在微機電系統中，量測殘餘應力是一個相當重要的課題，因為殘餘應力會影響到元件的性能。因此，一個好的感測器，必須監控並量測薄膜的殘餘應力。目前已經被研發出來的感測器有：後挫曲法、Guckle ring法以及微游標尺等方法。然而，這些量測方法在封裝後，會因為其微結構的變形不能再利用光學方法來量測。為了解決此一問題，本文提出了一個能即時讀取張應變與壓應變的感測器，而且輸出是以電壓的形式。模擬的結果顯示，此方法可以藉由設計微指針以及量測探針結構的尺寸來放大位移量，以提高解析度；也能夠利用兩結構間的距離來決定量測範圍。

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