Silicon and Germanium from 3°K to the Melting Point ", Phys. Rev., 134, pp.A1058-A1069, 1964
30 C. L. Tien and G. Chen, "Challenges in Microscale Conductive and Radiative Heat Transfer", J. Heat Transfer, 116, pp.799-807, 1994
31 A. Majumdar, "Microscale Heat Conduction in Dielectric Thin Films", J. Heat Transfer, 115, pp.7-16, 1993
32 J. M. Ziman, Electrons and Phonons, Oxford University Press, London, 1960
33 S. M. Lee and D. G. Cahill, "Heat Transport in Thin Dielectric Films", J. Appl. Phys., 81, pp.2590-2595, 1997
34 S. Kotake, "Molecular Engineering Problems in Heat and Mass Transfer", ASME Thermal Engineering Proceedings, 4, pp.33-40, 1991
35 S. Wakuri and S. Kotake, "Molecular Dynamics Study of Heat Conduction in Very Thin Films", ASME/JSME Thermal Engineering Proceedings, 4, pp.111-116, 1991
36 G. Chen and C. L. Tien, "Thermal Conductivity of Quantum Well. Structures", J. Thermophysics and Heat Transfer, 7, pp.311-318, 1993
37 C. K. Liu, C. K. Yu, H. C. Chien et al., "Thermal Conductivity of Si/SiGe Superlattice Films", J. Appl. Phys., 104, pp.114301, 2008
38 S. Y. Ren and J. D. Dow, "Thermal Conductivity of Superlattice", Phys. Rev. B, 25, pp.3750-3755, 1982
39 Y. S. Ju, M. T. Hung, and T. Usui, "Nanoscale Heat Conduction across Metal-Dielectric Interfaces", J. Heat Transfer, 128, pp.919-925, 2006
40 W. A. Little, "The Transport of Heat Between Dissimilar Solids at Low Temperature", Can, J. Phys., 37, pp.334-349, 1959
41 R. J. Stevens, L. V. Zhigilei, and P. M. Norris, "Effects of Temperature and Disorder on Thermal Boundary Conductance at Solid-Solid Interfaces: Nonequilibrium Molecular Dynamics Simulations", Int. J. Heat and Mass Transfer, 50, pp.3977-3989, 2007
42 E. T. Swartz and R. O. Pohl, "Thermal Resistance at Interfaces", Appl. Phys. Lett., 51, pp.2200-2202, 1987
43 E. T. Swartz and R. O. Pohl, "Thermal Boundary Resistance", Rev.of Modern Phys., 61, pp.605-668, 1989
44 C. D. Marshall, I. M. Fishman, R. C. Dorfman et al., "Thermal Diffusion, Interfacial Thermal Barrier, and Ultrasonic Propogation in YBa2Cu3O7 Thin Film: Surface-Selective Transient-Grating Experiment", Phy. Rev. B, 45, pp.10009-10021, 1992
45 R. C. Chen, J. P. Wu, and H. S. Chu, "Borometric Response of High-Tc Superconducting Detectors to Optical Pluses and Continuous Waves ", J. Heat Transfer, 117, pp.528-534, 1995
46 R. S. Prasher and P. E. Phelan, "A Scattering Mediated Acoustic Mismatch Model for the Prediction of Thermal Boundary Resistance", J. Heat Transfer, 123, pp.105-112, 2001
47 M. Kelkar and P. E. Phelan, "Thermal Boundary Resistance for Thin Film High-Tc Superconductors at Varying Interfacial Temperature Drops", Int. J. Heat and Mass Transfer, 40, pp.2637-2645, 1997
48 G. Chen, "Size and Interface Effect on Thermal Conductivity of Superlattices and Periodic Thin-Film Structures", J. Heat Transfer, 119, pp.220-229, 1997
49 簡恆傑, "微尺度薄膜熱傳導性能量測方法", 工業材料, 247, pp.95-105, 2007
50 K. E. Goodson and M. I. Flik, "Solid Layer Thermal Conductivity Measurement Techniques", Appl. Mech. Rev., 47, pp.101-112, 1994
51 G. Chen, D. Borca-Tasciuc, and R. G. Yang, Nanoscale Heat Transfer, American Scientific Publishers, 2004
52 F. P. Incropera and D. P. DeWitt, Fundamental of Heat and Mass Transfer, John Wiley & Sons, New York, 1996
53 A. C. Tam, "Applications of Photoacoustic Sensing Techniques", Rev. Mod. Phys., 58, pp.381-431, 1986
54 G. Langer, J. Hartmann, and M. Reichling, "Thermal Conductivity of Thin Metallic Films Measured by Photothermal Profile Analysis", Rev. Sci. Instrum., 68(3), pp.1510-1513, 1997
