Bi2Te3是商業上經常使用的熱電材料，為了提高其效率，通常會摻雜Sb來製造P型半導體，添加Se來製作N型半導體。因此我們現在可在市面上購得的熱電致冷器，為以Bi2-xSbxTe3、Bi2Te3-ySey的三元化合物所製造而成，而其中(Bi2Te3)0.25(Sb2Te3)0.75是Bi2-xSbxTe3裡擁有最高效率之組成。在熱電材料中，通常使用銲料來連接銅基板與P-N型半導體，而熱電材料所使用的溫度範圍，通常也必須考慮到銲料的熔點，因此銲料對熱電材料的反應是非常重要的。固本研究將探討銲料中Sn與熱電材料中最重要之商用組成間(Bi2Te3)0.25(Sb2Te3)0.75之液/固與固/固界面反應，並對其反應生成相之生長型態，討論其生成反應機制。相平衡是材料研究的基礎，也對了解界面反應之生成相與路徑有相當大幫助，而在Sn-Sb-Te-Bi系統裡，三元相圖資料仍是相當缺乏，固本研究也選擇了Sn-Sb-Te三元系統相平衡來探討。
本研究共配製13個實驗點來得到Sn-Sb-Te三元系統在160℃下之相平衡數據，並在研究中確認了三元相SnSb2Te4的存在，且SnSb2Te4具有一定量之組成變化，而非固定之原子組成。此外由實驗也對該系統之平衡相皆含第三元溶解度有新的認知，如SnTe相含Sb溶解度可達到7.23%，Sb2Te3相含Sn溶解度可達到7.4%，Te相含Sb溶解度可達到3.7%，且含Sn溶解度可達到12.42%。
本研究對Sn與熱電材料中最重要之商用組成間(Bi2Te3)0.25(Sb2Te3)0.75之液/固與固/固界面反應進行探討。在160℃下固/ 固界面反應，可觀察到介金屬相SnTe之生成，但隨著反應時間拉長，介金屬相會破裂，使得基材與Sn中間生成裂縫，而終止Sn的擴散。
Sn與(Bi2Te3)0.25(Sb2Te3)0.75在250℃下液/ 固界面反應，首先生成SnTe相，而隨著反應時間增加，可以看到條紋狀的Sn3Sb2在SnTe中生成，形成生成相交錯排列的結構(alternating structure)，而這也是在Sn- Sb -Te- Bi系統第一次發現此現象。在整個反應中，SnTe相與Sn3Sb2相皆不斷的生成且變厚，在本實驗中也試著在生成Sn3Sb2相與未生成Sn3Sb2相的時間中，用較短的時間間隔來進行探討，也觀察到了未完全反應的Sn3Sb2相與完全反應的Sn3Sb2相兩種不同的相與組成，並解釋其生成機制。

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