研究生: |
吳泰鋒 Tai-Feng Wu |
---|---|
論文名稱: |
氣泡式噴墨頭噴墨過程之數值模擬 Numerical Simulation of Bubble Inkjet Processes |
指導教授: |
潘欽
Chin Pan |
口試委員: | |
學位類別: |
碩士 Master |
系所名稱: |
原子科學院 - 工程與系統科學系 Department of Engineering and System Science |
論文出版年: | 2004 |
畢業學年度: | 92 |
語文別: | 英文 |
論文頁數: | 74 |
中文關鍵詞: | 微型氣泡 、CFD-ACE(U) 、入口邊界速度 、噴墨過程 、雷利方程式 、氣泡內壓力關係式 、液珠行為 |
外文關鍵詞: | microbubble, CFD-ACE(U), blow-suction method, ejection processes, the extended Rayleigh equation, Asai's pressure approximation, droplet behavior |
相關次數: | 點閱:2 下載:0 |
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本研究探討高熱通率下微型氣泡之成長過程與氣泡式噴墨頭噴墨過程之模擬。
其中, 微型氣泡之半徑隨時間的變化可由雷利方程式( extended Rayleigh
equation),配合Asai 建議之氣泡內壓力關係式(Asai, 1991)得到,並利用商用軟
體CFD-ACE(U),藉由入口邊界速度的變化,發展一種簡單之模擬氣泡成長與收縮
的方法。最後,本研究亦探討噴墨室與噴嘴之尺寸、加熱功率及溫度對噴墨過程與
液珠行為之影響。
根據模擬之結果,在氣泡成長前半段,由雷利方程式得到之微型氣泡半徑變化
與文獻中實驗值有相當好的吻合。而由入口速度邊界變化得到之模擬氣泡,也可達
到預期的體積變化速率。此外,利用此模擬氣泡模擬之噴墨過程顯示,噴出液珠之
速度會隨著噴孔面積與噴墨室的加大而變小,而液珠之體積與噴孔大小有正相關之
關係。然而,液體溫度的變化,對於液珠行為並無太大的影響。
In the present study, the variation of microbble radius under a high heat flux is
investigated and a simulated bubble is developed by the commercial software, CFD-ACE
(U), using a blow-suction method. The radius of microbubble is calculated by the
extended Rayleigh equation with Asai's pressure approximation(Asai, 1991) and the
results was fitted by the cubic spline method to be the input data of the simulated bubble.
Finally, a series of studies of the droplet behavior are conducted with various different
sizes of ink chambers and nozzles. Moreover the temperature effect was also discussed.
The results demonstrate that a good agreement in the early stage of bubble expansion
between the extended Rayleigh equation and the experimental data. This simulated bubble
volume is nearly coincided with the input bubble volume. Based on the results from the
simulation, the droplet velocity is found to decrease with an increase nozzle size and
chamber height, and the droplet volume increases with increase of the nozzle size.
However, the temperature effect is insignificant.
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