近年來，電子元件微小化技術不斷進步，使得在相同面積下容納更多的電子元件，因此，單位面積下所產生的熱劇增，這將造成電子產品的散熱問題。本研究即針對雙相移熱的方式，並利用微機電技術設計多平行漸擴微通道(microchannel)使用介電液FC-72(沸點為56℃)於微流道沸騰雙相流散熱技術之研究。
本研究的目的在改善多平行流道入口的設計，並探討漸擴角於沸騰下的效應，進一步提昇多平行漸擴微流道之熱傳能力。研究發現，樹枝狀結構的入口設計能有效的提供流道與流道間均勻的流量分佈，進而提昇最大傳熱量。本研究探討333、666及999 kg/m2s三種以平均流道截面積為基準之質量通率效應。在質量通率為999 kg/m2s的熱傳能力提昇最佳，能提高約35%的臨界熱通率。此外，研究也發現流道漸擴角越大，較能有效的抑止逆流現象的發生；因此，在高質量通率時有較佳臨界熱通率，而在低質量通率時，角度效應對熱傳所造成的影響並不顯著。
本研究證實，多平行微流道輔以適當的入口與漸擴角設計，可具有穩定的高移熱能力。若進一步加深流道，並利用雙入口對流之設計或文獻中之輻射型設計，將可利用熱傳面積倍增的效果滿足現今電子元件高移熱能力的需求。

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