彎曲及熱負載下之超薄型晶片軟膜異方性導電膠接點可靠度及可撓曲性研究

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研究生：	陸蘇財 Lu, Su-Tsai
論文名稱：	彎曲及熱負載下之超薄型晶片軟膜異方性導電膠接點可靠度及可撓曲性研究 Reliability and Flexibility Investigation of Ultra-Thin Chip-on-Flex (UTCOF) with Anisotropic Conductive Adhesive (ACA) Joints under Bending and Thermal Loading
指導教授：	陳文華 Chen, Wen-Hwa
口試委員:
學位類別：	博士 Doctor
系所名稱：	工學院 - 動力機械工程學系 Department of Power Mechanical Engineering
論文出版年：	2011
畢業學年度：	99
語文別：	英文
論文頁數：	146
中文關鍵詞：	超薄型晶片軟膜、異方性導電膠、可靠度、可撓曲性、有限單元數值分析、軟性電子構裝
外文關鍵詞：	Ultra-thin chip-on-flex (UTCOF), anisotropic conductive adhesive (ACA), reliability, flexibility, finite element analysis (FEA), flexible interconnects
相關次數：	點閱：3 下載：0
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中文摘要
展望未來消費性先進電子產品的應用，高密度和可撓曲接點的需求快速增加。本論文旨在探討超薄型晶片軟膜(ultra-thin chip-on-flex, UTCOF)異方性導電膠(anisotropic conductive adhesive, ACA)接點在承受彎曲及熱負載下的可靠度及其可撓曲性，除應用ANSYS有限單元套裝軟體發展一準確的三維數值分析模型外，並經由實驗驗証及參數化分析，期建立UTCOF接合構裝技術之設計準則。
由於ACA膠材的收縮特性和其導電顆粒之彈塑性質將影響ACA接點之電阻值，本論文乃利用三維有限單元模型，配合接觸力學分析，對熱壓合製程後之ACA接點電阻值導電機制進行分析，並與ACA接點電阻值驗証結果相互驗証，此研究結果將可供準確預估ACA接點的可靠性。
在高密度COF的研究中，本論文提出一新型的複合凸塊(compliant bump)接合結構，搭配雙層式ACA膠材，並完成20 □m間距接合架構的可行性驗証，1,000小時高溫高濕(85°C/85%RH)溫濕儲存 (temperature-humidity storage test, THST)和1,000次之溫度循環(temperature cycling test, TCT)測試。
在UTCOF的接合實驗相關參數研究，本論文完成了晶圓薄化及晶圓切割，除探討不同晶片厚度(25 □m, 35 □m, 50 □m)對超薄型晶片撓曲能力之影響，並對製程溫度對兩種不同ACA膠材(ACA-P, ACA-F)之固化特性，探討膠材在不同固化程度下之界面接合力及接點電阻值。此外，不同接合壓力下金凸塊(Gold bump)和複合凸塊的接點電阻值和導電顆粒變形亦予分析。ACA接點在熱負載下之可靠度，係利用7,000小時長時間85°C/85% RH THST來分析，並藉由不同測試環境下之靜態彎曲和四點彎曲負載來試驗其可撓曲性，不同測試環境下的失效樣品，亦將藉由掃描式電子顯微鏡(scanning electron microscopy, SEM)橫截面觀察其失效機制。此外，兩種UTCOF接點在四點彎曲負載下之失效機制並以有限單元數值分析配合探討。
本論文所建立的可撓曲UTCOF和高密度COF接合技術成果，將可為軟性電子構裝技術發展及量產設計之參考。