55 E. T. Ogawa, C. Hu, and P. S. Ho, "Thermal Diffusivity Measurement of Polymeric Thin Films Using the Photothermal Displacement Technique. II. On-Wafer Measurement ", J. Appl. Phys., 86, pp.6018-6037, 1999
56 P. K. Wong, P. C. W. Fung, H. L. Tam et al., "Thermal-Diffusivity Measurements of an Oriented Superconducting-Film Substrate Composite Using the Mirage Technique", Phys. Rev. B, 51, pp.523, 1995
57 K. Kurabayashi, "Anisotropic Thermal Properties of Solid Polymers", Int. J. Thermophysics, 22, pp.277-288, 2001
58 F. Volklein, "Thermal Conductivity and Diffusivity of a Thin Film SiO2-Si3N4 Sandwich System", Thin Solid Films, 188, pp.27-33, 1990
59 Q. Song, Z. Cui, S. Xia et al., "Measurement of SiNx Thin Film Thermal Property with Suspended Membrane Structure", Sensors and Actuators A, 112, pp.122-126, 2004
60 A. D. Mcconnell, S. Uma, and K. E. Goodson, "Thermal Conductivity of Doped Polysilicon Layers", J. Microelectromech. Syst., 10, pp.360-369, 2001
61 Martin von Arx, "Process-Dependent Thin-Film Thermal Conductivities for Thermal CMOS MEMS", J. Microelectromech. Syst., 9, pp.136-145, 2000
62 C. J. Morath, H. J. Maris, J. J. Cuomo et al., "Picosecond Optical Studies of Amorphous Diamond and Diamo Carbon: Thermal Conductivity and Longitudinal Sound Velocity", J. Appl. Phys., 76, pp.2636, 1994
63 賴威志 饒達仁, 簡恆傑, 徐振庭, "二氧化矽薄膜之熱傳導係數與邊界熱阻之量測研究", 科儀新知, 162, pp.59-65, 2008
64 B. Y. Tsui, C. C. Yang, and K. L. Fang, "Anisotropic Thermal Conductivity of Nanoporous Silica Film", Transcation on Electron Devices, 51, pp.20-27, 2004
65 B. Olson, S. Graham, and K. Chen, "A Practical Extension of the 3ω Method to Multilayer Structures", Rev. Sci. Instrum., 76, pp.053901, 2005
66 T. Borca-Tasciuc, A. R. Kumar, and G. Chen, "Data Reduction in 3 Omega Method for Thin-Film Thermal Conductivity Determination", Rev. Sci. Instrum., 72, pp.2139-2147, 2001
67 J. H. Kim, A. Feldman, and D. Novotny, "Application of the Three Omega Thermal Conductivity Measurement Method to a Film on a Substrate of Finite Thickness", J. Appl. Phys., 86, pp.3959-3963, 1999
68 S. M. Lee, "Thermal Conductivity Measurement of Fluids Using the 3ω Method", Rev. Sci. Instrum., 80, pp.024901, 2009
69 C. Dames and G. Chen, "1ω, 2ω, and 3ω Methods for Measurements of Thermal Properties", Rev. Sci. Instrum., 76, pp.124902, 2005
70 H. C. Chien, D. J. Yao, M. J. Huang et al., "Thermal Conductivity Measurement and Interface Thermal Resistance Estimation Using SiO2 Thin Film", Rev. Sci. Instrum., 79, pp.054902, 2008
71 K. E. Goodson, M. I. Flik, L. T. Su et al., "Prediction and Measurement of the Thermal Conductivity of Amorphous Dielectric Layers", J. Heat Transfer, 116, pp.317-324, 1994
72 饒達仁, 簡恆傑, 陳昭榮, "金屬電阻溫度係數之自我加熱效應探討", 中華民國第二十八屆全國力學會議, 臺北, 臺灣, R. O. C., 2004
73 Jr. A. J. Griffin, F. R. Brotzen, and P. J. Loos, "The Effective Transverse Thermal Conductivity of Amorphous Si3N4 Thin Films", J. Appl. Phys., 76, pp.4007-4011, 1994
74 Jr. A. J. Griffin, F. R. Brotzen, and P. J. Loos, "Effect of Thickness on the Transverse Thermal Conductivity of Thin Dielectric Films", J. Appl. Phys., 75, pp.3761-3764, 1994
75 Y. S. Touloukian, R. W. Powell, C. Y. Ho et al., Thermal Conductivity:Nonmetallic Solids, New York, IFI/Plenum, 1970
76 A. Majumdar and P. Reddy, "Role of Electron-Phonon Coupling in Thermal Conductance of Metal-Nonmetal Interfaces", Appl. Phys. Lett., 84, pp.4768-4770, 2004
77 T.C. Harman, P.J. Taylor, M. P. Walsh et al., "Quantum Dot Superlattice Thermoelectric Materials and. Devices", Science, 297, pp.2229-2232, 2002
