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研究生： 蔡馥亦
Tsai, Fu-Yi
論文名稱： 空孔與顆粒缺陷在矽晶圓對界面中行為之研究
指導教授： 胡塵滌
Hu, Chen-Ti
口試委員: 吳錫侃
楊聰仁
學位類別： 碩士
Master
系所名稱： 工學院 - 材料科學工程學系
Materials Science and Engineering
論文出版年： 2011
畢業學年度： 99
語文別： 中文
論文頁數： 90
中文關鍵詞： 界面缺陷 、空孔缺陷 、顆粒缺陷 、矽晶圓對 、推壓力 、界面能
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    • 本研究藉由動態刀刃法觀察矽晶圓對中不同種類缺陷於界面之行為特性，探討晶圓對界面上之空孔缺陷及人工製作的顆粒缺陷與刀刃受力關係及差異，建立界面缺陷行為的可能機制，以及討論不同熱處理溫度與矽晶圓對上不同位置對晶圓對界面強度與局部接合強度之影響與關係。
    根據矽晶圓對之動態刀刃法分析結果，刀刃所承受之推壓力隨熱處理溫度與插刀時間增加而增加。當刀刃裂口接近未經熱處理晶圓對的空孔缺陷時，缺陷發生前進移動而非預期的與裂口快速連結，且空孔缺陷移動距離會受刀刃已運動距離長短影響，刀刃所承受之推壓力隨插刀的時間而增加，推測與氫鍵密度增加有關，而當空孔缺陷與裂口連結瞬間刀刃所承受之推壓力無明顯變化。至於熱處理後晶圓對的空孔缺陷及顆粒缺陷行為，乃如預期的與刀刃裂口快速連結，連結瞬間，因釋放晶圓之彎曲彈性能可觀察到刀刃承受之推壓力值明顯減少。

    第一章 前言 1 第二章 文獻回顧 3 2-1. 簡介晶圓接合 (Wafer Bonding) 3 2-2. 晶圓接合之歷史回顧 4 2-3. 晶圓接合之應用 5 2-3-1. 積體電路 (IC)之應用 5 2-3-2. 微機電系統 (MEMS)之應用 7 2-3-3. P-N junction 的應用 7 2-3-4. 異質接合之應用 8 2-3-5. 封裝保護作用 10 2-4. 晶圓接合強度分析 10 第三章 實驗程序 26 3-1. 晶圓表面清洗 26 3-2. 接合及熱處理步驟 27 3-3. 含人工顆粒(Man-made Particle Defects)之晶圓對製程 27 3-3-1. 人工顆粒(Man-made Particle Defects)製程 27 3-3-2. 接合及熱處理步驟 28 3-4. 實驗分析與儀器介紹 29 3-4-1. 紅外線照相術 29 3-4-2. 接合界面動態刀刃分析 30 3-4-3. 界面能測試 31 3-4-4. 晶圓表面分析 32 第四章 結果與討論 36 4 -1. 熱處理溫度對晶圓對接合強度的影響 36 4 -2. 不同位置接合強度的研究 40 4 -3. 空孔缺陷(Void Defect)的動態刀刃分析 41 4-4. 顆粒缺陷(Particle Defect)的動態刀刃分析 46 第五章 結論 82 參考文獻 85

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