本研究利用影響蝕刻線寬的重要操作因子如蝕刻時間、蝕刻溫度、蝕刻液流量等，加上積分移動平均Integrated Moving Average IMA(1,1)時間序列干擾項追蹤如酸液組成等無法測量因素的變化，建立液晶面板工廠之濕蝕刻製程的模擬，使工廠能預測及監控蝕刻線寬的變異；並運用批間控制(Run-to-RunControl)改善蝕刻線寬之製程能力Cpk。所使用的批間控制方法除以指數加權移動平均(Exponential Weighted Moving Average, EWMA)計算蝕刻時間的修正，並使用區間控制(Zone Control)降低控制器調整配方的頻率，以及考慮產能的限制。經模擬證明此一方法確實能改善目前工廠的製程能力Cpk。

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