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研究生: 蔡英傑
Tsai, Ying-Chieh
論文名稱: 半導體晶圓測試探針卡取得決策之研究-以某公司驅動IC產品實證為例
Semiconductor Wafer Testing Probe Card Acquirement Decision Strategy in LCD IC Product
指導教授: 簡禎富
Chien, Chen-Fu
口試委員: 朱珮君
Chu, Pei-Chun
林國義
Lin, Kuo-Yi
學位類別: 碩士
Master
系所名稱: 工學院 - 工業工程與工程管理學系碩士在職專班
Industrial Engineering and Engineering Management
論文出版年: 2017
畢業學年度: 105
語文別: 中文
論文頁數: 48
中文關鍵詞: 紫式決策分析決策樹探針卡取得決策多屬性決策分析晶圓測試風險輪廓圖
外文關鍵詞: UNISON decision analysis, Decision tree, Probe card, Acquirement Decision Strategy, Multiple attribute decision analysis, Wafer test, Risk profile
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  • 摘要
    科技發展來自於生活的需求,在大眾生活中各類電子商品,如手機、電視、平板電腦,已經不可獲缺。作為各類電子產品的重要組成,如顯示器朝向多色階、高速、快速反應與低耗能發展,產品生命週期越來越短、價格也越來越低。面對後端IC測試代工費用也逐年調降的趨勢,測試代工廠如何提昇效能與掌控毛利率以應對產業發展趨勢成為一個新興重要的議題。
    本研究針對晶圓測試之探針卡主要耗材取得問題,基於紫式決策分析架構,採用影響圖與決策樹方法,建構探針卡取得之分析架構,並繪製風險輪擴圖與敏感度分析圖,從而能夠有效提供探針卡耗材取得模式選擇方案,以供決策者實務中進行決策。
    為實際檢驗研究架構之效度,本研究以台灣某半導體晶圓測試廠為案例。藉由取得來源與特定客戶型號的所有報廢探針卡,依據決策層級架構分析方法,建立模型進行架構分析,作為決策者參考依據。同時依據敏感度分析圖之成功率,決策者可取得未來同型號探針卡生產平均效率之決策預估值。實證結果顯示,本研究具備效度與可行性。其分析手法與方式,亦將可提供其他探討有關物料取得之決策問題,作為參考流程與架構的依據。


    Abstract
    Technology developments come from the real life requirements. Various types of electronic goods, such as mobile phones, televisions, tablet PCs, are indispensable in the public life recently. As an important part of electronic products, the display develops toward multi-color, high-speed, rapid response and low energy consumption trend. Product life cycle in display industry becomes shorter and shorter while sales price getting lower and lower. Facing costs decreasing year by year in trendency, how to improve the efficiency of the foundry and control gross margin to cope with industrial development trends has been a new critical issue for back-end IC test foundries.
    In this paper, to solve the main consumables acqusition problem of the probe card for wafer testing, a probe card acqusition decision-making framework is constructed based on the UNISON decision-making framework by using the influence graph and the decision tree method. Besides, risk profile and sensitivity analysis are used to obtain the mode of choice for probe card supplies to make decision in practical problem.
    To test the validity of the research structure, this study takes a Taiwan semiconductor wafer test company as a case. All the discarded probe cards are obtained from the foundry source and the specific customer model. Based on the decision hierarchy analysis method, the proposed model is established to analyze probe card acquisition decision problem and serves as a reference for decision makers. Meanwhile, refer to success rate of the sensitivity of graph analysis, decision maker can aquire the implementation of future decision with average efficiency of the probe card production decision-making estimates. The empirical results show that this study is effective and feasible. Its analytical practices and methods can also be a basis of reference flow and architecture.provide for other decision-making issues related to material acquisition.

    目錄 目錄 i 圖目錄 v 表目錄 vi 第一章 緒論 1 1.1 研究背景與動機 1 1.2 研究目的 3 1.3 論文架構 3 第二章 文獻回顧 5 2.1 紫式決策分析架構 5 2.1.1 瞭解問題 6 2.1.2 界定利基 7 2.1.2.1 決策目標 7 2.1.2.2 不確定因子 7 2.1.2.3 方案策略 8 2.1.3 架構因子的影響關係 8 2.1.4 客觀敘述感受 8 2.1.4.1 決策屬性 8 2.1.4.2 可能的狀況 9 2.1.4.3 方案之預期成果 9 2.1.5 綜合判斷與主觀衡量 9 2.1.5.1 屬性與相對權重 9 2.1.5.2 可能狀態發生的機率 10 2.1.5.3 決策者主觀價值與效用 10 2.1.6 完全不確定下決策 10 2.1.6.1 小中取大準則(Maxmin return) 10 2.1.6.2 大中取大準則(Maxmax return) 10 2.1.6.3 賀威志決策準則(Hurvicz optimism-pessimism index) 10 2.1.6.4 薩維基最小悔惜準則(Savage`s minimax regret) 11 2.1.7 權衡與決策 11 2.1.8 執行與回饋 11 2.1.9 影響圖和決策樹 11 2.1.9.1 影響圖 12 2.1.9.1.1 決策樹 12 2.1.9.1.2 風險輪廓圖 13 2.1.9.1.3 敏感度分析 13 2.2 執行與回饋 15 2.3 半導體晶圓測試 15 第三章 探針卡取得決策架構 17 3.1 研究架構 17 3.2 晶圓測試廠營運管理 18 3.3 瞭解問題 18 3.4 定界利基 19 3.4.1 決策目標 20 3.4.2 不確定因子 20 3.4.3 方案策略 20 3.5 架構因子的影響關係 21 3.5.1 影響圖 21 3.6 探針卡成本客觀敘述感受 22 3.6.1 壽命 23 3.6.2 重工率 23 3.6.3 方案預期與資料彙整 23 3.7 探針卡取得決策方法 23 3.7.1 探針卡取得決策樹 23 3.7.2 探針卡取得風險輪廓圖 24 3.7.3 探針卡取得敏感度分析 24 3.8 綜合判斷與主觀衡量 24 3.8.1 屬性與相對權重 24 3.8.2 可能狀態發生的機率 25 3.8.3 決策者主觀價值與效用 25 3.8.4 小中取大準則 25 3.9 權衡與決策 25 第四章 實證研究 26 4.1 實證研究問題之背景與情境說明 26 4.2 案例說明 26 4.3 界定與利基 27 4.4 架構因子的影響關係 27 4.4.1 影響圖 27 4.5 探針卡成本客觀敘述感受 28 4.5.1 決策方法 29 4.5.2 建構決策樹 30 4.5.3 建構風險輪廓圖 30 4.5.4 決策方案間累積風險比較 32 4.5.5 決策樹期望值 33 4.5.6 增加綜合方案 34 4.5.7 敏感度分析 38 4.5.7.1 重工機率 38 4.5.7.2 臨界機率 40 4.6 綜合判斷與主觀衡量 41 4.6.1 公司政策與長遠發展的趨向 41 4.6.2 風險變異與損失 42 4.7 權衡與決策 42 第五章 結論 43 5.1 結論 43 5.2 未來研究方向 43 參考文獻 44

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