本研究在探討12吋晶圓廠內的物料運輸問題。由於12吋晶圓重量造成人工搬運上的困難，因此自動物料搬運系統(AMHS)在12吋晶圓廠中被大量使用。但在實務的12吋晶圓廠的Intrabay系統中，仍然存在一些特別狀況，需要以人力去搬運以達到較好的生產績效。在現階段Intrabay系統的搬運100%自動化是很難達成的。因此本研究將探討混合式的搬運系統(HTS)模式，同時考慮以人力搭配OHT (Overhead Hoist Transport) 進行搬運。
在研究方法上，我們利用彩色時間性裴氏圖(CTPN)去建構混合式的搬運系統 (HTS) 模式。混合式之搬運系統模式可以適用於半導體不同區域的Intrabay系統，基於此目的該模式必須為一個具一般化的模型。在建構彩色時間性裴氏圖的模式上，我們將模式結構跟模式組態分離，以避免因為問題組態而影響到模式的結構。混合式之搬運系統模式主要包含兩個子系統，一為搬運系統，另一個為生產系統。在建構搬運系統上必須同時考慮人力與OHT的不同的搬運行為，以及搬運時所會面臨的狀況，而生產系統上也必須考慮半導體不同區域內的生產行為。其次將這兩個子系統進行連結，以CTPN為基的混合式之搬運系統轉換成三階段模擬(Three-Phase Discrete Event Simulation)進行模擬分析。模擬不同的情境後，最後利用反應曲面法求得在最佳的績效下，人員與OHT的最適配置比率。
本研究的實驗結果可以用來當作半導體在人力與OHT的搭配的決策參考依據。以CTPN建構的模型具有一般性，因此可以作為規劃不同區域內人力與OHT的最適配置。

This study investigates the transportation problems in the semiconductor fabrication. Due to the weight and size of the 300 mm wafer lot, it is difficult to transport lots by operators, and therefore the automated material handling system (AMHS) is widely employed. Nevertheless, in practice, there are several special situations where operators perform better than AMHS. To date, fully-automated transportation for an intrabay is still difficult to achieve, so that generally the hybrid transportation system (HTS) is adopted. Hence, this study focuses on the optimal design of the HTS that incorporate overhead hoist transports (OHTs) with operators.
The proposed methodology exploits the colored timed Petri nets (CTPN) to model the HTS, which can be applied to diverse areas in the intrabay system of semiconductor fabrication, and the modeling tool for analyzing the HTS has to be generalized. The model structure is separated from the model configuration in modeling the HTS, and thus prevents the need to modify a model structure due to a different problem configuration. There are two sub-systems, the transportation system and the production system in the HTS. In the construction of the transportation system, one needs to consider simultaneously the different behavior of operators and OHTs, and different situations in the transportation.
Also one needs to consider the different production behavior in the different fabrication areas. Then, these two sub-systems are combined and the CTPN-based hybrid transport system is transformed into a three-phase discrete event simulation system for further analysis. After simulating different scenarios, the response surface method (RSM) is used to obtain the optimal allocation of OHTs and operators.
The results of this study can provide the needed information to support the decision for allocation of OHTs and operators. Besides, the CTPN-based HTS simulator is a general model which can be applied to diverse areas of semiconductor fabrication.

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