Crimson直接電鍍製程是由Shipley公司於1990年所提出之印刷電路板表面金屬化流程，用以取代無電鍍銅法。一般人常認為此一直接電鍍程序如同其它直接電鍍法，乃因 “促進化” 後使非導體上形成一硫/鈀導電膜，而此導電膜造成基材得以進行電鍍。本論文以實驗證明：Crimson直接電鍍法並非以導電度促使其得以進行。
另一方面，以循環伏特法驗證硫-鈀直接電鍍系統乃經由硫離子架橋作用使得其銅還原反應發生於較Shadow直接電鍍系統還要正的電位。

前人的研究認為：PdS是硫化後基板在浸入鍍液後，由其中的硫酸根促使形成的。但吾人發現不含硫酸根的焦磷酸銅鍍液，仍可進行直接電鍍速率，只是速率較慢；若是將硫化後的基板浸入含硫酸根之溶液後，再於焦磷酸銅鍍液中進行電鍍，則可加快電鍍速率。因此推斷硫化後的基板浸入含硫酸根溶液後，可能使膠體內硫-鈀的鍵結形態發生變化。

由IR分析中發現：硫化後再浸入硫酸銅鍍液有兩種可能現象：(a) 硫-鈀鍵結形態改變。硫化後的硫-鈀的吸附態轉變為鍵結形態，此形態可能是Pd4S，但仍須更有力之證據；(b) 具直接電鍍能力的硫-鈀層對於硫酸根具吸附能力。

將Shipley加成法專利製程中，於硫化後多加入一硫酸槽，依照本實驗的說法，Pd-S之鍵結態可在上光阻之步驟前形成，並發現此舉可加速直接電鍍速率，且對於在曝光、顯影的過程具穩定硫-鈀層作用，但仍須先克服其再現性的問題才能得到肯定的解釋。

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