在各個領域常見的高分子聚合物，在工業上可取代部分金屬材料，於電子工業領域，可保護與定位脆弱的矽晶片。本文首先研究目前最常用在電子封裝之高分子材料，以環氧樹脂為基材，搭配補強材奈米二氧化矽，探討奈米二氧化矽/環氧樹脂複合材料於不同填充比重對複合材料機械性質之影響。接著考慮到電子封裝可能會有靜電上的問題，本文利用補強材奈米碳管作為降低表面阻抗的材料，與奈米二氧化矽搭配，製成奈米二氧化矽/奈米碳管/環氧樹脂複合材料。
實驗部分先確定奈米二氧化矽/環氧樹脂複合材料與奈米碳管/環氧樹脂複合材料之製程，並比較不同重量百分比在機械性質與表面阻抗的影響，再確定奈米二氧化矽/奈米碳管/環氧樹脂複合材料之製程，並比較與前者在機械性質與表面阻抗的變化。實驗結果顯示0.1 wt%奈米二氧化矽/環氧樹脂複合材料相對於純環氧樹脂更具延展性。添加奈米二氧化矽能增加抗壓縮的效果，以5 wt%奈米二氧化矽/環氧樹脂複合材料為例，在撓曲模數有9.83 %的提升。添加奈米碳管能提升拉伸性質，以0.5 wt%奈米碳管/環氧樹脂複合材料為例，在楊氏模數有18.37 %的提升。加入奈米碳管確實能降低奈米複合材料表面阻抗，其中0.1 wt%和2 wt%的奈米二氧化矽/奈米碳管/環氧樹脂複合材料皆達到靜電消散的功能。從FESEM圖中可發現奈米二氧化矽於5 wt%時分散性優於低重量百分比；奈米碳管在1 wt%奈米二氧化矽/奈米碳管/環氧樹脂複合材料時分散性較佳。

Polymers are commonly used in various fields of industry to partly replace metal materials. In the electronics industry, polymers can protect and keep fragile silicon wafers in position. In this study, epoxy is used as substrate materials as commonly used in electronic packaging, and nano-silica with different weight percentages are added as reinforcing material and the mechanical properties of nano-silica/epoxy composites are investigated first. After considering the additional electrostatic problem in packaging, carbon nanotubes are added to reduce the surface resistance of nano-silica/carbon nanotube/epoxy composites.
Nano-silica/epoxy composites, carbon nanotube/epoxy composites and nano-silica/carbon nanotube/epoxy composites were prepared and their mechanical properties and surface resistance with different weight percentages are studied. It is found that the composites with 0.1 wt% nano-silica are more ductile than pure epoxy. Nano-silica can increase the ability of composites against compression; the composites with 5.0 wt% nano-silica increase its flexural modulus 9.83%. Carbon nanotubes can improve the tensile properties of composites; the Young's modulus of the composites with 0.5 wt% carbon nanotubes increase 18.37%. Carbon nanotubes can reduce the surface resistance of nanocomposites. The results show that the composites with 0.1 wt% and 2.0 wt% of nano-silica and carbon nanotubes achieve the property of electrostatic dissipation. The FESEM shows that the dispersion of 5.0 wt% nano-silica in composites is better than those having lower weight percentage of nano-silica. The carbon nanotubes have better dispersion in 1.0 wt% nano-silica/carbon nanotube/epoxy composites.

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