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研究生: 賴奕名
Lai, Yi-Ming
論文名稱: 以氧化鋅堆疊結構作為薄膜電晶體主動層之研究
Study of Stacking ZnO Active Layer of Thin Film Transistor
指導教授: 林樹均
Lin, Su-Jien
吳泰伯
Wu, Tai-Bor
口試委員: 岑尚仁
陳建亨
學位類別: 碩士
Master
系所名稱: 工學院 - 材料科學工程學系
Materials Science and Engineering
論文出版年: 2011
畢業學年度: 99
語文別: 中文
論文頁數: 84
中文關鍵詞: 氧化鋅薄膜電晶體堆疊結構
相關次數: 點閱:1下載:0
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  • 本論文以氧化鋅薄膜當作薄膜電晶體元件的主動層,結構是由原子層化學氣相沉積(ALD)所沉積之氧化鋅和射頻濺鍍氧化鋅堆疊所組成。結合ALD氧化鋅具有較均勻成膜及低電阻、高載子遷移率的特性,和射頻濺鍍氧化鋅具備低漏電流及高開關比之優點,期望在不影響關電流之條件下,藉由ALD薄膜來改善主動層和閘極氧化層間界面的性質,取得最佳電性。
    由實驗結果得知,在閘極氧化層上先沉積一層極薄的ALD氧化鋅在鍍製上射頻濺鍍氧化鋅之堆疊結構,可有效改善元件電性,其開關電流比由純射頻濺鍍氧化鋅的1.78×10^7增加到4.5×10^7,臨界電壓由19 V降至13 V,且次臨界擺幅及場效載子遷移率也有改善現象,此證明了界面間得到了有效修補。而在鍍製好射頻濺鍍氧化鋅後所作的退火處理,能在更進一步降低其臨界電壓至7.5 V,其它元件量測之電性參數也得到些許提昇。


    致謝 摘要 Abstract 目錄 表目錄 第一章 序論 1-1薄膜電晶體之發展及近況 1-2透明薄膜電晶體 1-3 研究動機 第二章 原理與文獻回顧 2-1 氧化鋅薄膜 2-1-1 氧化鋅基本性質 2-1-2 氧化鋅薄膜之運用 2-2 氧化鋅薄膜製備方法 2-2-1 物理氣相沉積法 2-2-2 化學氣相沉積法 2-2-3 化學液相沉積法 2-3 原子層化學氣相沉積法(ALCVD) 2-4 ALCVD技術優缺點 2-5 薄膜電晶體結構 2-6 n型薄膜電晶體操作原理 第三章 實驗儀器架構與流程 3-1 薄膜分析 3-1-1 X-ray繞射儀原理(X-ray diffraction, XRD) 3-1-2 X-ray反射率原理(X-ray Reflectometry, XRR) 3-1-3 In-plane X-ray Diffraction(IPXRD) 3-1-4 原子力顯微鏡(Atomic force microscopy, AFM) 3-1-5 掃描式電子顯微鏡(SEM) 3-2 電性分析 3-2-1 四點探針原理(Four-point probe) 3-2-2 霍爾效應量測原理(Hall measurement) 3-3 電晶體元件參數 3-3-1 開關電流比定義 3-3-2 臨界電壓定義(Vth) 3-3-3 場效載子遷移率定義(μFE) 3-3-4 次臨界擺幅定義(Subthreshold Swing, S. S.) 3-4 試片製作 3-4-1 基板結構 3-4-2 元件製作流程 3-5 量測流程 第四章 實驗結果與討論 4-1 氧化鋅薄膜表面形貌分析 4-1-1 SEM分析 4-1-2 AFM分析 4-2 氧化鋅結晶結構分析 4-2-1 XRR分析 4-2-2 XRD & In-plane XRD分析 4-3 氧化鋅薄膜電性量測 4-4 堆疊結構對主動層之影響 4-4-1 純射頻濺鍍氧化鋅之電性分析 4-4-2不同沉積厚度之ALD氧化鋅電性分析 4-4-3 電晶體參數分析 4-5 退火處理對元件特性之影響 4-5-1 輸出特性曲線圖分析 4-5-2 轉換特性曲線圖(IDS-VGS)分析 4-5-3 電晶體參數分析 4-6 與現行氧化鋅堆疊結構之比較 第五章 結論 參考文獻

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