78 W. Kim, J. Zide, A. Gossard et al., "Thermal Conductivity Reduction and Thermoelectric Figure of Merit Increase by Embedding Nanoparticles in Crystalline Semiconductors", Phys. Rev. Lett., 96, pp.045901, 2006
79 X. F. Tang, W. J. Xie, H. Li et al., "Preparation and Thermoelectric Transport Properties of High-Performance P-type Bi2Te3 with Layered Nanostructure", Appl. Phys. Lett., 90, pp.012102, 2007
80 R. Venkatasubramanian, E. Siivola, T. Colpitts et al., "Thin-film Thermoelectric Devices with High Room-temperature Figures of Merit ", Nature, 413, pp.597-602, 2001
81 P. Heo, K. Hagiwara, R. Ichino et al., "Electrodeposition and Thermoelectric Characterization of Bi2Te3 ", J. Electrochem. Soc., 153, pp.C213-217, 2006
82 M. Y. Kim and T. S. Oh, "Electrodeposition and Thermoelectric Characteristics of Bi2Te3 and Sb2Te3 Films for Thermopile Sensor Applications", J. Electron. Mater., 38, pp.1176-1181, 2009
83 S. Li, M. S. Toprak, H. M. A. Soliman et al., "Fabrication of Nanostructured Thermoelectric Bismuth Telluride Thick Films by Electrochemical Deposition", Chem. Mater., 18, pp.3627-3633, 2006
84 G. J. Snyder, J. R. Lim, C. K. Huang et al., "Thermoelectric Microdevice Fabricated by MEMS-Like Electrochemical Process", Nat. Mater., 2, pp.528-531, 2003
85 A. Mzerd, D. Sayah, J. C. Tedenac et al., "Optical Crystal Growth Conditions of Thin Films of Bi2Te3 Semiconductors", J. Cryst. Growth, 140, pp.365-369, 1994
86 A. Boulouz, A. Giani, F. Pascal-Delannoy et al., "Growth of Bi2Te3 and Sb2Te3 Thin Films by MOCVD", Mater. Sci. Eng. B, 64, pp.19-24, 1999
87 A. Dauscher, A. Thomy, and H. Scherrer, "Pulsed Laser Deposition of Bi2Te3 Thin Films", Thin Solid Films, 280, pp.61-66, 1996
88 R. S. Makala, K. Jagannadham, and B. C. Sales, "Pulsed Laser Deposition of Bi2Te3-Based Thermoelectric Thin Films", J. Appl. Phys., 94, pp.3907-3918, 2003
89 F. Volklein, V. Baier, U. Dillner et al., "Transport Properties of Flash-Evaporated (Bi1-xSbx)2Te3 Films I: Optimization of Film Properties", Thin Solid Films, 187, pp.253-262, 1990
90 H. Noro, K. Sato, and H. Kagechika, "The Thermoelectric Properties and Crystallography of Bi-Sb-Te-Se Thin Films Grown by Ion Beam Sputtering", J. Appl. Phys., 73, pp.1252-1260, 1993
91 廖莉菱, "熱電材料應用於散熱為致冷晶片之技術開發", 國立台灣師範大學機電科技學系, 碩士論文, 2009
92 C. R. Yang, C. H. Yang, and P. Y. Chen, "Study on Anisotropic Silicon Etching Characteristics in Various Surfactant-Added Tetramethyl Ammonium Hydroxide Water Solutions", J. Micromech. Microeng., 15, pp.2028-2037, 2005
93 M. Takashiri, K. Miyazaki, S. Tanaka et al., "Effect of Grain Size on Thermoelectric Properties of n -type Nanocrystalline Bismuth-Telluride Based Thin Films", J. Appl. Phys., 104, pp.084302, 2008
94 T. Thonhauser, T. J. Scheidemantel, J. O. Sofo et al., "Thermoelectric Properties of Sb2Te3 Under Pressure and Uniaxial Stress", Phys. Rev. B, 68, pp.085201, 2003
95 O. Yamashita, K. Satou, H. Odahara et al., "Dependence of Thermal Conductivity on Electrical Resistivity in Bismuth-Tellurides", J. Phys. Chem. Solids, 66, pp.1287-1293, 2005
96 M. Takaishi, S. Tanaka, K. Miyazaki et al., "Thermal Conductivity Measurements of Bismuth Telluride Thin Films by Using the 3 Omega Method ", Thermophys Prop, 27, pp.24-26, 2006
97 S. Miura, Y. Sato, K. Fukuda et al., "Texture and Thermoelectric Properties of Hot-Extruded Bi2Te3 Compound", Mater. Sci. Eng.: A, 277, pp.244-249, 2000
98 G. J. Snyder, in Thermoelectrics Handbook: Macro to Nano, edited by edited by D. M. Rowe (CRC Press, Boca Raton, FL, 2006), p. chapter 9.
