簡易檢索 / 詳目顯示

回結果列表
研究生： 陳怡伶
Chen, Yi-Lin
論文名稱： 異向性導電膠之黏彈性質與覆晶軟膜之可靠度關聯性評估
Correlation Between the Viscoelastic Properties of Anisotropic Conductive Adhesive and Reliability of Chip-on-Flex
指導教授： 葉銘泉
Yip, Ming-Chuen
口試委員:
學位類別： 碩士
Master
系所名稱： 工學院 - 動力機械工程學系
Department of Power Mechanical Engineering
論文出版年： 2009
畢業學年度： 97
語文別： 中文
論文頁數： 89
中文關鍵詞： 異向性導電膠 、強度 、楊氏模數 、應力鬆弛 、動態機械性質
相關次數： 點閱：4  下載：0 
分享至:
查詢本校圖書館目錄 查詢臺灣博碩士論文知識加值系統 勘誤回報

    • 異向性導電膠在覆晶軟膜連接技術上受到廣泛的發展應用因為有成本低、環保、低溫處理及可達到細微間距等優點。本研究主要探討了兩種不同型號的異向性導電膠，型號分別為PE100與FP17-20，在不同應變率和溫度下其材料強度與楊氏模數的變化，此外，更針對異向性導電膠的可靠度方面，進行了高溫高濕老化及溫度循環測試。另外一方面，也做了不同溫度的應力鬆弛試驗及不同頻率下的動態機械性質測試。

    目錄...........................................I 表目錄........................................IV 圖目錄.........................................V 符號表.........................................X 第一章 前言....................................1 1-1電子封裝簡介................................1 1-2無鉛封裝技術的發展..........................1 1-3導電膠的種類................................2 1-4異向性導電膠................................3 第二章 研究動機................................5 第三章 文獻回顧................................7 3-1異向性導電膠的固化參數......................7 3-2異向性導電膠的接合參數......................8 3-3異向性導電膠的應力鬆弛測試..................10 3-4異向性導電膠的動態機械性質測試..............11 3-5異向性導電膠的可靠度........................11 3-6 WLF方程式與時間-溫度疊合原理...............15 第四章 實驗內容及程序..........................18 4-1實驗設備....................................18 4-1-1 Instron-8848微拉伸試驗機.................18 4-1-2溫度和濕度控制箱..........................19 4-1-3拉伸夾置具................................20 4-1-4 XY平台...................................20 4-1-5熱風循環烘箱..............................20 4-1-6加熱器....................................20 4-1-7掃描式熱差分析儀..........................20 4-1-8熱機械分析儀..............................21 4-1-9恆溫恆濕測試機 ............................21 4-1-10動態機械分析儀...........................21 4-1-11溫溼循環試驗機...........................22 4-1-12電子天平.................................22 4-2試片製作及規格..............................22 4-3實驗測試方法................................23 4-3-1掃描式熱差分析儀測試......................23 4-3-2熱機械分析儀測試..........................24 4-3-3靜態軸向拉伸試驗..........................24 4-3-4高溫環境測試..............................24 4-3-5動態機械分析..............................25 4-3-6時間-溫度疊合原理.........................26 4-3-7吸濕試驗分析..............................29 4-3-8溫度循環測試..............................29 4-3-9高溫高濕老化..............................30 4-3-10應力鬆弛測試.............................30 第五章 結果與討論..............................31 5-1掃描式熱差分析..............................31 5-2熱機械分析.................................. 32 5-3異向性導電膠的吸濕測試分析.................. 32 5-4異向性導電膠的軸向拉下的軸向拉伸測試.... 33 5-4-2異向性導電膠在不同應變率下的軸向拉伸測試.. 34 5-4-3兩種異向性導電膠的拉伸性質比較............ 35 5-4-4拉伸試驗的時間-溫度疊合原理............... 35 5-4-5經高溫高濕老化之異向性導電膠的拉伸性質.... 36 5-4-6經溫度循環之異向性導電膠的拉伸性質........ 37 5-5異向性導電膠的應力鬆弛測試.................. 38 5-5-1不同溫度下之應力鬆弛測試.................. 38 5-5-2應力鬆弛試驗的時間-溫度疊合原理........... 40 5-6異向性導電膠的動態機械性質.................. 41 5-6-1不同頻率下之動態機械性質.................. 41 5-6-2動態機械性質的時間-溫度疊合原理........... 42 第六章 結論.................................... 43 參考文獻....................................... 46 附表........................................... 51 附圖........................................... 54

