微機電系統（Micro-electro-mechanical system）發展至今，很多元件都已臻於成熟並大量應用在我們日常生活所使用的電子系統當中。在設計的過程中，機械構件與電子介面的匹配整合是很重要的一環，不外乎利用複合的方式或是單塊式共晶片（on-chip）兩種方式來作連接。
單塊式共晶片（on-chip）的方式固然整合性較高，但難度亦偏高，故本文利用SOG（Silicon On Glass）矽晶片搭配上簡易的製程製造出一微型電容感測式加速度計元件，輔以複合式的機電整合方式來完成加速度計感測系統。本文的成果不但提供了一個完整的設計流程，並藉由電性上的量測來探討在機電整合介面上的問題。期望此一架構能對未來類似的延伸應用提供一個完善的參考依據。

Many devices of MEMS（Micro-electro-mechanical system）have maturely developed and applied with electrical systems in our daily life. During designing, the integration of interface of the mechanical devices and electrical circuits is very important. The hybrid-connected integration and monolithic single chip integration are the most two common solutions.
With the high integration of monolithic system, it is more difficult to be achieved than hybrid-connected configuration. This study demonstrates an capacitive accelerometer sensor system based on hybrid integration interface consists of mechanical structure realized on SOG（Silicon On Glass）silicon substrate and capacitive sensing integrated circuits. It also proposes a complete design flow of MEMS device and analysis of interface between mechanical and electrical parts.

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