隨著科技發展，現代元件封裝技術也隨之進步，表面黏著元件也就應運而生。在QFN封裝上，散熱片的目的是為了達到有效地將熱與電器特性從元件轉移到PCB 的金屬層上，所以兩者的密合度非常重要。然而在製程上，常會因為錫膏面積而造成孔洞(Void)，影響傳導特性，故需做X光檢測來判斷孔洞面積大小。

然而孔洞缺陷並沒有一定的位置和形狀，且因錫膏厚度分佈不均勻，造成背景影像的亮度和空洞缺陷的亮度值差異很小，導致檢測的困難。既有的影像分割方法皆不適用於導熱片上的檢測，故發展出適應性分割技術來分離影像上的孔洞缺陷。本方法屬於混合型的分割技術，在文中會詳細介紹，最後將分析本方法的優缺點以及實驗結果討論，並將此方法套用在其他元件的檢測上。

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