研究生: |
張弘杰 Chang, Hung-Chieh |
---|---|
論文名稱: |
終極鑽石碟薄化矽晶圓之加工特性研究 A study on thinning silicon wafer with Ultimate Diamond Disk |
指導教授: |
左培倫
Tso, Pei-Lum |
口試委員: | |
學位類別: |
碩士 Master |
系所名稱: |
工學院 - 動力機械工程學系 Department of Power Mechanical Engineering |
論文出版年: | 2009 |
畢業學年度: | 97 |
語文別: | 中文 |
論文頁數: | 98 |
中文關鍵詞: | 晶圓薄化 、應力集中 、終極鑽石碟 、延性加工 、脆性破壞 |
相關次數: | 點閱:1 下載:0 |
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使用鑽石刀具薄化晶圓到一定程度會有表面應力集中及裂痕的出現,需要藉由不同的後續加工,例如:化學機械拋光(CMP)、蝕刻…等,增強晶圓強度及減少表面損傷,所以晶圓薄化將使加工成本增加,所以有效改善表面內應力的產生以及加工成本將是首要解決的問題。
過去用來薄化矽晶圓的鑽石刀具,因切刃高度不一致造成切削深度不同、工件受力分布不均,使得某些區域產生嚴重的破壞,終極鑽石碟(Ultimate Diamond Disk,UDD)是刀片式設計,刀片平均高度大約差數個微米(micrometer),刀刃高度一致,將使切削力分布均勻,工件表面減少刮痕和損傷層並延長UDD的使用壽命。
本研究將觀察UDD切削矽晶圓後,其表面形貌以及次表面裂痕,了解轉速與切深對矽晶圓表面裂痕生成之影響,藉由UDD切削生成之切屑以及量測切削力與比切削能得到其移除機制(延性加工或脆性破壞)與加工特性,並觀察UDD磨耗後之形貌及磨耗特性。
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