微機電感測元件及模組研發過程中，模組內各微機電感測元件與整合後之模組於製程中或操作環境之受熱或衝擊後對結構之影響為其中重要的ㄧ環。本文目標為點出單一微機電感測器或整合模組受熱或衝擊負載後結構之脆弱處，並進ㄧ步提出提升感測器或整合模組結構強度的方法。透過有限單元分析與實驗確認結構之脆弱處，進一步利用有限單元分析與最佳化設計方法-田口法評估結構強化之方法。
本研究首先探究不同的微機電感測元件，其在製程、操作過程或結構強度測試下受熱或衝擊負載後，對結構強度影響。從力學分析的角度，提供該感測元件於開發階段結構設計的建議；如對內嵌壓力感測器之加速度計，討論其於封裝製程中受熱所產生之熱應力分析，並針對黏膠之材料參數進行分析，提出黏膠材料選擇的方向；也透過有限單元數值模擬提出減少晶片運作過程中所產生之熱應力之結構設計。另外，也針對微機電麥克風晶片進行熱循環測試與衝擊測試下，利用有限單元數值模擬及實驗方法，點出該結構之脆弱點，並利用田口法提出強化結構之建議；同時討論結構強化與元件性能提升之設計方向，並對於微機電麥克風晶片之封裝結構提出新設計。
最後，針對微機電感測元件整合模組，利用有限單元分析軟體進行熱應力分析，針對模組內各感測元件之配置等幾何參數對於熱應力之影響，亦透過田口法提出強化微機電感測元件整合模組結構之設計方向。本研究所得到之結果，可提供微機電感測元件整合模組，無論是單一感測元件或整合模組結構設計之參考。

For the development of novel micro-electromechanical systems (MEMS) devices and integrated module, the thermal and shock loading from fabrication process and operation for structural robustness is important for both single device and integrated module. The targets of this research are to identify the weakness of device structures under thermal and shock loading and to propose the structural enhancement for various MEMS devices and integrated module. Finite element analysis and experiments were applied for identification of structural weak spots in this study; furthermore, finite element analysis with Taguchi method was used to evaluate the approaches of structural enhancement.
This study evaluated the effect of thermal or shock loading under process, operation, or tests for the structure of various MEMS devices first. The proposals of the structural design for two MEMS devices, including a chip with a pressure sensor embedded in an accelerometer and CMOS-MEMS microphone, were obtained from viewpoints of stress analysis. The thermal stress generated by packaging process for the chip with a pressure sensor embedded in an accelerometer was discussed and the material of adhesive was suggested by finite element analysis. The structural design of the chip to reduce thermal stress under operation was also proposed. In addition, the weakness spots of the CMOS-MEMS microphone after thermal and shock loading were identified by finite element analysis and thermal cycling test and drop test. The parametric combinations of microphone for structural enhancement and sensitivity improvement were assessed by Taguchi method. Novel enhanced structure on print circuit board (PCB) for CMOS-MEMS microphone chip was proposed to control packaging process properly and to reduce the residue stress of adhesive.
Finally, the interaction between several parameters of integrated MEMS sensor module and residual stress generated by packaging process was evaluated. The results could provide useful suggestions for structural design of single MEMS device and integrated module.

1. H. Kopetz, Internet of Things. In: Real-Time Systems, Real-Time Systems Series, Springer, Boston, MA, 2011.
2. A. Poghossian, K. Schumacher, J. P. Kloock, C. Rosenkranz, J. W. Schultze, M. M.Veggian, and M. J. Schöning, “Functional Testing and Characterization of ISFETs on Wafer Level by Means of a Micro-droplet Cell,” Sensors, Vol. 6, pp 397-404, 2006.
3. http://www.afore.fi/products-wafer_level_testing, retrieved on June 22, 2018.
4. http://www.solidustech.com/STI3000WaferProbeTestSystem.html, retrieved on June 22, 2018.
5. Y. C. Lin, P. J. Hesketh, and J. P. Schuster, “Finite-Element Analysis of Thermal Stresses in a Silicon Pressure Sensor for Various Die-mount Materials,” Sensors and Actuators, Vol. 44, Issue 2, pp. 145-149, 1994.
