本文提出了利用微加工製程，於矽晶片上製作微小化的測試儀器，藉由尺寸、出力相容的特性，該儀器被應用來量測薄膜機械性質，以及奈微米尺度之元件的機械特性。此儀器是由數種模組所構成，例如機械結構模組，致動模組，感測模組，積體電路模組，使用者可以根據應用的需求，選擇不同規格與特性的模組，再藉由不同模組的搭配，架構出在設計上具有彈性、製程容易實現等優點之微測試儀器。

本文以彎曲測試機制之微測試儀器為例，說明各個部份之設計考量點，例如其具備高解析度的力量輸出裝置(致動模組)，次微米的位移感測裝置(感測模組)，高剛性比之線性支撐彈簧(機械結構模組)等。本文亦針對該儀器之靜態、動態特性及電性進行測試，並使用商用儀器奈米壓痕系統、微機電元件運動分析儀對微測試儀器之力量和位移進行校正，最後利用此測試儀器對單晶矽懸臂樑進行彎曲測試，然後測得單晶矽之楊氏模數為173 GPa，與文獻僅4.8 %的誤差量，証明微測試儀器的可行性。

本文已成功的將微測試儀器之探頭裸露，使待測的薄膜材料試片不會受到單一種類的限制，未來希望能完成線上測試以量測到不同薄膜材料之機械性質，以發揮此微測試儀器之多功能性，如能再與控制及感測電路整合在一起，將具備即時檢測薄膜材料機械性質的功能。

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