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研究生: 莊嘉平
Juang Jia-Ping
論文名稱: 雙層超導穿遂結特性之研究
Characteristics of superconducting double-barrier tunnel junctions
指導教授: 齊正中
Chi Cheng-Chung
口試委員:
學位類別: 碩士
Master
系所名稱: 理學院 - 物理學系
Department of Physics
論文出版年: 2004
畢業學年度: 92
語文別: 中文
論文頁數: 90
中文關鍵詞: 約瑟芬穿遂結超導穿遂結超導電晶體三極超導元件非平衡態准粒子效應
外文關鍵詞: Josephson junction, SIS junction, bouble-barrier, tunnel junction, transistor, non-equilibrium, injection quasi-particle
相關次數: 點閱:3下載:0
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  • 目前為止,許多三極(3-terminal)的超導元件,包括Gray transistor、Quiteron以及Quatratran等已經陸續被製作,它們具有電晶體的一些特性,包括:大訊號與小訊號的電流增益與功率放大等。為了使元件的電流放大(current gain)、功率放大(power gain)效果更好,junction的I-V 曲線的漏電流要低(lower leakage current),且detector junction有較高的超導臨界電流密度(JC)。我們可以利用曝氧度(PO2×TO2),控制AlOx(作為穿隧障璧)的厚度以達到控制Jc的大小。
    本實驗室已經建立了以Nb為基礎的超導元件製程,所以本論文的超導電晶體也以Nb/Al-AlOX/Nb(SIS)的junction為基礎。我們的3-terminal devices是由兩個SIS junction所組成,為堆疊(stacked)成長的結構,採用Self-alignment Method的方式製作完成。對SIS junction做了I-V曲線量測、基本特性的分析及信號放大的量測後發現,detector junction的准粒子穿隧電流大小(Idet)隨著injection current(Iinj)的增加而增加,且恰在detector junction的sum voltage across gap(Vg)之下,有最大的電流增益(△Idet/Iinj)。而提高detector junction的電流密度JC大小,確實可以增加電流增益效果。除了訊號放大外,我們發現外加准粒子(quasi-particle injection)的影響,使detector junction准粒子穿隧電流的增加的行為與熱(heating effect)的影響不相同。


    目 錄 摘 要......................................................................................................I 誌 謝......................................................................................................II 目錄........................................................................................................III 圖目錄....................................................................................................VI 表目錄....................................................................................................IX 第一章 簡介...........................................................................................1 第二章 原理..........................................................................................3 2.1 准粒子穿隧(Quasi-particle Tunneling)..................................3 2.2 電子對穿隧(Josephson Effect,Pair Tunneling)...................8 2.3 超導量子衍射現象................................................................11 2.4 三極超導放大元件的工作原理...........................................13 第三章 實驗方法..................................................................................17 3.1 Junction 的製作........................................................................17 1. Base layer (Nb/Al/Nb)...........................................................17 2. Double barrier deposition.......................................................21 3. Junction definition..................................................................23 4. Wiring layer............................................................................27 3.2 樣品量測..................................................................................30 3.2-1 I-V 曲線量測.................................................................30 3.2-2 Digital I-V 量測系統..................................................31 3.2-3 大訊號量測系統............................................................33 3.2-4 小訊號量測系統............................................................34 3.3 元件資料...................................................................................37 第四章 結果與討論...............................................................................39 4.1 I-V曲線量測結果...............................................................39 4.1-1 I-V曲線特性分析...........................................................39 4.1-2 ∆A、∆B及∆C的大小.........................................................44 4.1-3 超導臨界電流(IC)與外加磁場的關係..........................46 4.2 非平衡態的准粒子效應(Non-equilibrium quasi-particle effect)........................................................................................51 4.3 大訊號分析(Large signal response).......................................57 4.4 小訊號分析(Small signal response)......................................78 第五章 結論...................................................................................81 參考資料.....................................................................................................83 附錄1...........................................................................................................85 附錄2...........................................................................................................86 附錄3...........................................................................................................88 附表1...........................................................................................................90 圖目錄 圖2.1 S1-I-S2 tunneling junction..........................................................................................3 圖2.2 T=0K,熱平衡下,兩超導體的能帶圖..............................................................4 圖2.3 (a)T=0K,外加偏壓V=(Δ1+Δ2)/e時,超導體能帶圖。(b)T=0K, 外加偏壓V=(Δ1+Δ2)/e時,I-V 曲線............................................................................5 圖2.4 (a)T≠0K,S1能隙上存在著熱激發的正常電子。