研究生: |
劉旻鑫 Liu, Min-Hsin |
---|---|
論文名稱: |
氮化鎵半導體結合廣義回退Doherty功率放大器使用不相等汲極偏壓技巧之研製 Design of GaN MMIC Generalized Back-off Doherty Power Amplifier Using Uneven Drain Bias Technique |
指導教授: |
徐碩鴻
Hsu, Shuo-Hung |
口試委員: |
劉怡君
Liu, Yi-Chun 連羿韋 Lian, Yi-Wei |
學位類別: |
碩士 Master |
系所名稱: |
電機資訊學院 - 電子工程研究所 Institute of Electronics Engineering |
論文出版年: | 2021 |
畢業學年度: | 109 |
語文別: | 英文 |
論文頁數: | 60 |
中文關鍵詞: | 氮化鎵 、廣義回退 、功率放大器 |
外文關鍵詞: | GaN, Doherty, Generalized |
相關次數: | 點閱:4 下載:0 |
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氮化鎵材料在功率元件的應用上相較於矽材料有相當大的優勢,因為有寬能隙、高臨界電場以及高熱導係數,使其能承受高電壓,此外,因氮化鎵屬於HEMT,故有高電子飽和速度的特性,使其在高頻領域有良好表現。半導體第一代材料是矽(Si),帶隙寬約為1.17eV;第二代材料是砷化鎵(GaAs),帶隙寬約為1.42eV,是現今絕大部分通信設備的材料;第三代材料是指帶隙寬在2.3eV及以上的半導體材料,氮化鎵的帶隙寬約為3.5eV,因此成為功率或射頻元件的新材料。近幾年來,由於通訊頻段上升到毫米波,如何製作高頻功率放大器被廣泛的研究,其中氮化鎵被認為是最有潛力的選項,因為第三代半導體主要應用於5G、電動車、雷達及高功率應用(如快速充電),功率放大器必須提供更高的輸出功率,同時必須盡可能的提高效率,避免廢熱造成能源的浪費和影響電路與系統之運轉。本論文將探討使用氮化鎵製程之Doherty、Class-F^(-1)以及Class-F射頻功率放大器。首先,在第一章介紹論文之研究動機、氮化鎵元件之特性及論文架構;第二章節,討論功率放大器之基本概念以及重要設計考量;第三章至第五章分別討論三個功率放大器電路之設計流程以及細節,包含整體電路架構、電晶體大小、被動元件的設計以及模擬和量測結果。第一個電路為9-dB回退之Doherty 10 GHz功率放大器,採用不相等汲級偏壓方法,此方法經過數學推導及Matlab驗證,推廣傳統6-dB回退之Doherty功率放大器之模型,此設計經修正後,功率附加效率可在9-dB回退區間內超過40%;第二個電路為5.8 GHz之Class-F^(-1)功率放大器;第三個電路為6 GHz Class-F功率放大器,後兩者功率附加效率皆高於45%。
Gallium Nitride HEMT is exceptional in high-frequency and high-power applications compared with silicon due to wide bandgap, high critical electric field, high electron mobility, and high thermal conductivity. The first-generation semiconductor material is Si (1.17eV bandgap), and the second-generation material is GaAs (1.42eV bandgap), applied in most modern communication equipment. The third-generation material includes GaN (3.5eV bandgap) and those with a higher than 2.3eV bandgap. Recently, millimeter wave is considered as a new domain in the next generation of wireless mobile communication, and GaN is the most promising candidate since the main applications in third-generation semiconductor include 5G communications, electric vehicle, radar, and high power oriented such as fast charging. To be noticed, good power amplifiers must not only deliver high output power, but also have high efficiency to avoid seriously heating issue in circuits and systems. This thesis presents the research on RF power amplifiers based on the topologies of Doherty, Class-F^(-1), and Class-F using 0.25-μm GaN on SiC technology from WIN Semiconductors. The first chapter includes motivation, characteristic of GaN materials, and thesis organization. Chapter II presents basic design concepts of power amplifiers. From chapter III to chapter V, three PAs are presented in details, including topology, transistor size, passive components, and simulation and measurement results. The first circuit is a 9-dB back-off 10 GHz Doherty PA, which employs novel uneven drain bias technique that generalizes traditionally 6-dB back-off Doherty PA design, and is verified by analytical derivation and Matlab. The revised design achieved PAE above 40% within 9-dB back-off region. The subsequent designs are 5.8 GHz Class-F^(-1) PA and 6 GHz Class-F PA both with PAE over 45%.
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