6. M. S. Zarnik, D. Rocak, and S. Macek, “Residual Stresses in a Pressure-Sensor Package Induced by Adhesive material During Curing：A Case Study,” Sensors and Actuators, Vol. 116, Issue 3, pp. 442-449, 2004.
7. X. Zhang, T. Y. Tee, and J. Luan, “Comprehensive Warpage Analysis of Stacked Die EMS Package in Accelerometer Application,” 6th international Conference on Electronic Packaging Technology, pp. 1-6, 2005.
8. S. S. Walwadkar and J. Cho, “Evaluation of Die Stress in MEMS Packaging: Experimental and Theoretical Approaches,” IEEE Transactions on Components and Packaging Technologies, Vol. 29, No. 4, pp. 735-742, 2006.
9. Y. J. Chen, C. S. Wang, and Y. J. Yang, “Combining Vibration Test with Finite Element Analysis for The Fatigue Life Estimation of PBGA Components,” Microelectronics Reliability, Vol. 48, Issue 4, pp. 638-644, 2007.
10. X. Zhang, S. Park, and M. W. Judy, “Accurate Assessment of Packaging Stress Effects on MEMS Sensors by Measurement and Sensor–Package Interaction Simulations,” Microelectromechanical Systems, Vol. 16, Issue 3, pp. 639-649, 2007.
11. T. L. Chou, C. H. Chu, C. T. Lin, and K. N. Chiang, “Sensitivity Analysis of Packaging Effect of Silicon-based Piezoresistive Pressure Sensor,” Sensors and Actuators A: Physical, Vol. 152, pp. 29-38, 2009.
12. M. K. Yeh and C. L. Lu, “Thermal Stress and Thermal Cycling Analyses of Microgyroscope Chip Models,” Key Engineering Materials, Vol. 462-463, pp. 622-627, 2011.
13. V. Kutis, J. Dzuba, J. Paulech, J. Murin, and T. Lalinsky, “MEMS Piezoelectric Pressure Sensor – Modeling and Simulation,” Procedia Engineering, Vol. 48, pp. 338-345, 2012.
14. S. Park, D. Liu, Y. Kim, H. Lee, and S. Zhang, “Stress Evolution in an Encapsulated MEMS Package Due to Viscoelasticity of Packaging Materials,” Electronic Components and Technology Conference (ECTC), pp. 70-75, 2012.
15. H. Lee, R. Liu, S. Park, and X. Xue, “MEMS Die Warpage during Curing of Die Attach Material,” ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, paper No. IPACK2015-48010, pp. V003T07A004, 2015.
16. H. T. Yang, Y. F. Su, and K. N. Chiang, “Research on Packaging Effects of Three-axis SOl MEMS Acceleromete,” International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), pp. 1-4, 2015.
17. R. Liu, H. Wang, J. Wang, H. Lee, S. Park, X. Xue, Y. Kim, S. Saiyed, and D. Sengupta, “Moisture Diffusion and Hygroscopic Swelling of Adhesives in Electronics Packaging,” 2016 IEEE 66th Electronic Components and Technology Conference, 2016.
18. M. K. Yeh and C. L. Lu, “Reliability Analysis of 3D Heterogeneous Microsystem Module by Simplified Finite Element Model,” Microelectronics Reliability, Vol. 63, pp. 111-119, 2016.
19. W. C. Yeh, C. K. Chan, J. Hsieh, C. F. Hu, F. M. Hsu, and W. Fang, “Novel TPMS Sensing Chip with Pressure Sensor Embedded in Accelerometer,” Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems, pp. 1759-1762, 2013.
20. B. Lee, S. Seok, and K. Chun, “A Study on Wafer Level Vacuum Packaging for MEMS devices,” Journal of Micromechanics and Microengineering, Vol. 13, pp. 663-669, 2003.
21. E. Yıldırım, M. A. Sahir Arikan, and H. Külah, “A Normally Closed Electrostatic Parylene Microvalve for Micro Total Analysis Systems,” Sensors and Actuators A: Physical, Vol. 181, pp. 81-86, 2012.
