以溶液鑄型法製備Nafion膜層及其梯度電極製備之研究

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研究生：	陳俐君 L. C. Chen
論文名稱：	以溶液鑄型法製備Nafion膜層及其梯度電極製備之研究 The study of the synthesis of NafionTM membrane by solution-cast route and the fabrication of gradually componential metal electrode thereon
指導教授：	金重勳 T. S. Chin
口試委員:
學位類別：	碩士 Master
系所名稱：	工學院 - 材料科學工程學系 Materials Science and Engineering
論文出版年：	2004
畢業學年度：	92
語文別：	中文
論文頁數：	90
中文關鍵詞：	Nafion 、溶液鑄型法、梯度電極、IPMC
相關次數：	點閱：3 下載：0
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IPMC 是一種由離子交換樹脂與金屬所組成的複合材料，其主要結構是由離子高分子及上下金屬電極所組成。當外界施加電場時，IPMC可藉由離子移位而產生形變。目前IPMC在應用上遭遇最大的困難為，其電極表面水分的流失及金屬電極會由離子高分子上剝離分開，使其形變效能劣化。
本研究於導電性高分子的選取上，採用美國杜邦(DuPont)公司發展出的全氟磺酸高分子(perfluorosulphonic acid polymer，PFSA)，其商品名為NafionTM。本研究以溶液鑄造法製備NafionTM膜層並於成膜時施予不同重力加壓，探討成膜時施加壓力對於膜層結晶性質及其機械性質之影響。實驗結果顯示，以溶液鑄型成膜時，外加壓力會破壞其內部結構，小角度X光散射結果發現，主要是使氟碳化合物主鏈的結晶度降低，結晶厚度變小，結晶區域數目減少。所得膜層其楊氏係數因膜層結晶性降低，隨成膜時施加壓力增加而降低。
本研究嘗試以反無電鍍製程鍍製IPMC白金電極。結果顯示，利用此製程可成功鍍製一白金奈米顆粒梯度分佈均勻之電極，且與離子高分子界面的金屬離子細微化且均勻分布。但其表面阻值過高，以傳統無電度再鍍上白金電極後，則可得到一擺動壽命優於傳統無電鍍製程製備之IPMC。

目錄

中文摘要                                                  I
英文摘要                                                II誌謝                                                     III目錄                                                     IV
表目錄                                                  VII圖目錄                                                 VIII緒論……………………………………………………………..……..... 1
1.1    前言……………………………………………………………. 1
1.2    電致動高分子材料………………………………………...….. 2
1.3    研究目的………………………………………………………. 3
第一章    文獻回顧………………………………………………………. 5
2.1 IPMC在生物醫學上之應用…………………………………... 5
2.2離子性高分子-金屬複合材料（IPMC）……………………... 8
2.3 IPMC電極製備………………………………………………. 10
2.4 NafionTM 簡介………………………………………………. 12
2.5 NafionTM溶液鑄型成膜…………………………………….. 15
2.6結晶性高分子之X光小角度散射分析原理……………….. 18
第二章    實驗方法與步驟…………………………………………… 30
3.1 實驗流程………….…………………………………………. 30
3.2 藥品……………….…………………………………………. 31
3.3 儀器…………….……………………………………………. 32
3.4材料製備……….…………………………………………….. 34
        3.4.1以溶液鑄型法製備NafionTM膜層…………………… 34
3.4.2金屬鍍膜製作…………………………………………. 34
3.5 NafionTM膜層性質量測…………………………………….. 35
    3.5.1霍氏轉換紅外光譜儀分析( FTIR )……………………. 35
        3.5.2廣角X光繞射分析(WAXD)………………………….. 35
        3.5.3小角度X光散射分析(SAXS)………………………… 36
        3.5.4拉伸試驗……………………………………………….. 36
        3.5.5 示差熱量掃描測定(DSC)…………………………….. 36
        3.5.6 膜層密度量測………………………………………… 37
3.6 金屬電極性質檢測分析….………………………………… 37
         3.6.1成分梯度檢測分析……………………………………. 37
        3.6.2四點探針鍍層電阻量測………………………………. 37
        3.6.3 電極表面形貌分析…………………………………… 38
        3.6.4擺動測試………………………………………………. 38
第三章    結果與討論………………………………………………… 39
4.1 以溶液鑄型法製備NafionTM膜層之研究……….………… 39
        4.1.1霍氏轉換紅外光譜儀( FTIR )分析結果……………. 39
    4.1.2廣角X光繞射分析(WAXD)結果……………………. 43
        4.1.3小角度X光散射分析(SAXS)結果…………………... 48
            4.1.3.1 SAXS散射圖譜分析…………………………. 48
        4.1.3.2布拉格定律計算長區間距……………………. 51
            4.1.3.3 相關函數計算長週期長度及結晶層厚度…… 54
            4.1.3.4小角度X光散射分析結果討論……………… 59
        4.1.4示差熱量掃描測定(DSC)分析結果………………….. 60
        4.1.5膜層密度量測結果…………………………………… 62
        4.1.6拉伸試驗結果………………………………………… 63
    4.2金屬鍍膜製備之研究……………………………………….. 65
        4.2.1四點探針鍍層電阻量測結果………………………… 65
        4.2.2成分梯度檢測分析結果……………………………… 66
        4.2.3電極表面形貌分析結果……………………………… 72
        4.2.4擺動測試結果………………………………………… 74
第四章     結論………………………………………………………… 78
參考文獻……………………………………………………………… 80

                                

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