CMOS製程是半導體產業中的一套標準化製程平台，透過此標準製程，可以提高元件的產量及降低生產的成本，目前已大量被應用在IC產業中。而CMOS MEMS則是利用此一標準化程序，將製程中用來作為電性回路的導線層及中間夾雜的介電層製作微機電元件，此元件除了有先前提到的優點外，小線寬可製作更精確及更小的機械元件，且容易與感測電路結合，達到機電整合的優勢。
本研究利用此標準製程來製作Fresnel lens微聚焦透鏡，同時結合出平面及同平面熱致動器，期望達到焦點定位及焦距調變的微光學移動平台，進一步透過此基本架構，延伸出許多不同種類的微光學元件，製作出多功能的微光學平台，經由後續量測與分析，得到元件完整的聚焦特性及靜態行為，希望對未來相關領域的研究或應用能有所幫助。

This thesis presents a novel CMOS MEMS micro-optical stage. The stage contains a Fresnel lens in the center, and then combines in-plane and out-of-plane thermal actuators outside. Thus, the focal length can be tuned by out-of-plane thermal actuator, and focal point can be positioned by in-plane thermal actuator. Based on the fundamental framework, this study also extends other focusing lenses, like binary phase Fresnel lens, convex lens, and integrates polymer lens into Fresnel lens to be compound lens. The compound lens can change curvature by heating, further tune the focal length. By way of the following measurement and analysis, obtained complete focusing characteristics and static behavior, hoped that can have assistance in related researches or applications in the future.

[1] http://www.dlp.com/
[2] H. Baltes, O. Brand, A. Hierlemann, D. Lange, and C. Hagleitner, “CMOS MEMS –present and future,” The 15th IEEE International conference on Micro Electro Mechanical System, pp 459-466, 2002.
[3] http://www.analog.com/
[4] S. Sinzinger, and J. Jahns, Microoptics. 1st Ed., New York, NY Wiley-VCH, 1999.
[5] W.J. Smith, Modern Optical Engineering. 3rd ed., McGraw-Hill, 2000.
[6] K.Y. Hung, F.G. Tseng, and H.P. Chou, “Application of 3D Gray Mask for the Fabrication of Curved SU-8 Structures,” Journal of MicroSystem Technologies, Volume 11, Numbers 4-5, pp 365-369, 2005 (SCI).
[7] S. Kwori, and L.P. Lee, “Stacked two dimensional micro-lens scanner for micro confocal imaging array,” MEMS’02, pp 483-486, 2002.
[8] S. Park, Y. Jeong, J. Kim, K. Choi, H.C. Kim, D.S. Chung, and K. Chun, “Fabricaton of PDMS Microlens for LIF detection,” Microprocesses and Nanotechnology Conference, pp 206-207, 2005.
[9] P.R. Fleming, A.J. Ouderkirk, and E.J. Borchers, “Method and Apparatus for Step and Repeat Exposures,” U.S.A. patent No.6285001, 2001.
[10] A. Werber, and H. Zappe, “Tunable microfluidic microlenses,” Applied Optics, Vol. 44, Issue 16, pp. 3238-3245, 2005.
[11] H. Toshiyoshi, G.-D. J. Su, J. LaCosse, and M.C. Wu, “A surface micromachined optical scanner array using photoresist lenses fabricated by a thermal reflow process,” J. Lightwave technol., 21(7), pp 1700-1708, 2003.
[12] B. Morgan, C.M. Waits, J. Krizmanic, and R. Ghodssi, “Development of a deep silicon phase Fresnel lens using gray-scale lithography and deep reactive ion etching,” Journal of Microelectromechanical Systems, Vol. 13, pp 113-120, 2004.
[13] T.Q. Vu, and C.S. Tsai, “Ion-milled waveguide lenses and lens arrays in GaAs,” Journal of Lightwave Technology, Vol. 7, pp 1559-1566, 1989.
[14] K. Saruta, H. Fujita, and H. Toshiyoshi, “Bulk micromachined 2D lens scanners for transparent optical fiber switches,” optical MEMS’02, pp 13-14, 2002.
[15] 強玲英, 類LIGA技術加工SU-8光阻以製作折射式微透鏡陣列之研究, 中華大學碩士論文, 2000.