Abstract
For future advanced applications in consumer electronic products, the need of high-density and flexible interconnects increases rapidly. In this study, the reliability and flexibility of ultra-thin chip-on-flex (UTCOF) interconnects using anisotropic conductive adhesive (ACA) were investigated. A rigorous three-dimensional (3-D) numerical analysis model was performed using the ANSYS program. Moreover, experimental and parametric analyses of UTCOF interconnects were evaluated to establish the design rule of ACA-bonded UTCOF interconnects.
Due to shrinkage of ACA resin and elastic-plastic characteristic of conductive particles, the effect of contact behavior in ACA joints on the contact resistance of the fabricated UTCOF interconnects after thermo-compression process was also estimated using a three-dimensional finite element model. The contact resistances obtained from the analysis results were in good agreement with experimental results, and can be used to predict the reliability performance in ACA joints.
A process for manufacturing 20 □m-pitch compliant-bumps was proposed for COF structure using 2-layer ACA material. The reliability of the fabricated COF interconnects was evaluated by performing an 85°C/85％ relative humidity temperature-humidity storage test (RH THST) for 1,000 hours and a -55°C~125°C thermal cycling test (TCT) for 1,000 cycles.
For UTCOF interconnects, the effect of chip thickness (25 □m, 35 □m, 50 □m) on the fracture strength of the ultra-thin silicon chip was estimated. Both the ACA-P and ACA-F materials were assembled at different bonding temperatures to study the temperature effects on the curing percentage and adhesion by differential scanning calorimeter (DSC) measurement and peeling test, respectively. Meanwhile, the relationship between curing conditions and electrical contact resistance was examined. Moreover, the bonding pressure effects on the electrical performance and deformation degree of conductive particles within the ACA resin were also explored. The contact resistance of daisy chain was measured to examine the bonding quality through the 80 □m pitch dummy test samples using micro Au (gold) bump (GB) and compliant bump (CB). The reliability of the fabricated UTCOF interconnects bonded with selected ACA joints was evaluated by long-term 85°C/85％ RH THST for 7,000 hours and their flexibility was performed by static bending under various testing environments and 4-point bending tests. The interfaces between ultra-thin silicon chip and substrate for failed samples from THST and 4-point bending tests were then inspected through the cross-section scanning electron microscopy (SEM) works. Finite element analysis (FEA) was also conducted to interpret the failure mechanism of the UTCOF interconnects under 4-point bending test.
Based on the results achieved, the UTCOF with ACA joints presented in this work would be reliable for serving as flexible interconnects for consumer electronic products. Also, the manufacturing technology for high-density and flexible UTCOF interconnects with ACA joints was thus established.

Table of Contents

摘要    Ⅰ
Abstract    ⅠⅤ
Abbreviations    ⅤⅠⅠ
List of Tables    ⅩⅠⅠ
List of Figures    ⅩⅠⅠⅠ

Chapter 1. Introduction    1
1.1 Background    1
1.2 Problem statement    3
1.3 Research objectives    6

Chapter 2. Experimental Design & Finite Element Modeling    8
2.1 Ultra-fine pitch chip-on-flex    8
2.1.1 Manufacturing of compliant bump    8
2.1.2 ACA/NCA materials    9
2.1.3 Fabrication process    10
2.1.4 Electrical performance and reliability tests    11

2.2 Ultra-thin chip-on-flex    12
2.2.1 Wafer thinning and post-treatment    13
2.2.2 ACA materials    14
2.2.3 Fabrication process    15
2.2.4 Thermal and warpage measurement    16
2.2.5 Reliability and flexibility tests    16

2.3 Three-dimensional finite element modeling    17
2.3.1 Contact mechanism model for ACA joints    18
2.3.2 Transient thermal model for UTCOF    19
2.3.3 Thermal-mechanical model for UTCOF    20
2.3.4 Four-point bending model for UTCOF    21

Chapter 3. Electrical Contact Mechanism for Anisotropic Conductive Adhesive Joints    23
3.1 Analytical models    23
3.2 Finite element analysis steps    28
3.3 Finite element analysis results and experimental verification    29

Chapter 4. Experimental Test Results    31
4.1 Ultra-fine pitch chip-on-flex    31
4.1.1 Bonding accuracy    31
4.1.2 Insulation resistance    32
4.1.3 Effects of bonding temperature    33
4.1.4 Reliability results and failure mechanism of ACA joints    34
4.1.4.1 85°C/85% RH temperature-humidity storage test (THST)    34
4.1.4.2 -55°C~125°C thermal cycling test (TCT)    35