22. Z. Li, Y. Hao, D. Zang, T. Li, and G. Wu, “An SOI-MEMS Technology Using Substrate Layer and Bonded Glass as Wafer-Level Package,” Sensors and Actuators A: Physical, Vol. 96, pp. 34-42, 2002.
23. D. Hah, S. T. Y. Huang, J. C. Tsai, H. Toshiyoshi, and M. C. Wu, “Low- Voltage, Large-scan Angle MEMS Analog Micromirror Arrays with Hidden Vertical Comb-drive Actuators, Journal of Microelectromechanical Systems, Vol. 13, pp. 279-289, 2004.
24. M. Lishchynska, C. O’Mahony, O. Slattery, O. Wittler, and H. Walter, “Evaluation of Packaging Effect on MEMS Performance: Simulation and Experimental Study,” IEEE Transactions on Advanced Packaging, Vol. 30, pp. 629-635, 2007.
25. R. C. Batra, M. Porfiri, and D. Spinello, “Effects of van der Waals Force and Thermal Stresses on Pull-in Instability of Clamped Rectangular Microplates,” Sensors, Vol. 8, pp. 1048-1069, 2008.
26. R. Bogue, “Recent Developments in MEMS Sensors: A Review of Applications, Markets and Technologies,” Sensor Review, Vol. 33, No. 4, pp. 300-304, 2013.
27. C. H. Huang, C. H. Lee, T. M. Hsieh, L. C. Tsao, S. Wu, J. C. Liou, M. Y. Wang, L. C. Chen, M. C. Yip, and W. Fang, “Implementation of the CMOS MEMS Condenser Microphone with Corrugated Metal Diaphragm and Silicon Back-plate,” Sensors, Vol. 11, pp. 257-269, 2011.
28. C. H. Je, J. Lee, W. S. Yang, and J. Kim, “The Novel Sensitivity Improved Surface Micromachined MEMS Microphone with the Center-hole Membrane,” Procedia Engineering, Vol. 25, pp. 583-586, 2011.
29. C. H. Je, J. Lee, W. S. Yang, J. Kim, and Y. H. Cho, “A Surface-Micromachined Capacitive Microphone with Improved Sensitivity,” Journal of Micromechanics and Microengineering, Vol. 23, No. 5, 055018, 2013.
30. F. Tounsi, B. Mezghani, L. Rufer, and M. Masmoudi, “Electroacoustic Analysis of a Controlled Damping Planar CMOS-MEMS Electrodynamic Microphone,” Archives of Acoustics, Vol. 40, No. 4, pp. 527-537, 2015.
31. W. J. Mao, C. L. Cheng, S. C. Lo, Y. S. Chen, and W. Fang, “Design and Implementation of a CMOS-MEMS Microphone without the Back-plate,” Solid-State Sensors, Actuators and Microsystems (Transducers), pp. 1037-1040, 2017.
32. B. A. Ganji and B. Y. Majlis, “Design and Fabrication of a New MEMS Capacitive Microphone using a Perforated Aluminium Diaphragm,” Sensors and Actuators A: Physical, Vol. 149, pp. 29–37, 2009.
33. N. Mohamad, P. Iovenittia, and T. Vinay, “High Sensitivity Capacitive MEMS Microphone with Spring Supported Diaphragm,” Proceeding of SPIE, Vol. 6800 68001T, 2008.
34. C. K. Chan, W. C. Lai, M. Wu, M. Y. Wang, and W. Fang, “Design and Implementation of a Capacitive-type Microphone with Rigid Diaphragm and Flexible Spring using the Two Poly Silicon Micromachining Processes,” IEEE Sensors Journal, Vol. 11, pp. 2365-2370, 2011.
35. H. A. C. Tilmans, J. De Coster, P. Helin, V. Cherman, A. Jourdain, P. De Moor, B. Vandevelde, N. P. Pham, J. Zekry, A. Witvrouw, and I. De Wolf, “MEMS Packaging and Reliability: An Undividable Couple,” Microelectronics Reliability, Vol. 52, pp. 2228-2234, 2012.
