研究生: |
張汝柏 |
---|---|
論文名稱: |
電子軟銲Sn-In-Zn合金液相線投影圖及其與Ag, Cu, Ni 之界面反應 Liquidus projection of Sn-In-Zn electronic solders and their interfacial reactions with Ag, Cu, Ni substrates |
指導教授: | 陳信文 |
口試委員: |
陳信文
林士剛 王彰盟 王愉博 |
學位類別: |
碩士 Master |
系所名稱: |
工學院 - 化學工程學系 Department of Chemical Engineering |
論文出版年: | 2012 |
畢業學年度: | 100 |
語文別: | 中文 |
論文頁數: | 121 |
中文關鍵詞: | 無鉛銲料 、界面反應 |
外文關鍵詞: | Sn-In-Zn |
相關次數: | 點閱:2 下載:0 |
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Sn-In-Zn合金是發展潛力的無鉛銲料。本研究以反應偶實驗方法,探討Sn-20.0wt.%In-x%Zn 合金 (x介於0.5wt.%-5.0wt.%)間,與Ag、Cu以及Ni基材之界面反應。包含了對銅於230℃以及260℃下之液固反應,以及150℃下對銀,鎳以及銅之固固反應。
當鋅含量為0.5 wt.%以及0.7 wt.%時,Sn-20wt.%In-x%Zn/Cu在230oC反應,界面處生成Cu6Sn5相。將溫度提高至260oC,界面仍生成Cu6Sn5相。此結果與Sn-In/Cu之界面反應結果相似。當鋅增加至1.0 wt.%以上,Sn-20wt.%In-x%Zn/Cu之反應偶在230oC,反應則生成Cu5Zn8相。但是Sn-20wt.%In-x%Zn/Cu之反應在260oC時,鋅為1.0 wt.%時,生成CuZn相,當鋅增加至2.0wt.%則為Cu5Zn8相。此結果與Sn-Zn/Cu之反應有相似與不同之處。
Sn-20wt.%In-x%Zn/Ag反應偶於150o反應,結果與Sn-Zn/Ag界面反應結果相似。當鋅含量為2.0wt.%、3.0wt.%、5.0wt.%時,界面皆生成三層介金屬相,分別為ε-AgZn3、γ-Ag5Zn8、ζ-AgZn相。當鋅含量低於1.0 wt.%時,界面會有三層生成相,最外層為含有銦之ζ-AgZn相,由於鋅含量之不同而有顏色上的差異,中間為結構較鬆散含有鋅溶解度之ζ相,最內層也是ζ-AgZn相,與外側相比銦含量較低。
對鎳固固反應的部分,於Sn-20In中添加微量鋅(0.5wt.%)就會使生成相由Ni3Sn4相變成γ-Ni5Zn21相。
藉由Sn-In-Zn三元系統液相線投影圖可以探討Sn-In-Zn之固化路徑,在本研究中將Cui等人利用CALPHAD(calculation of phase diagram)計算方法繪出Sn-In-Zn三元系統液相線投影圖進行修正,完成Sn,γ以及Zn相區,β相以及In相區由於金相處理較為困難,並未在本研究中完成。
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