電容式近接與觸覺力感測晶片之設計與實現｜國立清華大學博碩士論文庫

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研究生：	陳延淋 Chen,Yen-Lin
論文名稱：	電容式近接與觸覺力感測晶片之設計與實現 Design and Implementation of Capacitive Proximity and Tactile Force Sensor
指導教授：	方維倫 Fang, Wei-Leun
口試委員:	羅丞曜 Lo, Cheng-Yao 葉勝凱 Yeh, Sheng-Kai
學位類別：	碩士 Master
系所名稱：	工學院 - 動力機械工程學系 Department of Power Mechanical Engineering
論文出版年：	2021
畢業學年度：	109
語文別：	中文
論文頁數：	128
中文關鍵詞：	CMOS-MEMS 、電容式、陣列、近接感測器、觸覺力感測器、三軸
外文關鍵詞：	tri-axial force sensor
相關次數：	點閱：3 下載：0
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機器人產業的蓬勃發展，應用場域也變得十分廣泛。為了使得機器人在行動時能夠對於外界環境能保有著良好的感知能力，觸覺感測器的應用將扮演著一個重要的角色，因此若觸覺感測器能擁有多種感知能力將能夠提供更多樣化的資訊以提高機器人對於外在環境的掌握。本研究提出於台積電 0.18μm 1P6M標準商用CMOS製程平台上，設計、製造以及實現了近接感測器與三軸觸覺力感測器功能的整合。其中近接感測器將能夠扮演著雷達的角色增加物體定位的精度以避免機器人與物體間的碰撞；而三軸力感測器所提供之回饋訊號則扮演著控制施力大小的角色，避免不當的施力而造成毀損。另外本研究選擇之電容式近接感測機制擁有不論導體即非導體皆能夠感測的能力，並透過PCB上接地電極的輔助，提升了近接感測器感測範圍；其中陣列式的電極結構有著能夠同時實現電容式三軸力感測器的優勢，透過整合高分子材料作為力傳介面，並進一步的在高分子材料中埋入玻璃凸塊透過剛性的調變來提升整體元件的力傳及性能表現。

With recently swift development of robotic industry, application fields of robots go more and more various. To make sure robots acquire sufficient data to properly operate, tactile sensors serve to translate diverse environmental information like external force into electrical signals.
This study proposes to design, fabricate and implement a tactile sensor equipped with proximity and tri-axial force sensing ability on standard TSMC 0.18μm 1P6M CMOS platform. Capacitive type proximity sensing mechanism is chosen for its diverse objects sensing ability, and PCB shielding metal is utilized for sensing range enhancement. Meanwhile, electrodes array is suitable for implementation of capacitive tri-axial force sensor, and polymer is heterogeneously integrated as the force transmission and protection layer. Furthermore, glass bump is embedded in the polymer for stiffness adjustment to improve the force transmission efficiency and moreover the force sensitivity.

摘要    I
Abstract    II
誌謝    III
目錄    V
圖目錄    IX
表目錄    XV
第一章 緒論    1
1-1 前言    1
1-2 文獻回顧    3
1-2-1 觸覺力感測器    4
1-2-2 近接感測器    8
1-2-3 CMOS-MEMS    11
1-2-4 高分子材料    12
1-3 研究動機與目標    14
1-4 全文架構    16
第二章 感測原理與設計規劃    31
2-1 TSMC 0.18μm 1P6M CMOS製程平台    31
2-2 高分子材料    32
2-3 感測機制    35
2-3-1 電容式近接感測原理    35
2-3-2 電容式觸覺力感測原理    37
2-4 元件設計概念    40
2-4-1 近接感測設計概念    41
2-4-2 三軸觸覺力感測設計概念    42
2-5 模擬分析    45
2-5-1 近接感測模型建立    45
2-5-2 三軸觸覺力感測模型建立    47
第三章 製程流程    63
3-1 製程流程    63
3-2 製程步驟探討    64
3-2-1 金屬濕式蝕刻    64
3-2-2 雷射及打線    66
3-2-3 高分子模造    67
3-3 製程結果與討論    68
第四章 量測結果    80
4-1 近接感測單元量測    80
4-1-1 物體材料    81
4-1-2 方向性    82
4-2 觸覺力感測單元量測    83
4-2-1 正向力感測    84
4-2-2 平面剪力感測    86
4-3 近接與觸覺力雙模式量測    88
4-4 三軸力解析    89
第五章 結論與未來工作    99
5-1 結論    99
5-2 未來工作    100
參考文獻    106
附錄A 結合電容與壓阻式之三軸力感測器    114
A-1 感測器設計    114
A-1-1壓阻式感測機制    114
A-1-2 元件設計概念    117
A-2 製程流程與結果    119
A-3 量測結果與討論    120

                                

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