36. J. Iannacci, “Reliability of MEMS: A Perspective on Failure Mechanisms, Improvement Solutions and Best Practices at Development Level,” Displays, Vol. 37, pp. 62-71, 2015.
37. M. C. Yew, C. W. Huang, W. J. Lin, C. H. Wang, and P. Chang, “A Study of Residual Stress Effects on CMOS-MEMS Microphone Technology,” 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), pp. 323-326, 2009.
38. A. Saeedivahdat, F. Abdolkarimzadeh, A. Feyzi, G. Rezazadeh, and S. Tarverdilo, “Effect of Thermal Stresses on Stability and Frequency Response of a Capacitive Microphone,” Microelectronic Engineering, Vol. 41, pp. 865-873, 2010.
39. C. H. Chuang, W. H. Li, and S. L. Lee, “Parametric Study of Flip-chip Packaging for an MEMS Device with Diaphragm,” Microsystem Technologies, Vol. 17, pp. 669-675, 2011.
40. H. J. Wang, H. A. Deng, S. Y. Chiang, Y. F. Su, and K. N. Chiang, “Development of a Process Modeling for Residual Stress Assessment of Multilayer Thin Film Structure,” Thin Solid Films, Vol. 584, pp. 146-153, 2015.
41. B. Putz, B. Volker, C. Semprimoschnig, and M. J. Cordill, “Influence of Extreme Thermal Cycling on Metal-polymer Interfaces,” Microelectronic Engineering, Vol. 167, pp. 17-22, 2017.
42. S. A. Zawawi, A. A. Hamzah, F. Mohd-Yasin, and B. Y. Majlis, “Mechanical Performance of SiC Based MEMS Capacitive Microphone for Ultrasonic Detection in Harsh Environment,” Proceeding of SPIE 10354, Nanoengineering: Fabrication, Properties, Optics, and Devices XIVProceeding of SPIE, Vol. 103541J, 2017.
43. P. Lall, A. Abrol, and D. Locker, “Effects of Sustained Exposure to Temperature and Humidity on the Reliability and Performance of MEMS Microphone,” ASME 2017 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems, No. IPACK2017-74252, pp. V001T01A022, 2017.
44. B.H. Kim and H.S. Lee, “Acoustical-Thermal Noise in a Capacitive MEMS Microphone, ” IEEE Sensors Journal, Vol. 15, pp. 6853-6860, 2015.
45. J. Lee, C.H. Je, W.S. Yang, Y.G. Kim, M.H. Cho, and J. Kim, “Thin MEMS Microphone Based on Package-Integrated Fabrication Process,” Electronics Letters, Vol. 48, pp. 866-867, 2012.
46. J. Li, T. Mattila, and V. Vuorinen, Handbook of silicon based MEMS materials and technologies, second edition, William Andrew, Norwich, NY, Chapter 41, pp. 744-763, 2015.
47. J. Hokka, J. Raami, H. Hyvönen, M. Broas, J. Makkonen, J. Li, T. T. Mattila, and M. Paulasto-Kröckel, “Methods for Reliability Assessment of MEMS Devices-Case Studies of a MEMS Microphone and a 3-Axis MEMS Gyroscope,” IEEE 62nd Electronic Components and Technology Conference, pp. 62-69, 2012.
48. L. B. Tan, C. W. Ang, C. T. Lim, V. B. C. Tan, and X. Zhang, “Modal and Impact Analysis of Modern Portable Electronic Products,” Electronic Components and Technology Conference, pp. 645-653, 2005.
49. A. S. Vahdat, G. Rezazadeh, and S. Afrang, “Improving Response of MEMS Capacitive Microphone Filtering Shock Noise,” Microelectronics Journal, Vol. 42, pp. 614-621, 2011.
50. J. Li, M. Broas, J. Raami, T. T. Mattila, and M. P. Krockel, “Reliability Assessment of a MEMS Microphone under Mixed Flowing Gas Environment and Shock Impact Loading,” Microelectronics Reliability, Vol. 54, pp. 1228-1234, 2014.
51. A. Dehe, “Silicon Microphone Development and Application,” Sensors and Actuators A: Physical, Vol. 133, pp. 283-287, 2007.
