聚亞醯胺系無接著劑型軟性銅箔基板的研究與發展日益受到重視，尤其是用於超高密度線路的超薄銅箔之軟性銅箔基板與雙面可佈線路之雙面軟性銅箔基板，其製作關鍵技術分別是濺鍍/電鍍製程與熱壓合製程。
本論文研究分成三大部分，在第一部份研究中，合成得到一系列適合濺鍍/電鍍製程且各方面性質皆優異之新型聚亞醯胺。在第二部分研究中，合成得到一系列適合熱壓合製程的聚矽氧烷亞醯胺。在上述的兩部分研究中，不但詳細地討論聚亞醯胺的機械性質、電氣性質與熱性質等，並且分析與探討其組成對銅箔基板的抗剝離強度與破壞面軌跡之影響。第三部分主要探討聚矽氧烷亞醯胺的微相分離現象。
由於聚矽氧烷亞醯胺中的聚二甲基矽氧烷鏈段與聚亞醯胺鏈段之間的熱力學不相容性，使得聚矽氧烷亞醯胺具相分離現象。此研究主要改變聚矽氧烷亞醯胺中聚二甲基矽氧烷的含量與鏈長，利用顯微鏡技術（穿透式電子顯微鏡與光學顯微鏡）觀察聚矽氧烷亞醯胺的聚集形態，並利用DSC 分析並計算其介相（包括：硬質相與軟質相）含量與組成變化，更進一步地探討聚矽氧烷亞醯胺微相分離的形成機制與現象。

The main purpose of this research is to develop new PIs, which are applied for the manufacture of polyimide-based adhesiveless flexible copper clad laminate via sputter/electro-deposition and hot-pressing procession, respectively.
In the first part, a series of PIs containing pyridine as well as triazole were synthesized. The corresponding polyimide films exhibit a good balance in thermal, mechanical and dielectric properties, as does the PMDA-ODA film. XPS indicates that the LOF of the laminates occurs
either at the interface or in the polyimide. This complex substantially promoted the adhesion between sputter-deposited copper and PIs. In the second part, a series of pyridine-containing PISs with different amounts of PDMS with various segmental lengths were synthesized. The effects of the content and the segmental length of PDMS on the Tg, Dk and Rs of the copolymer are investigated. XPS shows that the LOF is either cohesive or adhesive.
In the final part, a series of amorphous PIS segmented copolymers with various PDMS segmental lengths and contents were synthesized. Extraction was utilized to obtain highly pure PISs for a study of phase separation. The morphology of the PIS changes as a function of its segmental length and content. DSC reveals that the phase separation is
induced and dominated by the aggregation of the PDMS segments.

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