4.2 Ultra-thin chip-on-flex    36
4.2.1 Fracture strenght of ultra-thin silicon chip    36
4.2.2 Thermally-induced warpage    37
4.2.2.1 Effect of ACA joint material properties    38
4.2.2.2 Effect of bonding temperture    38
4.2.2.3 Effect of chip thickness    39
4.2.3 Reliability results and failure mechanism of ACA joints    40
4.2.3.1 Effects of bonding temperature    40
4.2.3.2 Effects of bonding pressure    43
4.2.3.3 Effect of ACA material    43
4.2.3.4 Effect of bump material    45
4.2.3.5 Effect of chip thickness    46
4.2.4 Flexibility results and failure mechanism of ACA joints    46
4.2.4.1 Four-point bending test    46
4.2.4.2 Static bending with thermal/humid testing environments    48

Chapter 5. Numerical Analysis Results    50
5.1 Transient thermal analysis for UTCOF    50
5.2 Thermal-mechanical analysis for UTCOF    51
5.3 Four-point bending analysis for UTCOF    52

Chapter 6. Conclusions and Future Work    54
6.1 Summary of accomplishments and contributions    54
6.2 Recommendations for future work    61

References    64
List of Tables

Table 2.1 Material Properties of ACAs for ultra-fine pitch COF    76
Table 2.2 Specifications of chip and substrate for ultra-fine pitch COF    77
Table 2.3 Material properties of ACAs for UTCOF    78
Table 2.4 Specifications of chip and substrate for UTCOF    79
Table 2.5 Averaged contact resistance of ACA joints under different bonding pressures    80
Table 2.6 Material properties used for the contact mechanism analysis    81
Table 2.7 Material properties used for the transient-thermal and thermal-mechanical analysis    82
Table 2.8 Material properties used for the four-point bending analysis    83
Table 4.1 Comparison of peeling stresses of ACA-P- and ACA-F-bonded UTCOF interconnects    84
Table 5.1 Comparison of warpage of ACA-F- and ACA-P-bonded UTCOF interconnects    85