52. M. Fuldner, A. Dehe, and R. Lerch, “Analytical Analysis and Finite Element Simulation of Advanced Membranes for Silicon Microphone,” IEEE Sensors Journal, Vol. 5, pp. 857-862, 2005.
53. J. Meng, S. T. Douglas, and A. Dasgupta, “MEMS Packaging Reliability in Board-level Drop Tests under Severe Shock and Impact Loading Conditions-Part I: Experiment,” IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 6, pp. 1595-1603, 2016.
54. M. L. Ya, N. Soin, and A. N. Nordin, “Design and Optimization of a Low-voltage Shunt Capacitive RF-MEMS Switch,” 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), France, Apr. 2014.
55. C. H. Yeh, Z. O. Zhao, P. L. Shen, and Y. C. Lin, “Optimization of an Optical Inspection System Based on the Taguchi Method for Quantitative Analysis of Point-of-Care Testing,” Sensors, Vol. 14, pp. 16149-16158, 2014.
56. M. Bagherinia, M. Bruggi, A. Corigliano, S. Mariani, and E. Lasalandra, “Geometry Optimization of a Lorentz Force, Resonating MEMS Magnetometer,” Microelectronics Reliability, Vol. 54, pp. 1192-1199, 2014.
57. D. Gopinath, Y. Joshi, and S. Azarm, “An Integrated Methodology for Multiobjective Optimal Component Placement and Heat Sink Sizing,” IEEE Transactions on Components and Packaging Technologies, Vol. 28, Issue 4, pp. 869-876, 2005.
58. S. J. Lin, Y. J. Huang, and C. M. Ko, “MCM Placement Problem with GASA Multi-objective Optimization Strategy,” Electronic Materials and Packaging International Conference, pp. 1-7, 2007.
59. X. Cao, T. Wang, K. D. T. Ngo, and G. Q. Lu, “Height Optimization for a Medium-Voltage Planar Package,” Applied Power Electronics Conference and Exposition, pp. 479-484, 2009.
60. W. U. Zhaohua, “Study on Thermal Placement Optimization of 3D High-power Microwave Module,” International Conference on Electronic Packaging Technology & High Density Packaging, pp. 270-276, 2012.
61. J. Zhang and D. Zhang, “Study of Response Surface Methodology in Thermal Optimization Design of Multichip Modules,” IEEE Transactions on Components and Packaging Technologies, Vol. 3, Issue 12, pp. 2075-2080, 2013.
62. J. Lee. “Reliability and Wireability Optimizations for Chip Placement on Multichip Modules,” Electronics Packaging Manufacturing, Vol. 28, Issue 2, pp. 133-141, 2005.
63. F. X. Che, H. L. Pang, and L. H. Xu. “Investigation of IMC Layer Effect on PBGA Solder Joint Thermal Fatigue Reliability,” Electronic Packaging Technology Conference, Vol. 2, pp. 427-430, 2005.
64. S. Chen, T. Lee, J. Lee, and N. Feng. “Solder Joint Thermal Fatigue Analysis of 48-FBGA,” Electronic Packaging Technology, pp. 1-4, 2006.
65. C. Bailey, T. Tilford, and H. Lu, “Reliability Analysis for Power Electronics Modules,” 30th International Spring Seminar on Electronics Technology, Cluj-Napoca, pp. 12-17, 2007.
66. H. Jiang, X. Ma, and N. Chen. “Analysis and Comparison of Thermal Stress and Hygrothermal Stress of SiP Device by QFN Packaging,” Electronic Packaging Technology & High Density Packaging, pp. 1-5, 2008.
67. M. K. Yeh and C. L. Lu, “The Effect of Thermal Prestress on the Deformation of Micromirror Chip Embedded with Through-Silicon Vias,” Key Engineering Materials, Vol. 462-463, pp. 563-568, 2011.
68. X. Huang, W. F. Wu, and P. L. Chou. “Fatigue Life and Reliability Prediction of Electronic Packages under Thermal Cycling Conditions through FEM Analysis and Acceleration Models,” Electronic Materials and Packaging, pp. 1-6, 2012.
