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研究生: 葉子豪
Tzu-Hao Yeh
論文名稱: 結合雙穩態微撓性機構之扭轉鏡片之分析與設計
Analysis and Design of Torsion Mirror for Bistable Micro Compliant Mechanism
指導教授: 宋震國
Cheng-Kuo Sung
口試委員:
學位類別: 碩士
Master
系所名稱: 工學院 - 動力機械工程學系
Department of Power Mechanical Engineering
論文出版年: 2002
畢業學年度: 90
語文別: 中文
論文頁數: 84
中文關鍵詞: 扭轉鏡片雙穩態撓性
外文關鍵詞: torsion mirror, bistable, Compliant
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  • 本論文的研究重點在於分析與設計結合雙穩態撓性機構與SDA之扭轉鏡片。在理論分析方面,推導具雙穩態之扭轉鏡片本身之特性,接著介紹連接SDA之雙穩態撓性機構與SDA之致動原理,另外利用ANSYS模擬軟體對扭轉鏡片之模態與旋轉軸受力作模擬分析。在製程方面分為前段薄膜沉積與後段蝕刻釋放兩部份,前段製程係委託美國Cronos Integrated Microsystems公司的多人共用製程MUMPs (Multi-User MEMS Processes or MUMPsTM) ; 後段製程則是由作者自行製作,方法是使用強酸液體腐蝕氧化矽後以清洗溶液去除強酸,最後以蒸發方式去除清洗溶液。在整體元件的設計方面,同時考慮MUMPs共用製程的限制與扭轉鏡片的特性,使用自動組裝之設計使鏡片出平面。由於本研究在應用上之進階目標為光學讀寫頭之讀取精度提升,此部分使用ZEMAX模擬軟體作分析,以確認此一構想的可行性。


    This thesis presents the analysis and design of a type of torsion mirror that integrated with a bistable micro compliant mechanism. The mirror, which is about 300 mm on a side, is driven by a bistable compliant mechanism and has resonant frequencies in the kilohertz range. Having selected the topology of the device, the equations governing the motions and the forces of the torsion mirror and the actuator can be derived. The bistable micro-mechanism being driven by the SDA and the associated torsion mirror are fabricated by the three-layer polysilicon surface micromachining technology supported by MUMPs (Multi-User MEMS Processes Service) of Cronos Integrated Microsystems. The device consists of three major parts: the mirror, compliant mechanism and SDA. The mirror is fixed on the substrate by the hinges. Polysilicon structures with integrally fabricated hinges are rotated out of the plane of the wafer after fabrication, and interconnected with other structures to form complex three-dimensional designs with detailed features in all three dimensions. The preliminary simulations of the device include analyzing the nature frequencies and the stresses of the mirror and torsion beam. The stresses on the components were found to be acceptable for preliminary fabrication prototyping.

    摘要………………………………………………………………… I Abstract……………………………………………………………... II 誌謝………………………………………………………………… III 目錄………………………………………………………………… IV 圖目錄……………………………………………………………… VII 表目錄……………………………………………………………… X 第一章 緒論……………………………………………………….. 1 1.1 背景………………………………………………………... 1 1.2 文獻回顧…………………………………………………... 3 1.3 研究內容與範圍………………………………………….. 4 第二章 理論分析………………………………………………….. 10 2.1 具雙穩態之扭轉鏡片…………….……………………….. 10 2.1.1 扭轉軸邊界之受力……………………..…………… 10 2.1.2 扭轉軸之回復力矩……………………..…………… 13 2.1.3 扭轉鏡片之自然頻率…………………..…………… 14 2.2 雙穩態撓性機構.……………...…………………………... 15 2.3 抓爬式靜電致動器(SDA)的分析設計………………... 17 2.3.1 等效彈簧系統…………………………..…………… 17 2.3.2 電容板之靜電力分析…………………..…………… 20 2.3.3 SDA的形變………….…………………..…………… 21 2.4 整體元件之自然頻率……………………………………... 22 2.5 性能目標之探討…………………………………………... 24 2.5.1 扭轉角度…………………………………………..… 24 2.5.2 鏡片邊緣之位移量……………..…………………… 25 2.5.3 旋轉軸之相對位置……………..…………………… 25 2.5.4 鏡面尺寸………………………..…………………… 25 2.5.5 旋轉軸之形狀…………………..…………………… 25 2.5.6 驅動電壓………………………..…………………… 26 2.5.7 共振頻率………………………..…………………… 26 2.6 自動組裝(Self-assembly)之設計…………………………. 26 第三章 扭轉鏡片之模擬分析………..…………………………… 28 3.1 致動器之輸出力…………………..………………………. 28 3.1.1 雙穩態撓性機構之輸出力……..…………………… 28 3.1.2 SDA之輸出力……………….……..………………… 30 3.1.3 彈簧力…………………………..…………………… 32 3.2 有限單元系統..……………………………………………. 33 3.2.1 有限單元模型之建立…………..…………………… 34 3.2.2 邊界條件………………………..…………………… 36 3.2.3 模態分析………………………..…………………… 36 3.2.4 應力分析………………………..…………………… 38 第四章 MUMPs共用製程…………..…………………………….. 41 4.1 MUMPs 薄膜沉積…………….…………………………... 41 4.1.1 矽基材、氮化矽與第零層多晶矽..………………… 42 4.1.2 第一層氧化矽、第一層多晶矽與第二層氧化矽…………… 43 4.1.3 第二層多晶矽與金屬層………………………..…… 44 4.2 元件蝕刻釋放……………………………………………... 45 4.2.1 蝕刻釋放………………………………………..…… 45 4.2.2 蝕刻孔之設計…………………………………..…… 46 4.3 MUMPs製程設計規範(Design rules)…………………... 47 4.4 扭轉鏡片之設計…………………………………………... 48 4.4.1 微樞紐之設計…………………………………..…… 48 4.4.2 SDA之設計………………………….…………..…… 50 4.4.3 防止結構層黏底之設計………….…...………..…… 51 4.4.4 靜電屏蔽層(Shield)之設計….…...………....…… 52 第五章 量測原理與實驗設備…………………………………….. 54 5.1 量測原理…………………………………………………... 54 5.2 實驗設備…………………………………………………... 56 第六章 光學理論分析與模擬…………………………………….. 60 6.1 光碟機系統簡介…………..………………………………. 60 6.2 光學路徑分析……………..………………………………. 61 6.3 光點品質之評價方法……..………………………………. 66 6.4 模擬與分析………………..………………………………. 68 6.4.1 NA=0.45,CD光學讀寫頭使用之透鏡組…..……… 68 6.4.2 外加扭轉鏡片後之光路模擬…………..…………… 72 6.5 增加循軌精度之鏡片分析………..………………………. 76 第七章 結論……………………………………………………….. 78 參考文獻…..……………………………………………………….. 81

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