99 H. Scherrer and S. Scherrer, in Thermoelectrics Handbook: Macro to Nano, edited by edited by D. M. Rowe (CRC Press, Boca Raton, FL, 2006), p. chapter 27.
100 國科會精儀中心, 微機電系統技術與應用, 國科會精儀中心, 新竹市, 2003
101 簡恆傑, 李聖良, 楊書榮, "快速電子構裝熱阻量測方法", 中國機械工程學會第二十三屆學術研討會, 臺南, 2006, pp.E5-010
102 H. C. Chien, D. J. Yao, and C. T. Hsu, "Measurement and Evaluation of the Interfacial Thermal Resistance between a Metal and a Dielectric", Appl, Phys. Lett., 93, pp.231910, 2008
103 A. V. Sergeev, "Electronic Kapitza Conductance Due to Inelastic Electron-Boundary Scattering", Phy. Rev. B, 58, pp.R10199, 1998
104 Y. Sungtaek. Ju, "Impact of Nonequilibrium Between Electrons and Phonons on Heat Transfer in Metallic Nanoparticles Sespended in Dielectric Media", J. Heat Transfer, 127, pp.1400-1402, 2005
105 J. G. Fujimoto, J. M. Liu, and E. P. Ippen, "Femtosecond Laset Interaction with Metallic Tungsten and Nonequilibrium Electron and Lattice Temperature", Phy. Rev. Lett., 53, pp.1837-1840, 1984
106 T. Q. Qiu and C. L. Tien, "Short-Pulse Laser Heating on Metals", Int. J. Heat Mass Transfer, 35, pp.719-726, 1992
107 T. Q. Qiu and C. L. Tien, "Heat Transfer Mechanisms During Short-Pulse Laser Heating of Metals", J. Heat Transfer, 115, pp.835-841, 1993
108 劉靜, 微米奈米尺度傳熱學, 五南圖書出版公司, 台北, 2004
109 A. N. Smith J. L. Hostetler, D. M. Czajkowsky, and P. M. Norris, "Measurement of The Electron-Phonon Coupling Factor Dependence on Film Thickness and Grain Size in Au, Cr, and Al", Applied Optics, 38, pp.3614-3620, 1999
110 P. E. Hopkins, J. M. Klopf, and P. M. Norris, "Influence of Interband Transitions on Electron-Phonon Coupling Measurements in Ni Films", Applied Optics, 46, pp.2076-2083, 2007
111 Z. Lin, L. V. Zhigilei, and Vittorio Celli, "Electron-Phonon Coupling and Electron Heat Capacity of Metals Under Conditions of Strong Electron-Phonon Nonequilibrium", Phy. Rev. B, 77, pp.075133, 2008
112 J. Hohlfeld, S. -S. Wellershoff, J. G□dde et al., "Electron and Lattice Dynamics Following Optical Excitation of Metals", Chem. Phys., 251, pp.237-258, 2000
113 C. Kittel, Introduction to Solid State Physics, John Wiley & Sons. Inc, 2004
114 B. L. Zink and F. Hellman, "Specific Heat and Thermal Conductivity of Low Stress Amorphous Si-N Membranes", Sol. St. Comm., 129, pp.199-204, 2004
115 L. B. Freund and S. Suresh, Thin Film Materials: Stress, Defect Formation and Surface Evolution, Cambridge University Press, 2003
116 M. Ohring, The Materials Science of Thin Films, Academic Press, 2002