69. S. Yi and K. Pickup, “Thermal Stress Analyses of Inductive Proximity Sensors under Thermal Cycling Condition,” Thermal Investigations of ICs and Systems, pp. 1-6, 2012.
70. C. W. Kuo and H. Y. Tsai, “Thermal Stress Analysis and Failure Mechanisms for Through Silicon Via Array,” Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 202-206, 2012.
71. C. C. Tsai, L. L Liao, Y. F. Su, T. Y. Hung, and K. N. Chiang. “Reliability Analysis of Copper Bump Interconnection in Double-sided Power Module,” Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, pp. 1-4, 2015.
72. ANSYS, https://www.ansys.com/
73. R. D. Cook, D. S. Malkus, M. E. Plesha, and R. J. Witt, Concepts and Applications of Finite Element Analysis, 4th ed., John Wiley & Sons, Inc., Danvers, 2002.
74. JESD22-B111, Board Level Drop Test Method of Components for Handheld Electronic Products, JEDEC Standard, 2003.
75. JESD22-B110B, Mechanical Shock-component and Subassembly, JEDEC Standard, 2009.
76. J. M. Gere, Mechanics and Materials, Springer-Verlag, 1994.
77. J. A. Collins, Failure of Materials in Mechanical Design, John Wiley & Sons, 1981.
78. M. M. Saleem and A. Soma, “Design Optimization of RF-MEMS Switch Consifering Thermally Induced Residual Stress and Process Uncertainties,” Microelectronics Reliability, Vol. 55, pp. 2284-2298, 2015.
79. D. G. Khushalani, V. R. Dubey, P. P. Bheley, J. P. Kalambe, R. S. Pande, and R. M. Partrikar, “Design Optimization and Fabrication of Micro Cantilever for Switching Application,” Sensors and Actuators A: Physical, Vol. 225, pp. 1-7, 2015.
80. Y. Tang, S. M. Luo, G. Y. Li, Z. Yang, R. Chen, and C. J. Hou, “Optimization of the Thermal Reliability of a Four-tier Die-Stacked SiP Structure Using Finite Element Analysis and Taguchi Method,” Microelectronics Journal, Vol. 73, pp. 18-23, 2018.
81. 黎正中譯，穩健設計之品質工程，台北圖書有限公司，台北，1993。
82. M. N. Horenstein and P. R. Stone, “A Micro-Aperture Electrostatic Field Mill Based on MEMS Technology,” Journal of Electrostatics, Vol. 51-52, pp. 515-521, 2001.
83. D. T. Read, Y. W. Cheng, and R. Geiss, “Morphology, Microstructure, and Mechanical Properties of a Copper Electrodeposit,” Microelectronic Engineering, Vol. 75, Issue 1, pp. 63-70, 2004.
84. B. A. Zahn, “Finite Element Based Solder Joint Fatigue Life Predictions for a Same Die Size-Stacked-Chip Scale-Ball Grid Array Package,” 27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium, San Jose, CA, USA, 2002.
85. C. L. Lu and M. K. Yeh, “Thermal Stress Analysis of Chip with Pressure Sensor Embedded in Accelerometer,” 2017 International Conference on Electronics Packaging (ICEP), Yamagata, Japan, April 19-22, 2017.
86. C. L. Lu and M. K. Yeh, “Stress Analysis of Shielding Electrode in Chip with Pressure Sensor Embedded in Accelerometer,” Microelectronics International, Vol. 36, No. 1, pp. 35-42, 2019.
87. T. Falat, K. Friedel, N. Marenco, and S. Warnat, “TSV Constraints Related to Temperature Excursion, Pressure During Molding, Materials Used and Handling Loads,” Microsystem Technologies, Vol. 15, Issue 1, pp. 181-190, 2009.
88. L. A. N. Melchor, Evaluation of Die Attach Materials for High Temperature Power Electronics Appictions and Analysis of the Ag Particles Sintering Solution, Doctoral Thesis, Department of Electronic Enginerring, University Autonomous of Barcelona, Barcelona, Spain, 2015.
89. R. Iannuzzelli, “Predicting Plated-Through-Hole Reliability in High Temperature Manufacturing Processes,” IEEE Electronic Components and Technology Conference (ECTC), Atlanta, GA, USA, 1991.