[16] http://www.ck.tp.edu.tw/~pxhuang/ppt/Wave-Optics.ppt
[17] M. C. Wu, “Micromachining for optical and optoelectronic systems,” Proceedings of the IEEE, Vol. 85, No. 11, pp 1833-1856, 1997.
[18] J. Krizmanic, B. Morgan, R. Streitmatter, N. Gehrels, K. Gendreau, Z. Arzoumanian, R. Ghodssi, and G. Skinner, “Development of Ground-Testable Phase Fresnel Lenses in Silicon,” Exp. Astron, 20: 299-306, 2005.
[19] Y. Zhang, J. Chen, and X. Yea, “Multilevel phase Fresnel zone plate lens as a near-field optical element,” Optics Communications 269, pp271–273, 2007.
[20] A. Jain and H. Xie, “An Electrothermal Microlens Scanner With Low-Voltage Large-Vertical-Displacement Actuation,” IEEE Photonics Technology Letters, Vol.17, No.9, pp 1971-1973, 2005.
[21] C.-M. Sun, C.-W. Wang, and W. Fang, “CMOS MEMS Lorentz Force Dual-axis Scanning-Stage,” Proceedings of the 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, pp 580-583, 2007.
[22] J. M.-L. Tsai, H.-Y. Chu, J. Hsieh, and W. Fang, “The BELST II Process for Silicon HARM Vertical Comb Actuator and Its Applications,” Journal of Micromechanics and Microengineering, Vol. 14, pp 235-241, 2004.
[23] H.-C. Chang, J. M.-L. Tsai, H.-C. Tsai, and W. Fang, “Design, Fabrication, and Testing of a 3-DOF HARM Micromanipulator on (111) Silicon Substrate,” Sensors and Actuators A, Vol. 125/2, pp 438-445, 2005.
[24] M. Wu, H.-Y. Lin, and W. Fang, “Design of Novel Sequential Engagement Vertical Comb Electrodes for Analog Micro-mirror,” IEEE Journal of Photonics Technology Letters, Vol. 19, pp 1586-1588, 2007.
[25] W. Tan, M. Wu, and W. Fang, “Novel MUMPs-compatible single-layer Out-of-plane Electrothermal Actuator,” Journal of Microlithography, Microfabrication and Microsystems, Vol. 2, pp 91-95, 2003.
[26] M. Wu, and W. Fang, “Design and Fabrication of MEMS Devices Using the Integration of MUMPs, Trench-refilled Molding, DRIE, and Bulk Silicon Etching Processes,” Journal of Micromechanics and Microengineering, Vol. 15, pp 535-542, 2005.
[27] J. Hsieh, S.-Y. Hsiao, C.-F. Lai, and W. Fang, “Integration of UV Curable Polymer Lens and MUMPs Structure on SOI Optical Bench,” Journal of Micromechanics and Microengineering, Vol. 17, pp 1703-1709, 2007.
[28] W. Tang, M. Wu, Y.-P. Ho, H.-C. Chang, and W. Fang, “Novel MUMPs-compatible single-layer Out-of-plane Electrothermal Actuator,” SPIE's International Symposium on Smart Materials, Nano-, and Micro- Smart Systems, Melbourne, Australia, 2002.
[29] M. Wu, C.-F. Lai, and W. Fang, “Integration of the DRIE, MUMPs, and Bulk Micromachining for Superior Micro-Optical Systems,” 17th IEEE MEMS International Conference, Maastricht, the Netherlands, 2004.
[30] C.-F. Lai, J. Hsieh, and W. Fang, “Integration of UV Curable Polymer Lens with MUMPs Structure on SOI wafer,” Optical MEMS’04, Takamatsu, Japan, 2004.
[31] H. Xie, Y. Pan, and G.K. Fedder, “A CMOS MEMS Micromirror With Large Out-of-Plane Actuation,” ASME International Mechanical Engineering Congress and Exposition, New York, NY, USA, 2001.
[32] H.Xie, Y.Pan, and G.K. Fedder, “A CMOS-MEMS Mirror With Curled-Hinge Comb Drives,” Journal of Microelectromechanical Systems, Vol.12, No.14, 2003.
[33] H.-K. Ko, and H.-J. Shin, “Micromirror device for image display apparatus,” U.S.A. patent No.6351330, 2002.
