研究生: |
林瑋翔 Lin, Woei-Shyang |
---|---|
論文名稱: |
耐磨耗新型銅合金之開發 Development of Innovative Copper Alloys with Superior Wear Resistance |
指導教授: |
蔡哲瑋
Tsai, Che-Wei |
口試委員: |
葉均蔚
Yeh, Jien-Wei 陳育良 Chen, Yu-Liang |
學位類別: |
碩士 Master |
系所名稱: |
工學院 - 材料科學工程學系 Materials Science and Engineering |
論文出版年: | 2019 |
畢業學年度: | 107 |
語文別: | 中文 |
論文頁數: | 101 |
中文關鍵詞: | 析出強化型銅合金 、磨耗阻抗 、導電度 、硬度 、時效硬化 |
外文關鍵詞: | precipitation hardened copper alloy, wear resistance, electrical conductivity, hardness, age hardening |
相關次數: | 點閱:3 下載:0 |
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本研究是以固溶多元素銅合金為基礎,經熱處理後析出硬化,開發數款兼具硬度與導電性之銅合金,旨在取代昂貴且製程中具有毒性的銅鈹合金。於研究中觀察合金微結構、硬度與導電度之時效曲線,並探討其於室溫下、高溫與潤滑油環境下之耐磨耗性質。量測本研究尖峰時效態合金之導電度,並與 C17200 銅鈹合金進行比較,探討新合金的實際應用性質。
在此合金系列中,鎳矽化合物為主要析出相,可在合金時效處理後,提升其硬度與導電度;鋁、鉻、鐵、錫元素則提供固溶強化、晶粒細化之性質。故本實驗將針對鎳、矽、鋁含量的變化,對合金微結構、硬度與導電度表現進行研究。
應用性質方面,本研究開發之新型合金綜合性能表現優異,其滾軋退火態在具有 290.4 Hv 硬度與 23.7 % IACS 導電度的同時,也保有 2199.25 m/(MPa∙mm^3) 的室溫磨耗阻抗,其摩擦係數為 0.73。有 6840.00 m/(MPa∙mm^3) 的油溫磨耗阻抗。對比銅鈹合金,本研究合金之硬度為C17200其 72 %、導電度為其99 %,更具有 208 % 之室溫磨耗阻抗與 205 % 之油溫磨耗阻抗之提升。
On the basis of multi-component alloy with precipitation hardening, a series of innovative copper alloys with superior hardness and conductivity are developed to replace beryllium copper for high cost and toxicity. For further commercial application, microstructures, age hardening, dry and wet sliding wear resistances of the present alloys are analyzed and compared with C17200 beryllium copper.
In this study, Ni-Si compounds act as precipitates, giving rise to the increases on hardness and conductivity. Additionally, aluminum, chromium, iron, and tin elements provide properties such as solid solution strengthening and grain refining. Therefore, the effects of nickel, silicon, and aluminum on microstructure, hardness, and conductivity are studied.
In the aspect of commercial application, the innovative copper alloy in this study demonstrates excellent performance with 290.4 Hv in hardness and 23.7 % IACS in conductivity, which are 72 % and 99 % of those of C17200 alloy. Besides, the dry and wet sliding wear resistances of the innovative copper alloy are 2199.25 m/(MPa∙mm^3) at ambient temperature and 6840.00 m/(MPa∙mm^3) at elevated temperature, respectively, which makes an improvement of 208 % and 205 % compared with those of C17200 alloy.
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