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研究生: 黃建豪
Huang, Chien-Hao
論文名稱: 0.35和0.25微米BCD製程之橫向式蕭特基二極體元件設計
The design of Lateral Schottky Barrier Diode in 0.35um and 0.25um BCD process
指導教授: 龔正
Gong, Jeng
黃智方
Huang, Chin-Fang
口試委員:
學位類別: 碩士
Master
系所名稱: 電機資訊學院 - 電子工程研究所
Institute of Electronics Engineering
論文出版年: 2009
畢業學年度: 97
語文別: 英文
論文頁數: 85
中文關鍵詞: 蕭特基二極體
外文關鍵詞: Schottky, diode, BCD
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  • 本篇論文針對蕭特基二極體以0.35um和0.25um BCD製成設計做討論。我們使用了2D模擬軟體去分析其元件特性,以提升蕭特基二極體的崩潰電壓,及改善導通電阻與漏電流之間的取捨為目標。除了2D模擬軟體提供我們由元件的橫截面上設計蕭特基二體外,3D軟體使我們可以更有彈性的由元件俯視面上做不同光罩的設計。最後,實驗量測結果將可以確認我們的模擬分析是否正確。


    In this thesis, the development of integrated Schottky barrier diode (SBD) in 0.35um and 0.25um BCD technology is described. In order to improve the breakdown voltage, the trade off between on-resistance, and reverse leakage current, we use the simulation tools to analyze the characteristics of SBD. The two-dimensional simulation helps us to design SBD in the cross-sectional view. In addition, the three-dimensional simulation makes us have further improvement by flexible design in the device top patterns. Finally, the experimental results are given to confirm our analytic work.

    Abstract (in Chinese)….………….……………………………………………………I Abstract (in English)…………………………………………………………………..II 致謝…………………………………………………………………... ...III Contents……………………………………………………………………………...IV Figure Contents………………………………………………………………...……VII CHAPTER1 INTRODUCTION CHAPTER2 DEVICE CHARACTERISTC OF POWER RECTIFIERS 2.1 SCHOTTKY BARRIER RECTIFIERS……………………………………3 2.1.1 Metal-semiconductor contact……………………………….………..3 2.1.2 Forward conduction……………………………………….………….4 2.1.3 Reverse blocking……………………………………….……...……..7 2.1.4 Breakdown voltage…………………………………..……………….8 2.1.5 Power dissipation………………………………………………....….8 2.1.6 Switching behavior……………………………….……….………….9 2.2 P-I-N RECTIFIERS………………………………………………………..9 2.2.1 P-I-N rectifier structure…………………………………………..…..9 2.2.2 Forward conduction……………………………….….………………9 2.2.3 Reverse blocking………………………………….…….……………9 2.2.4 Reverse recovery……………………………………….…….……..10 2.3 MPS (Merged P-I-N Schottky Diode) RECTIFIERS……….……………10 2.3.1 MPS rectifier structure………………………………………...……10 2.3.2 Forward conduction……………………………………..……….….11 2.3.3 Reverse blocking………………………………………………..…..11 CHAPTER3 TWO-DIMENSIONALSIMULATION OF SCHOTTKY BARRIER DIODE 3.1 Conventional SBD Structure……………………………………………..20 3.2 The effect of SBD with and without poly-Si……………………………..20 3.3 The effect of SBD with and without p-type ring…………………………21 3.4 Breakdown voltage……………………………………………………….22 3.5 The effect of space between poly-Si and cathode N+ implant……………23 3.6 The effect of field oxide isolation………………………………………..24 3.7 The effect of DPW……………………………………………………….25 3.8 The effect of space between p-rings (L)…………………………………25 3.9 The effect of temperature………………………………………………...27 CAHPTER4 THREE-DIMENSIONAL SIMULATION OF SCHOTTKY BARRIER DIODE 4.1 P-Type ring of dotted pattern…………………………..…………………46 4.2 The effect of space between p-type dots………………………………....47 CHAPTER5 MEASUREMENT OF THE TAPED-OUT SCHOTTKY BARRIER DIODE 5.1 EXPIRIMENT RESULTS IN 0.35-MICRON TECHNOLOGY…….......59 5.1.1 The effect of different p-type ring implant (FPW P-body PDD)..…59 5.1.2 The effect of LVPW implant……………………………………….59 5.1.3 The effect of space between poly-Si and cathode N+ implant….…..60 5.1.4 The effect of space between p-rings………………………….…….60 5.1.5 Temperature performance…………………………….….…………61 5.2 EXPIRIMENT RESULTS IN 0.25-MICRON TECHNOLOGY…….......61 5.2.1 The effect of DPW……………………………………...…….……61 5.2.2 Reduce the on-resistance by separated DPW………...….……....…62 5.2.3 P-type ring of dotted pattern………………………...……………...63 CHAPTER6 CONCLUSION AND FUTURE WORK 6.1 Conclusion……………………………………………………..…….…...80 6.2 Future work……………………………………………………..…….….81 REFERENCES……………………………………………………………………….83

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