一個堆疊式晶片之產品將多個晶片整合至中介層(interposer)上。在此論文中，我們首先討論傳統測試機制使用在中介層上的困難，接著我們提出一個可以使用在堆疊前(pre-bond)中介層上的非接觸式之測試機制以用來提升生產良率。我們的測試機制試圖從加熱中介層後之熱影像中偵測出損壞的中介層，我們從熱影像中擷取出特別的特徵(feature)，並且使用一個分群演算法(clustering algorithm)來決定是否一個中介層為損壞。實驗結果證實出我們的測試機制可以顯著的將良率從70.5％提升至96.84％。

A stacked-die product integrates multiple dies on interposers. In this paper, we first discuss the difficulties of traditional testing mechanism for interposers. To improve production yield, a contactless testing mechanism for pre-bond interposers is proposed. Our testing mechanism attempts to detect a defective interposer from the thermal image after heating the interposer. We propose to extract special features from the thermal image and then use a clustering algorithm to determine whether the interposer is defective. Experimental results show that our testing mechanism can efficiently improve the yield from 70.5% to 96.84%.

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