本文的研究目的主要是利用奈米壓痕系統進行微懸臂樑彎矩測試，並透過測得之負載-位移關係曲線，計算出薄膜材料的楊氏係數。本文針對微懸臂樑彎矩實驗中，探討數種影響楊氏係數計算的誤差效應並修正之：(1)利用有限元素的模擬，修正微懸臂樑四分之一平面邊界造成的影響；(2)將探頭刺穿懸臂樑表面的壓痕效應排除；(3)透過實驗的方法，將儀器定位解析度所造成的誤差排除。並由上述數種效應整理出一修正的微懸臂樑彎矩測試實驗方法，如此可較準確地測得材料楊氏係數。另外和壓痕測試法的結果比較發現，彎矩測試法與壓痕測試法的量測結果約有10%左右的差異量。

This study aims to determine the thin film material properties using the bending test of micromachined cantilevers. The bending test was performed by using a nanoindentation loading system. There are two merits in this study, (1) the indentation of the film during the test was considered and corrected, and (2) the boundary effect was considered in the model by finite element method. In application, the elastic modulus of electroplating Nickel film with 11μm thick and thermal oxide film with 2.1μm were characterized.

According to the results in this study, the load-deflection tests of the micromachined cantilevers using a nano-indentation system are significantly improved. Because the approach is very simple and straightforward, it can be applied as a supplement to the other measurement techniques.

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