    1. K.W. Jang, C.K. Chang, W.S. Lee and K.W. Paik, “Material properties of anisotropic conductive films (ACFs) and their flip chip assembly reliability in NAND flash memory applications,” pp.1-10,2008.
    2. H.Y. Son, C.K. Chung, M.J. Yim and K. W. Paik, “Wafer Level Package using Pre-Applied Anisotropic Conductive Films (ACFs) for Flip-Chip Interconnections,” IEEE, pp.565-569, 2006.
    3. M.J. Yim, J. Hwang and K.W. Paik, “Anisotropic conductive films (ACFs) for ultra-fine pitch Chip-On-Glass (COG) applications,” International Journal of Adhesion & Adhesives, Vol.27, pp.77-84, 2007.
    4. J.W. Kim, Y.C. Lee, D.G. Kim and S.B. Jung, “Reliability of adhesive interconnections for application in display module,” Microelectronic Engineering, Vol.84, pp.2691-2696, 2007.
    5. M.A. Uddin, M.O. Alam, Y.C. Chan and H.P. Chan, “Adhesion strength and contact resistance of flip chip on flex packages-effect of curing degree of anisotropic conductive film,” Microelectronic Engineering, Vol.44, pp.505-514, 2004.
    6. L. Li and J.E. Morris, “An introduction to electrically conductive adhesives,” Int. J. Microelect. Pkg., Vol.1, pp.159-175, 1998.
    7. Y. Li and C. P. Wong, “Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications,” Materials Science and Engineering, R: Reports, Vol. 51, pp. 1-35, 2006.
    8. M.J. Rizvi, C. Bailey and H. Lu, “Failure mechanisms of ACF joints under isothermal aging,” Microelectronics Journal, Vol.39, pp.1101-1107, 2008.
    9. P. Savolainen, “Display Driver Packaging：ACF Reaching the Limits？” 9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, pp. 7-10, 2004.
    10. J. Liu and J. E. Morris, in: Proceedings of the American Society of Mechanical Engineers 27th Workshop on Polymeric Materials for Microelectronics and Photonics Applications: Mechanics, Physics, Reliability, Processing, pp.259–281, 1999.
    11. X. Chen, J. Zhang, C. Jiao and Y. Liu, “Effects of different bonding parameters on the electrical performance and peeling strengths of ACF interconnection,” Microelectronics Reliability, Vol. 46, pp. 774-785, 2006.
    12. Y.C. Chan and D. Y. Luk, “Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly I. Different bonding temperature,” Microelectronics Reliability, Vol. 42, pp. 1185-1194, 2002.
    13. J. Liu, “Conductive Adhesives for Electronic Packaging.” Isle of Man Electrochemical Publications, 1999.
    14. H. J. Kim, S. M. Hong, S. Y. Jang, Y. J. Moon and K. W. Paik, “Bubbles formation in rigid-flexible substrates bonding using anisotropic conductive films (ACFs) and their effects on ACFs joints reliability,” Proceedings of 7th Electronic Packaging Technology Conference, Vol. 2, pp. 734-739, 2005.
    15. B. Wunderle, C. Kallmayer, H. Walter, T. Braum, A. Gollhardt, B. Michel and H. Reichl, “Failure modeling of ACA-glued flip-chip on flex assemblies,” Microsystem Technologies, Vol. 15, pp. 3-15, 2009.
    16. 黃建元,“異方性導電膜在覆晶軟膜接合技術之機械性質與可靠度測試之研究,”碩士論文-國立清華大學動力機械工程研究所, 2006.
    17. S. Ronan, T. Alshuth, S. Jerrams and N. Murphy,“ Long-term relaxation prediction for elastomers using the time-temperature superposition methods, ” Material and Design, Vol. 28, pp.1513-1523, 2007.
    18. 潛振寰, “底膠材料IC封裝熟化過程中黏彈性質之模型建構,” 碩士論文-國立成功大學機械工程研究所, 2006.
    19. M. Patel, “Viscoelastic properties of polystyrene using dynamic rheometry,” Polymer Testing, Vol.23, pp.107-112, 2004.
    20. M. Teo, S.G. Mhaisalkar, E.H. Wong, P.S. Teo, C.C. Wong, K. Ong, C.F. Goh and L.K. Teh, “ Correlation of material properties to reliability performance of anisotropic conductive adhesive flip chip packages,” Components and Packaging Technologies, Vol. 28, pp.157-164, 2005.
