近年來光電顯示產業快速發展，相關光電產品大量使用透明材質的光學元件如薄膜電晶體基板、透明電極和導光板等。因此，透明材質光學元件的形貌量測技術，愈發重要。
在先前的研究中，已經驗證了相位移式差分干涉對比顯微術(Differential Interference Contrast Microscopy, 以下簡稱：PS-DIC)用於量測透明材質元件高度的可行性。然而，要將此技術應用在生產線上，必須要有較短的量測時間。
為了縮短PS-DIC三維形貌量測系統的量測時間，本研究提出應用於PS-DIC量測系統的二步相移演算法。首先，以電腦軟體模擬分析比較常用的四步、三步相移演算法與本研究所提出的二步相移演算法的相位計算結果、抵抗影像隨機雜訊的能力以及可能影響相位計算結果的參數。再以穿透式架構的PS-DIC量測系統量測透明材質的薄膜電晶體玻璃基板，驗證本研究所提出的二步相移演算法應用於實際量測的可行性及加速量測的成效。實驗結果顯示以二步相移演算法搭配PS-DIC量測系統可重建出薄膜電晶體玻璃基板的三維表面形貌且提升量測速度。

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