[34] D.J. Young, and B.E. Boser, “A micromachine-based RF low-noise voltage-controlled oscillator,” Custom integrated circuit conference, processing of the IEEE, pp 5-8, 1997.
[35] A.Oz, and G.K. Fedder, “RF CMOS MEMS capacitor having large tuning range,” Tech. Digest,12th Inernational Confenrence Solid-State Sensors and Actuators, Boston, pp 8-12, 2003.
[36] H. Luo, G.K. Fedder, and L.R. Carley, “A 1mG Lateral CMOS-MEMS Accelerometer,” MEMS’00, Miyazaki, Japan, pp 502-507, 2000.
[37] H.Guckel, J.Klein, T.Christenson, K. Skrobis, M.Laudon, and E.G. Lovell, “Theremo-magnetic metal flexure actuators,” Tech. Digest, 5th Inernational Confenrence Solid-State Sensors and Actuators, pp 74-75, 1992.
[38] A. Jain, A. Kopa, Y. Pan, G. K. Fedder, and H. Xie, “A Two-Axis Electrothermal Micromirror for Endoscopic Optical Coherence Tomography,” IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS, Vol. 10, No. 3, 2004.
[39] A. Jain and H. Xie, “An Electrothermal SCS Micromirror for Large Bi-Directional 2-D scanning,” Transducers’05, Seoul, Korea, pp 988-991, 2005.
[40] A.Jain, and H. Xie, “A Tunable Microlens Scanner with Large-Vertical-Displacement Actuation,” MEMS’05, Miami Beach, FL, pp 92-95, 2005.
[41] S.T. Todd, A.Jain, H. Qu, and H. Xie, “A 3-D Micromirror Utilizing Inverting-Series-Connected Electrothermal Bimorph Actuators for Piston and Tilt Motion,” 2005 IEEE/LEOS International Conference on Optical MEMS, Oulu, Finland, 2005.
[42] http://www.sandia.gov/
[43] G.K. Fedder, S. Santhanam, M.L. Reed, S.C. Eagle, D.F. Guillou, M.S-C.Lu, and L.R. Carley, “Laminated high-aspect-ratio microstructure in a conventional CMOS process,” Sensor and actuator A, 57, pp 103-110, 1996.
[44] A. Oz, and G.K. Fedder, “RF CMOS-MEMS capacitor having large tuning range,” Transducers’03, Boston, MA, pp 851-854, 2003.
[45] A Oz, and G.K. Fedder, “CMOS/BiCMOS Self-Assembling and Electrothermal Microactuators for Tunable Capacitors Gap-closing Structures and Latch Mechanisms,” Solid-State Sensor, Actuator and Microsystems Workshop, Hilton Head Island, South California, pp 212-215, 2004.
[46] C.-C. Lo, F. Chen, and G.K. Fedder, “Integrated HF CMOS-MEMS Square-Frame Resonators with On-Chip Electronics and Electrothermal Narrow Gap Mechanism,” Transducer’05, Seoul, Korea, pp 2074-2077, 2005.
[47] P.J. Gilgunn, J. Liu, N. Sarkar, and G.K. Fedder, “CMOS–MEMS Lateral Electrothermal Actuators,” Journal of Microelectromechanical Systems, Volume: 17, Issue: 1, pp 103-114, 2008.
[48] L.R. Carley, M.L. Reed, G.K. Fedder, and S. Santhanam, “Microelectromechanical Structure and Process of Making Same,” U.S.A. patent No.5970315, 1999.
[49] S.-Y. Lee, H.-W. Tung, W.-C. Chen, and W. Fang, “Thermal Actuated Solid Tunable Lens,” IEEE Journal of Photonics Technology Letters, Vol. 18, pp 2191-2193, 2006.
[50] H.-W. Tung, S.-Y. Lee, W.-C. Chen, and W. Fang, “A Novel Solid State Tunable Micro Lens,” MEMS’07, Kobe, Japan, 2007.
[51] 李家雯, 應用於光學讀寫頭之微聚焦平台, 清華大學碩士論文, 2003.
[52] 梁凱智, CMOS製程整合電熱致動與壓阻感測之元件開發, 清華大學碩士論文, 2004.
[53] 童璽文, 熱致動式固態可調焦微透鏡, 清華大學碩士論文, 2005.
[54] 孫志銘, CMOS微透鏡移動平台之設計與製造, 清華大學碩士論文, 2006.