    21. 楊景斌, “異方性導電膠膜覆晶結合技術之機械性質與環境可靠度測試,” 碩士論文-國立清華大學動力機械工程研究所, 2005.
    22. M.J. Rizvi, H. Lu, C. Bailey, Y.C. Chan, M.Y. Lee and C.H. Pang, “ Role of bonding time and temperature on the physical properties of coupled anisotropic conductive-nonconductive adhesive film for flip chip on glass technology, ” Microelectron Eng. Vol. 85, pp.238-244, 2008.
    23. M.J. Rizvi, Y.C. Chan, C. Bailey, H. Lu and A. Sharif, “ The effect of curing on the performance of ACF bonded chip-on-flex assemblies after thermal ageing, Soldering and Surface Mount Technology Journal, Vol. 17, pp.40-48, 2005.
    24. 陳建良,“利用異向性導電模接合得覆晶軟板結合技術其撓曲行為之研究,”碩士論文-國立清華大學動力機械工程研究所, 2007.
    25. S.T. Lu, and W.H. Chen, “Reliability of Ultra-thin Chip-on-Flex (UTCOF) with Anisotropic Conductive Adhesive (ACA) Joints,” Electronic Components and Technology Conference, pp.1287-1293, 2008.
    26. C.M. Wu and M.L. Chau,“ Degradation of flip-chip-on-glass interconnection with ACF under high humidity and thermal aging,” Soldering and Surface Mount Technology, Vol. 14, pp.51-58, 2002.
    27. G. Xian V.M. Karbhari, “ Segmental relaxation of water-aged ambient cured epoxy, ” Polymer Degradation and Stability, Vol. 92, pp.1650-1659, 2007.
    28. L. K. Teh, M. Teo, E. Anto, C. C. Wong, S. G. Mhaisalkar, P. S. Teo, and E. H. Wong, “Moisture-Induced Failures of Adhesive Flip Chip Interconnects,” Transactions on Components and Packaging Technologies, Vol. 28, pp.506-516, 2005.
    29. B. LR and Y. AF, “ Moisture diffusion and hygrothermal aging in bismaleimide matrix carbon fiber composites-part I: uni-weave composites, ” composite Sci Technology, Vol.62, pp.2099-2110, 2002.
    30. M.L. Williams, R.F. Landel and J.D. Ferry, “The temperature dependence of relaxation mechanisms in amorphous polymers and other glass-forming liquids,” J. Am. Chem. Soc, Vol.77, pp.3701-3707, 1955.
    31. Y. Miyano, M. Nakada and N. Sekine, “Accelerated testing for long-term durability of GFRP laminates for marine use,” Composites: Part B, Vol.35, pp.497-502, 2004.
    32. Y. He, “Thermomechanical and viscoelastic behavior of a no-flow underfill material for flip-chip applications,” Thermochimica Acta, Vol.439, pp. 127-134, 2005.
    33. ASTM D3418-08, “Standard Test Method for Transition Temperature and Enthalpies of Fusion and Crystallization of Polymers by Differential Scanning Calorimetry, ” 2008
    34. ASTM E831-06, “Standard Test Method Assignment for Linear Thermal Expansion of Solid Material by Thermomechanical Analysis, ” 2006.
    35. ASTM D882-02, “Standard Test Method for Tensile Properties of Thin Plastic Sheeting,” 2008.
    36. ASTM D4065-06, “Standard Practice for Plastics: Dynamic Mechanical Properties: Determination and Report of Procedures1,” 2008.
    37. ASTM D 5026-06, “Standard Test Method for Plastic：Dynamic Mechanical Properties：In Tension, 2006
    38. R. Li, “Time-temperature superposition methods for glass transition temperature of plastic material,” Material Science and Engineering, Vol.A278, pp. 36-45, 2000.
    39. J. D. Ferry, “Viscoelastic properties of polymers, ” Wiley, 1980.
    40. JESD22-A120A, “ Test Method for Measurement of Moisture Diffusivity and Water Solubility in Organic Materials Used in Electronic Devices, 2001.
    41. ASTM E 3286-02, “Standard Test Method for Stress Relaxation for Materials and Structures, 2002.

    無法下載圖示 全文公開日期 本全文未授權公開 (校內網路)
    全文公開日期 本全文未授權公開 (校外網路)

    QR CODE