研究生: |
邱啟倫 Chiu, Chi-Lun |
---|---|
論文名稱: |
薄L型均溫板性能研究 Tests on a Thin L-Type Vapor Chamber |
指導教授: |
王訓忠
Wong, Shwin-Chung |
口試委員: |
許文震
簡國祥 |
學位類別: |
碩士 Master |
系所名稱: |
工學院 - 動力機械工程學系 Department of Power Mechanical Engineering |
論文出版年: | 2012 |
畢業學年度: | 100 |
語文別: | 中文 |
論文頁數: | 82 |
中文關鍵詞: | 薄型均溫板 、均溫板 、L型 |
相關次數: | 點閱:1 下載:0 |
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本研究針對一L型均溫板(vapor chamber)進行不同設計參數之性能測試,此L型均溫板利用平行溝槽取代上板毛細結構,可降低蒸氣腔厚度,同時也具有支撐的功能。本研究分成兩部分,第一部分為組裝式均溫板,以可重複使用的O環來進行組裝,目的在於找出適當的溝槽尺寸以及毛細結構的組成及厚度,做為第二部分針對採擴散接合密封的薄型均溫板的實驗依據;第一部分結果顯示水冷溫度為40℃時,可達較佳性能,熱傳極限約50W,均溫板熱阻值約0.08K/W,但冷凝區後端呈現積水現象。第二部分為永久性擴散接合密封的薄型均溫板,結果顯示冷凝區因蒸汽通道甚薄而嚴重積水,使本薄型均溫板在單熱源及雙熱源加熱下的均溫性及熱傳極限均不佳。
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