隨著工業化發展，近年來物聯網(Internet of Things)的系統與整合技術興起，從製造業、工業等之生產線上，利用物聯網系統達到機台與機台的資訊互聯。當機台能互相溝通，便能進而將製造、自動檢測技術整合，而微小化之感測元件的使用與其功能即是關鍵。本研究使用內嵌壓力感測器之微加速度計作為研究對象，以有限單元法對微感測器進行分析。使用商用軟體ANSYS®建立結構模型、網格化，因本研究之微感測器結合壓力與加速度計，對微感測器做受力分析時，給予壓力在壓力感測器之薄膜(Diaphragm)。在結果與討論中探討微感測器結構受力結果，最大應力出現在彈簧內側轉角，有應力集中之現象，若受力過大質量塊可碰觸到元件底面造成破壞。另外本研究對微感測器作模態分析，以了解微感測器可能產生共振的情況與自然頻率，並將模態分析結果提供後續的簡諧響應作分析依據。進行隨機振動分析前，為因應微感測器的使用情況，將以導電銀膠作為感測器黏貼於電路板之媒介，透過實驗得到導電銀膠的楊氏模數、蒲松比和剪力強度等機械性質。最後根據NASA F-15B飛行之振動環境測試進行隨機振動分析，探討組件遇振動負載時可能發生的失效現象。

The Internet of thing (IoT) system integration technology is rising along with the industry development. IoT system is used for information communication between machines in production lines and how to make the miniaturized sensors work is the key. In this study, a pressure sensor embedded in a micro-accelerometer was investigated by using the finite element method. Since the micro-sensor includes a pressure sensor and a micro-accelerometer, there are two kinds of loading applied in the analysis. For the pressure measurement, the pressure was applied on the diaphragm of micro-sensor. The results show a stress concentration at the inside corner of the spring and the bottom of proof mass may touch the floor and cause failure for larger loading. The modal analysis and the harmonic analysis were performed to find the vibration characteristics of the micro sensor. A conductive silver adhesive was chosen as the medium for the micro-sensor to attach a PCB. The Young's modulus, Poisson's ratio and shear strength of the adhesive were obtained experimentally. The micro-sensor was simulated according to NASA F-15B Flight Test of random vibration test, from which the failure of the micro-sensor could be determined.

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