List of Figures

Figure 1.1 ACA-bonded UTCOF interconnects    86
Figure 1.2 The sequences of the manufacturing process for ACA-bonded UTCOF    87
Figure 1.3 Schematic of conductive particles bridging for COF interconnects    88
Figure 1.4 Bonding structure of molded-UTCOF interconnects    88
Figure 2.1 SEM image of sidewall-insulated Au-coated PI compliant-bumps    89
Figure 2.2 Method for manufacturing an sidewall-insulated Au-coated PI compliant-bump    90
Figure 2.3 COF interconnects bonded with double-layer ACA    91
Figure 2.4 SEM image of compliant-bump bonding structure    92
Figure 2.5 20 □m-pitch COF interconnets    92
Figure 2.6 Geometry of chip and substrate for UTCOF    93
Figure 2.7 SEM pictures of UTCOF assembly    94
Figure 2.8 Warpage measurement of UTCOF interconnects    95
Figure 2.9 90 degree peeling test    96
Figure 2.10 Bending tests    97
Figure 2.11 Equivalent local model of one ACA joint    98
Figure 2.12 Mesh design of finite element model for contact mechanism    99
Figure 2.13 Top views of the 3-D finite element models for multiple conductive particles    100
Figure 2.14 Schematics of UTCOF assembly and reference points    101
Figure 2.15 Three-dimensional UTCOF interconnects analysis    102
Figure 2.16 Finite element modeling of the UTCOF interconnects for four-point bending    103
Figure 3.1 Real contact area between the bump and the particle    104
Figure 3.2 Equivalent contact resistance model of a compliant bump    105
Figure 3.3 Calculated parameters of contact resistance for MCP    106
Figure 3.4 Contact resistance model for a single conductive particle    107
Figure 3.5 Contact resistance model for multiple conductive particles    108
Figure 3.6 Cross-sectional SEM images of ACA joints under different applied loadings    109
Figure 3.7 Comparison between experimental and analysis results with multiple conductive particles (N=3, 5, 9, 13)    110
Figure 3.8 Contact resistance of MCP joints versus number of conductive particles (L=60%)    111
Figure 4.1 Bonding accuracy inspection using X-rays    112
Figure 4.2 Misalignment values of COF interconnects at different bonding temperatures    112
Figure 4.3 Short-circuiting rate in ACA-bonded COF interconnects    113
Figure 4.4 SEM image of conductive particles bridging at joint space    114
Figure 4.5 SEM images of ADL ACA-bonded samples with compliant-bump    114
Figure 4.6 Curing percentage of bonding materials at different bonding temperatures    115
Figure 4.7 Contact resistance of ACA joints at different bonding temperatures    115
Figure 4.8 Peeling strength of ACAs materials at different bonding temperatures    116
Figure 4.9 Contact resistance variation and failure mode in the 85°C/85% RH THST    117
Figure 4.10 Contact resistance variation and failure mode in the 55°C~125°C TCT    118
Figure 4.11 Average fracture strength of different chip thickness in both FD and FU directions    119
Figure 4.12 SEM images for different chip surface (Unit: μm)    120
Figure 4.13 Effects of ACA and bump materials on the warpage of UTCOF interconnects    121
Figure 4.14 Effects of ACA materials and bonding temperature on the warpage of UTCOF interconnects    122
Figure 4.15 Effects of ACA materials and chip thickness on the warpage of UTCOF interconnects    122
Figure 4.16 Curing of ACAs at different bonding temperatures    123
Figure 4.17 DSC curing curves of ACAs at different bonding temperatures    124
Figure 4.18 Contact resistance of ACA joints at different bonding temperatures    125
Figure 4.19 Peeling strength of ACAs materials at different bonding temperatures    125
Figure 4.20 The cross-sections of the fabricated UTCOF bonded using different ACAs materials    126
Figure 4.21 Effect of bonding temperature on the variation in the contact resistance in the 85°C/85% RH THST    127
Figure 4.22 Failure of the ACA-F-bonded UTCOF interconnects at 150°C/150Mpa    128
Figure 4.23 Cross-sectional SEM images of ACA-F joints under different applied loadings    129
Figure 4.24 Effect of bonding pressure on the variation in the contact resistance in the 85°C/85% RH THST    130
Figure 4.25 Failure of the ACA-F-bonded UTCOF interconnects at 190°C/100Mpa    131
Figure 4.26 Pressure-induced ultra-thin chip cracking under the vacuum hole of the bonding tool at bonding pressure of 200 MPa    131
Figure 4.27 Contact resistance variation in the 85°C/85% RH THST    132
Figure 4.28 Failure of the ACA-P bonded UTCOF interconnects at 140°C after 85°C/85% RH THST    133
Figure 4.29 Effect of bump material on the variation in the contact resistance in the 85°C/85% RH THST    134
Figure 4.30 Effect of ultra-thin chip thickness on the variation in the contact resistance in the 85°C/85% RH THST    134
Figure 4.31 Failure of the ACA-F bonded UTCOF interconnects at 190°C/150Mpa (chip thickness is 25 □m)    135
Figure 4.32 Contact resistance variation in the static bending test    136
Figure 4.33 Averaged maximum allowable deflections in the four-point bending test    136
Figure 4.34 Load-deflection curves of the UTCOF interconnects under four-point bending    137
Figure 4.35 Failure of the UTCOF samples in the four-point bending test    138
Figure 4.36 Effect of temperature-humidity testing environments on the variation in the contact resistance under bending condition (R: 30 mm)    139
Figure 4.37 Failure of the ACA-bonded UTCOF interconnects under bending condition (R: 30 mm) after the 85°C /85% RH THST    140
Figure 4.38 Scanning acoustic image of the failure sample under bending condition (R: 30 mm) after 85°C /85% RH THST    141
Figure 4.39 Effect of testing time of the 85°C/85% RH THST on the peeling strength of UTCOF interconnects    141
Figure 5.1 Comparison of computed and experimental temperatures at reference points    142
Figure 5.2 Temperature distributions of UTCOF interconnects (t = 30 sec.)    143
Figure 5.3 Wapage behaviors of the ACA-F-bonded UTCOF interconnects    144
Figure 5.4 Stress distribution in the UTCOF interconnects under four-point bending    145
Figure 5.5 Distribution of averaged peeling stresses at ACA-chip interface from the corner to the center Au bumps    146

                                

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