(b)外加偏壓 V=(Δ1-Δ2)/e時,熱激發電子有機會穿隧至S2。.......................................................5 圖2.5 (a) (Δ1-Δ2)/e < V <(Δ1+Δ2)/e時,S2能隙上的態密度小,造成負阻現象。 (b)V=(Δ1+Δ2)/e,S1能隙底部的電子可以穿越屏障至S2。(c)SIS junction 准粒子 穿隧I-V特性曲線...............................................................................................................6 圖2.6 磁場B沿y軸方向進入SIS junction....................................................................8 圖2.7 SIS junction 之IC與Φ的Fraunhofer pattern........................................................12 圖2.8 (a)為三層300Å的Al,中間夾氧化層。(b)為injector的I-V曲線。 (c)為collector的I-V曲線..................................................................................................13 圖2.9 (a)為Quiteron結構圖 (b)為大量准粒子注入中間薄膜。 (c)detector的I-V曲線,有線性與非線性負載..............................................................14 圖2.10 (a)左圖為trap層為超導時的能量圖(b)為不同detector 偏壓下, 過量准粒子隨injector current而改變..............................................................................16 圖3.1 光阻式樣的俯視圖與剖面圖................................................................................17 圖3.2 利用AZ5214E可以得到上窄下寬的金屬薄膜.................................................18 圖3.3 三層膜的沉積結構俯視圖與剖面圖...................................................................20 圖3.4 去除光阻後, 完成三層膜的俯視圖剖面圖.......................................................21 圖3.5 微影顯影完後,光阻式樣的俯視圖剖面圖......................................................22 圖3.6 多層膜去除光阻完成後的俯視圖剖面圖..........................................................23 圖3.7 微影後的junction式樣的俯視圖剖面圖............................................................24 圖3.8 蝕刻top Nb後的結構圖的俯視圖剖面圖..........................................................25 圖3.9 鍍上SiO2絕緣層後的俯視圖剖面圖...................................................................26 圖3.10 去除光阻後,junction 定義完成的俯視圖剖面圖.........................................26 圖3.11 沉積Nb6000 Å的俯視圖剖面圖.......................................................................27 圖3.12 微影後的正光阻行成時刻的光罩的俯視圖剖面圖.......................................28 圖3.13 蝕刻未受保護的Nb部分的俯視圖剖面圖.....................................................28 圖3.14去除光阻,完成double-barrier tunnel junction製作示意圖............................29 圖3.15 3td-17-27-R 之光學照片......................................................................................29 圖3.2.1 4-Wire給I量V裝置圖......................................................................................30 圖3.2.2 I-V曲線量測系統................................................................................................30 圖3.2.3 Digital I-V & current gain 裝置圖........................................................................32 圖3.2.4 The circuit of the signal mixer box.........................................................................33 圖3.2.5 Digital I-V & current gain 裝置圖........................................................................34 圖3.2.6 小訊號量測dV的裝置圖..................................................................................35 圖3.2.7 the circuit of the signal mixer box..........................................................................36 圖3.2.8 the circuit of the DC current source........................................................................36 圖3.2.9 晶圓上,3td樣品編號與位置...........................................................................37 圖3.2.10 每一個矽晶粒上有兩個3td樣品區分為R、L............................................38 圖4.1 3td-3-7-R-AB junction的I-V圖..............................................................................40 圖4.2 3td-3-7-R-BC junction的I-V圖..............................................................................40 圖4.3 3td-12-7-R-AB junction的I-V圖............................................................................41 圖4.4 3td-12-7-R-BC junction的I-V圖............................................................................41 圖4.5 3td-14-12-L-AB junction的I-V圖..........................................................................41 圖4.6 3td-14-12-L-BC junction的I-V圖..........................................................................41 圖4.7 3td-15-17-L-AB junction的I-V圖...........................................................................42 圖4.8 3td-15-17-L-BC junction的I-V圖..........................................................................42 圖4.9 3td-16-11-R-AB junction的I-V圖..........................................................................43 圖4.10 3td-16-11-R-BC junction的I-V圖........................................................................43 圖4.11 3td-17-11-R-AB junction的I-V圖........................................................................43 圖4.12 3td-17-11-R-BC junction的I-V圖........................................................................43 圖4.13 3td-12-7-R-AB junction的I-V圖.........................................................................47 圖4.14 3td-12-7-R-BC junction的I-V圖.........................................................................47 圖4.15 3td-12-7-R-AC junction的I-V圖.........................................................................47 圖4.16 AB