由於近年來電子科技的高度成長，電子產品的趨勢是走向小型化、輕量化、薄型化、高速化、高機能化、高密度化及低成本化，而電子封裝技術亦已朝向高腳數及精緻化發展，因此單一封裝體，其封裝體積愈小而電晶體數目愈高已是封裝技術所欲追求之目標。然而高電晶體數目導致電子元件在運作時會產生較高的熱，這對於電子元件的壽命有極大之影響，溫度對於電子元件而言，是控制其壽命的主要因素，因此若能預測封裝體受熱時的行為，對於改善其製程及提高可靠度應有不少之助益。
本文利用數值分析及實驗兩種不同方式來進行探討應變量，在實驗部分方面，係利用在鑄模灌酯上經由機械加工後，再利用雲紋干涉術來觀測電子封裝體其橫斷面之位移量，進而得知其應變量。而在數值分析方面，將利用商用有限元素法套裝軟體ANSYS，來模擬電子封裝體受溫差熱負載，再與實驗結果做比較，並試著嘗試改變鑄模灌酯之機械性質及幾何形狀，來探討對電子封裝體應變量之影響，進而提供相關從業人員之參考

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