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研究生: 黃至弘
Chih-hung, Huang
論文名稱: TIM測量平台之精準度分析
Analysis for Accuracy of Thermal Interface Material (TIM) Test Experimental Equipment
指導教授: 林唯耕
W.K. Lin
口試委員:
學位類別: 碩士
Master
系所名稱: 原子科學院 - 工程與系統科學系
Department of Engineering and System Science
論文出版年: 2005
畢業學年度: 93
語文別: 中文
論文頁數: 165
中文關鍵詞: 熱介面材料熱阻抗熱傳導係數
外文關鍵詞: Thermal Interface Material, Thermal Resistance, Thermal Conductivity, Dummy Heater, Thermal Grease, Thermal Pad, TIM
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  • 效能好的TIM可以大幅降低CPU和Cooler之間的界面熱阻。為了得到最佳化的選擇,我們必須精準地量測出TIM的熱性質。目前沒有任何理論模式可預測TIM的熱性質,所以精準的測量平台和方法是相當重要的。本實驗以熱傳導理論為起點,加上精密加工技術,利用工程與系統科學系電子構裝實驗室所設計之Dummy Heater,針對電腦所使用之熱介面材料,發展出一套製作低成本、高準確率的熱性質量測系統。
    本實驗分為兩大部分。第一部份是針對金屬材料熱傳導係數的量測;第二部份則是熱介面材料的熱性質量測。本論文所設計之治具各有其不同的熱通量值,當治具設計完成之後,藉由理論分析所得到之結果對待測金屬做熱性質分析,再和實驗結果做比較,以驗證實驗治具之精準度。經過驗證之後,將精準度高的實驗治具,用於第二部份熱介面材料之熱性質量測。最後配合自行發展之軟體,在實驗操作時,由電腦擷取所需資料,提供操作者一個簡易的操作環境。


    摘要 I 誌謝 II 目錄 IV 表目錄 VI 圖目錄 IX 第一章 緒論 1 第二章 理論基礎 8 第三章 實驗設備與方法 20 第四章 結果與討論 46 第五章 結論 117 參考文獻 120 附錄 軟體操作手冊 122

    [1] ASTM C177-97, Standard Test Method for Steady-State Heat Flux
    Measurements and Thermal Transmission Properties by Means of the Guarded-Hot-Plate Apparatus, West Conshohocken , PA.

    [2] ASTM D374, Standard Test Methods for thickness of Solid Electrical Insulation Materials ,American Society for Testing and Materials, West Conshohocken, PA.

    [3] ASTM D5470-01, Standard Test Methods for Thermal Transmission Properties of Thin Thermally Conductive Solid Electrical Insulation Materials, American Society for Testing and Materials, West Conshohocken, PA.

    [4] ASTM E1225-99, Standard Test Method for Thermal Conductivity of
    Solid by Means of Guarded-Comparative-Longitudinal Heat Flow
    Technique, West Conshohocken, PA.

    [5] Seri Lee, Malcolm Early, “Thermal Interface Material Performance
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    [6] Robert A Rauch, “Testing methods for characterizing the thermal transmission Properties of phase-change thermal interface materials, Electronics Cooling, May 1999.

    [7] Bill Adams, “Radiator Heat Dissipation Testing”, Electronics
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    [8] Thermagon company, “Test Specifications of Thermal Resistance”, September 2001.

    [9] Dr. Ron Hunadi, “Thermal Greases with Exceptionally high thermal conductivity and low thermal resistance”, International Symposium on Advanced Packaging Materials, 1998.

    [10] Gary L. Solbrekken, “The Development of a Predict Package Level Thermal Interface Material Performance”, Inter Society Conference on Thermal Phenomena, 2000.

    [11] Aoki Russel and Chin Chia-pin, “A Testing Apparatus for Thermal Interface Materials”, International symposium on Mircoelectronics, 1998.

    [12] Chin Chia-pin and Gary L., “Thermal Modeling of Grease-Type Interface Material in PPGA Application”.

    [13] Suresh V. Garimella and Anthony F. Black, “Technical Brief - Prediction of thermal contact resistance”, Electronics Cooling, volume 9, no.4, November 2003.

    [14] Khatri; Prakash, “Dry thermal grease”, United States Patent 6475962, November 2002.

    [14] Chiu Chia-pin; Shipley, James C.; Simmons, Craig B., “Short carbon fiber enhanced thermal grease”, United States Patent Application 20030000690, January 2003.

    [15] Jie Wei, “Measurement of Vapor Chamber Performance”, 19th IEEE SEMI-THERM Symposium.

    [16] Vijit Wuttijumnong, Thang Nguyen, Masataka Mochizuki, Koichi Mashiko, Yuji Saito & Tien Nguyen, “Overview Latest Technologies Using Heat Pipe & Vapor Chamber For Cooling Of High Heat Generation Notebook Computer”, 20th IEEE SEMI-THERM Symposium.

    [17] Daniel Blazej, “Thermal Interface Materials”, Electronics Cooling, volume 9, no.4, November 2003.

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