junction臨界電流Ic與B場關係................................................................49 圖4.17 BC junction臨界電流Ic與B場關係................................................................49 圖4.18 AC junction臨界電流IC1與B場關係................................................................49 圖4.19 AC junction臨界電流IC2與B場關係................................................................49 圖4.20 AC junction臨界電流IC1與B場的行為與AB junction的Ic vs B 行為一樣.............................................................................................................................50 圖4.21 AC junction臨界電流IC2與B場的行為與BC junction的Ic vs B 行為一樣.............................................................................................................................50 圖4.22 T=4.2 K時,不同injection current下,3td-3 樣品的I-V曲線....................52 圖4.23.熱影響下,3td-3 樣品的I-V曲線圖................................................................53 圖4.24 T=4.2 K時,不同injection current下,3td-14 樣品的I-V曲線...................54 圖4.25 .熱影響下,3td-14 樣品的I-V曲線圖.............................................................55 圖4.26 T=4.2 K時,不同injection current下,3td-15 樣品的I-V曲線...................55 圖4.27 熱影響下,3td-15 樣品的I-V曲線圖..............................................................56 圖4.28 電流放大的量測電路圖.....................................................................................57 圖4.29 無負載時,電流增益的示意圖........................................................................57 圖4.30 3td-3樣品,Idet與Iinj的關係圖(IBA=Idet, ICB=Iinj)...................................................59 圖4.31 3td-3樣品,電流增益t與Iinj的關係圖(IBA=Idet, ICB=Iinj)....................................59 圖4.32電流增益之能帶解釋圖......................................................................................60 圖4.33中間層的准粒子使中間層能隙下降,造成電流增益...................................61 圖4.34 電流放大的量測電路圖.....................................................................................61 圖4.35 3td-3樣品,Idet與Iinj的關係圖(IBC=Idet, IAB=Iinj)...................................................61 圖4.36a 3td-12-7-R-AB injection current(ICB)=0時,I-V曲線圖...................................63 圖4.36b 3td-12-7-R-AB injection current(ICB)=2mA時,I-V曲線圖.............................63 圖4.37a 3td-12-7-R-BC injection current(IAB)=0時,I-V曲線圖....................................63 圖4.37b 3td-12-7-R-BC injection current(IAB)=2mA時,I-V曲線圖..............................63 圖4.36 3td-12樣品,Idet與Iinj的關係圖.(IBA=Idet, ICB=Iinj)......................................................64 圖4.37 3td-12樣品,Idet與Iinj 的關係圖.(IBC=Idet, IAB=Iinj).....................................................64 圖4.38 3td-14樣品,Idet與Iin的關係圖.(IBA=Idet, ICB=Iinj)..................................................66 圖4.39 3td-14樣品,電流增益(△IBA/ICB)與Iinj的關係圖..............................................66 圖 4.40 3td-14樣品,Idet與Iin的關係圖.(IBC=Idet, IAB=Iinj)....................................................67 圖4.41 3td-14樣品,電流增益(△IBA/ICB)與Iinj的關係圖...............................................67 圖4.42 3td-15樣品,Idet與Iin的關係圖.(IBA=Idet, ICB=Iinj)..................................................69 圖4.43 3td-15樣品,電流增益(△IBA/ICB)與Iinj的關係圖..............................................69 圖 4.44 3td-15樣品,Idet與Iin的關係圖.(IBC=Idet, IAB=Iinj)....................................................70 圖4.45 3td-15樣品,電流增益(△IBA/ICB)與Iinj的關係圖...............................................70 圖4.46 3td-16樣品,Idet與Iin的關係圖.(IBA=Idet, ICB=Iinj)..................................................72 圖4.47 3td-16樣品,電流增益(△IBA/ICB)與Iinj的關係圖..............................................72 圖 4.48 3td-16樣品,Idet與Iin的關係圖.(IBC=Idet, IAB=Iinj)....................................................73 圖4.49 3td-16樣品,電流增益(△IBA/ICB)與Iinj的關係圖...............................................73 圖4.50 3td-17樣品,Idet與Iin的關係圖.(IBA=Idet, ICB=Iinj)..................................................74 圖4.51 3td-17樣品,電流增益(△IBA/ICB)與Iinj的關係圖..............................................75 圖 4.52 3td-17樣品,Idet與Iin的關係圖.(IBC=Idet, IAB=Iinj)....................................................75 圖4.53 3td-17樣品,電流增益(△IBA/ICB)與Iinj的關係圖...............................................76 圖4.54 Detector的電壓輸出與AC電壓源輸出電壓(與injector junction 的輸入電流成正比)關係圖..............................................................................................79 圖4.55 正常工作偏壓下,detector的輸出與AC源電壓(或injection電流) 成正比的關係.....................................................................................................................79 圖4.56 (a)-(e)對應injection current (ICB)(0-1mA),不同detector偏壓下, 小訊號的電流增益.............................................................................................................80 表目錄 表3.2.1 不同元件的製作條件與參數............................................................................38 表4.1 3td junction的特性參數..........................................................................................44 表4.2 3td-12-7 junction 的fitting參數.............................................................................48 表4.3樣品的junction參數及大訊號結果......................................................................77

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