本研究依據業界相關溫濕規範條件以數位陰影雲紋法(Digital Shadow Moir□ Method)配合四步相位移(Four-Step Phase-Shifting)技術量測用於智慧型手機及導航系統之4.3吋薄膜電晶體液晶顯示器(Thin Film Transistor-Liquid Crystal Display, TFT-LCD)背光模組之平面外位移場，期能以數位陰影雲紋法之線上觀測優勢，取代目前業界必須於可靠度測試中途多次另行由恆溫恆濕試驗機中移出背光模組做輝度量測之檢測方式，而成為背光模組溫濕規範可靠度測試之新方法。本研究之實驗結果顯示在高溫高濕之規範條件下背光模組之面外位移量最大。
本研究亦以有限元素法套裝軟體ANSYS進行模擬分析，探討相同實驗條件下，不同法線方向裕度之背光模組的面外位移，雖然受限於電腦設備之記憶體容量而無法得到與實驗結果一致之數值架構，但本研究已首次提供了一以ANSYS進行背光模組內零組件未相黏合之接觸及熱變形分析範例。

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