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研究生: 江惠聖
論文名稱: Sn-3 Ag-1 Zn 無鉛焊錫軟焊鐵鎳42合金研究
指導教授: 張士欽
口試委員:
學位類別: 碩士
Master
系所名稱: 工學院 - 材料科學工程學系
Materials Science and Engineering
論文出版年: 2003
畢業學年度: 91
語文別: 中文
論文頁數: 70
中文關鍵詞: 無鉛焊錫42合金
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  • 本研究發現在Sn-3 Ag-1 Zn無鉛銲錫中有兩種不同的析出物。顆粒尺寸較大的析出物,大小約為數個微米。其成份相當接近Ag3Sn。而顆粒尺寸較小的析出物,大小約為100 nm左右。經由TEM/EDX鑑定的結果,部分為Ag3Sn,而部分的析出物則含有大量的鋅。然而,在含有大量鋅的析出物中,其銀和鋅的比例接近1,而錫的含量則不同。因此推測應該是銀鋅化合物(AgZn),而錫(Sn)則來自於基地。為驗證推測,依鑑定出來的錫、銀、鋅比例熔融合金,而此合金的X-Ray diffraction pattern結果證實了推測是正確的。 另外,氯化鋅酒精溶液及氯化亞錫酒精溶液則作為新的助熔劑(Flux)。這兩種助熔劑都能加強銲錫的潤濕能力,且都能在銲錫和基板間形成良好的鍵結。而且試片強度都遠高於利用之前的助焊劑所焊接的試片。而觀察斷面均為密佈的窩穴(Dimples),代表其均為延性破裂。另外,觀察拉伸至不同階段的剝離測試試片則發現破裂皆發生在銲錫中間。


    CONTENTS ABSTRACT 1 ACKNOWLEDGEMENT 3 CONTENTS 4 INTRODUCTION 6 II LITERCTURE REVIEW 8 Ⅱ-1. Lead-free Solders 8 Ⅱ-2. Wetting characteristics 9 Ⅱ-3. The formation and growth of IMC in the solder interface 11 Ⅱ-4. Adhesion strength test 12 Ⅲ EXPERIMENTAL PROCEDURES 14 Ⅲ-1. Materials 14 Ⅲ-2. Flux 14 Ⅲ-3. Soldering 15 Ⅲ-4. Microstructure observation and analysis of the solder 15 Ⅲ-5. The Peel Test and observation of the fracture surface 15 Ⅲ-6. The observation of crack propagation in the solder 16 Ⅳ. RESULTS AND DISCUSSION 18 Ⅳ-1. Microstructures 18 Ⅳ-2. The fluxes and the mechanical properties 19 IV-3. The fracture surface and the cracking 22 path of the solder in peel test IV-4. The deformation of peeled solder 23 V. CONCLUSION 25 VI. REFERENCES 26 FIGURE 29 Table 66 APPENDIX 70

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