90. C. L. Lu and M. K. Yeh, “Thermal Stress Analysis for a CMOS-MEMS Microphone with Various Metallization and Materials,” Microelectronic Engineering, Vol. 213, pp. 47-54, 2019.
91. C. L. Lu and M. K. Yeh, “Thermal Stress and Failure Analysis for a CMOS-MEMS Microphone with Various Metallization and Materials,” MAM 2018, Materials for Advanced Metallization Conference, Milano, Italy, March 18-21, 2018.
92. C. L. Lu and M. K. Yeh, “Structural Enhancement for a CMOS-MEMS Microphone under Thermal Loading by Taguchi Method,” 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, Paper ID 135, May 28-31, 2019.
93. C.T. Ko, S.H. Tseng, and S.C. Lu, “A CMOS Micromachined Capacitive Tactile Sensor with High-frequency Output,” Journal of Microelectromechanical Systems, Vol. 15, No. 6, pp. 1708-1714, 2006.
94. C. L. Yeh, Y. S. Lai, and C. L. Kao, “Evaluation of Board-level Reliability of Electronic Packages under Consecutive Drops,” Microelectronics Reliability, Vol. 46, pp. 1172-1182, 2006.
95. C. L. Coq, A. Tougui, M. P. Stempin, and L. Barreau, “Optimization for Simulation of WL-CSP Subjected to Drop-test Plasticity Behavior,” Microelectronics Reliability, Vol. 51, pp. 1060-1068, 2011.
96. M. L. Wu and J. S. Lan, “Reliability and Failure Analysis of SAC 105 and SAC 1025N Lead-free Solder Alloys during Drop Test Events,” Microelectronics Reliability, Vol. 80, pp. 213-222, 2018.
97. B. Halg, “On a Nonvolatile Memory Cell Based on Micro-electro-mechanics,” IEEE Proceedings on Micro Electro Mechanical Systems, An Investigation of Micro Structures, Sensor, Actuators, Machines and Robots, pp. 172-176, 1990.
98. J. Dolbow and M. Gosz, “Effect of Out-of-plane Properties of a Polyimide Film on the Stress Field in Microelectronic Structures,” Mechanics of Materials, Vol. 23, pp. 311-321, 1996.
99. Y. Wang and Q. Yang, “Study on Effect of Master DOF on Error of PCB Substructure Modal Analysis,” Proceedings of IET Conference on The Institution of Engineering & Technology, pp. 1-5, 2015.
100. P. R. Ni, C. L. Lu, and M. K. Yeh, “Shock Loading Analysis for MEMS Capacitive Microphone with Various Materials in Acoustic Plate,” MAM 2018, Materials for Advanced Metallization Conference, Milano, Italy, March 18-21, 2018.
101. C. L. Lu, P. R. Ni, and M. K. Yeh, “Stress Analysis of CMOS-MEMS Microphone under Shock Loading by Taguchi Method,” ESREF 2018, 29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Aalborg, Denmark, Paper ID 55, October 1-5, 2018.
102. C. L. Lu, P. R. Ni, and M. K. Yeh, “Stress Analysis of CMOS-MEMS Microphone under Shock Loading by Taguchi Method,” Microelectronics Reliability, Vol. 88-90, pp. 824-828, 2018.
103. M. K. Yeh and C. L. Lu, “Stress Analysis and Structural Improvement of a CMOS-MEMS Microphone Chip under Thermal Loading,” 3rd ICMEA 2018, International Conference on Material Engineering and Application, Hong Kong, China, Paper ID MEA#043, August 10-12, 2018.
104. JESD22-A104C, Temperature Cycling, JEDEC Standard, 2005
105. http://www.istgroup.com/tw/service/Dual-Beam-FIB/, retrieved on June 22, 2018.
106. http://www.istgroup.com/tw/service/SEM/, retrieved on June 22, 2018.
107. J. Bagdahn, W. N. Sharpe, and Jr., O. Jadaan, “Fracture Strength of Polysilicon at Stress Concentrations,” Journal of Microelectromechanical Systems, Vol. 12, pp. 302-312, 2003.