掉落試驗(Drop Test)是微機電元件開發過程中具指標性的一環，因為當元件裝載在機台或行動裝置，容易因掉落而受到衝擊。本文目的為利用有限單元軟體ANSYS®建立微機電環境感測晶片模型，進行模態及動態分析。模擬微機電環境感測晶片在運作時受到壓力及衝擊負載時其應力與變形，探討微機電環境感測晶片元件之可靠度，並以掉落試驗來驗證模擬結果。最後藉由田口法進行微機電環境感測晶片配置的最佳化分析，以降低晶片配置中微機電環境感測晶片的黏膠層應力為目標來提升整體晶片配置可靠度。
本文首先探討微機電壓力計結構，藉由分析不同尺寸壓力計上電極在運作時受到壓力差負載時，其結構變形及應力分布；再以變形程度與實際製程情況討論壓力計的適用範圍及尺寸。接著分別對微機電溫溼計及壓力計元件進行模態分析，發現兩者之共振頻率皆遠大於外在頻率負載，顯示兩者皆不會發生共振而損壞。從微機電環境感測晶片的掉落衝擊分析中發現晶片受到衝擊時，微機電溫濕計有最大的位移及主應力，在微機電壓力計的上下電極間的二氧化矽層兩側也有應力集中的現象。由整體晶片配置模型的衝擊分析中發現黏膠層的最大von Mises應力值接近黏膠層的鍵結強度而可能導致損壞。藉由田口法進行整體晶片配置的最佳化分析可解決黏膠層損壞問題，利用調整幾何結構，以降低整體晶片配置中環境感測晶片黏膠層的最大von Mises應力，結果顯示利用田口法可降低89 %環境感測晶片黏膠層的最大von Mises應力。最後進行掉落試驗以驗證有限單元分析結果。本文所得結果可供微機電環境感測晶片結構及模組配置之參考。

Drop test is an important method in the development of MEMS devices. Since as the electronic components are installed on machines or mobile devices, they are easily impacted by falling. The purpose of this study is to establish models of MEMS environmental sensing chips for modal and dynamic analyses using the finite element software ANSYS®. These finite element models are used to analyze the reliability of CMOS-MEMS environmental sensing chip under air pressure, vibration and shock. The simulation results were verified by drop test experiments. Finally, the optimization of the overall chip configuration of MEMS environmental sensing chips by the Taguchi method is carried out to reduce the stress of the adhesive of MEMS environmental sensing chip and to improve the reliability in the overall configuration.
The deformation and stress distribution of MEMS barometer were discussed by analyzing the upper electrode of different size under air pressure. Then, by the modal analysis of MEMS hygrometer, thermometer and barometer, it was found that their fundamental frequencies are far greater than the frequency from external loads, indicating that they would not fail during service condition. From the drop impact analysis of MEMS environmental sensing chip model, it was found that the MEMS hygrometer and thermometer had larger displacement and principal stress when the chip was under impact. The stress concentration was found on both sides of the silicon dioxide layer between the upper and lower electrodes of MEMS barometer. In the drop impact analysis of overall chip configuration, after the optimization by the Taguchi method with adjustment of chip structure, the maximum von Mises stress of adhesive in environmental sensing chip was successfully reduced 89% to prevent the adhesive failure. Finally, a drop impact test was performed to verify the results obtained from finite element analysis. The results presented in this study could give valuable suggestions for the designers of MEMS environmental sensing chip.

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