在競爭激烈的觸控面板(Touch Panel)產業中，各面板廠紛紛投入更高世代技術生產，以符合市場需求及降低生產成本。由於生產設備投入的資金非常龐大，必須有效的控制生產成本、增加生產效率、提高生產品質，才能在競爭激烈的環境中生存下來。雷射切割技術為觸控面板製程中一項關鍵製程，若是因為切割製程的品質不良而造成產品報廢，前段製程耗時又高成本的生產投入將會付諸流水。為了獲得高良率和維持應有的生產效益，雷射切割製程的控制能力實為各家廠商極欲提昇的生產技術之一。
　　在極具複雜的雷射切割製程中，影響其產出的製程參數眾多，如果僅依據工程師經驗來判斷其設定值，可能導致製程不穩定而造成不良率提高。本研究針對雷射切割製程參數最佳化提出一系統性的求解程序，首先以迴歸分析與工程知識判斷重要因子，再以反應曲面法(Response Surface Method，RSM)進行實驗設計，最後結合倒傳遞類神經網路(Backpropagation Neural Network，BPN)和基因演算法(Genetic Algorithms，GAs)找尋出雷射切割製程最佳參數組合。透過實際個案研究發現本研究提出之方法可大幅降低雷射切割製程的不良率，由原始的33 % 降至0.3 %。此外，相較於其他參數最佳化之方法，本研究提出之方法有較佳的改善效果。

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