異質材料間所發生的界面反應，一直以來都是十分有趣且具有挑戰性的研究課題。以微電子產品為例，其內部元件構裝接點，在銲料與基材接合之界面上，因彼此間組成濃度或者說是化學勢之差異，會提供一驅動力促使原子相互擴散，並於界面處反應生成介金屬相。除了組成差異所造成的驅動力外，在微電子產品之接點上，也存在電流的流動。由於電流的流動所造成之電遷移效應亦會影響原子的移動，因此在探討微電子產品接點所發生的界面反應時，應同時考慮組成的差異與電遷移兩種驅動力。然而幾乎所有相關的研究，都僅探討組成差異所造成之影響。基於相關資料之缺乏，本研究將同時探討電遷移效應與組成差異對界面反應的影響，主要研究的對象則是無鉛銲料接點上之界面反應。
本研究選擇錫-0.7wt%銅、錫-3.5wt%銀、錫-58wt%鉍與錫-9wt%鋅等四種無鉛銲料，並配合鎳與銀等基材來進行錫/鎳、錫/銀、鉍/鎳、鋅/鎳、錫-0.7wt%銅/鎳與錫-3.5wt%銀/鎳等界面反應實驗。研究的方法是利用反應偶的技術來製備試樣，並在反應偶兩端接上電線，並連接至直流電源供應器，以提供固定的電流密度通過反應偶界面。

實驗的結果顯示電遷移效應不會改變上述六個系統界面反應生成相的種類，但對生成相的成長速率卻有不一樣的影響。在錫/鎳、錫/銀、錫-0.7wt%銅/鎳與錫-3.5wt%銀/鎳反應偶試樣中，在電子流動方向與主要擴散原子錫擴散方向相同的界面上，電遷移效應會加速介金屬生成相的成長速率；反之，在電子流動方向與錫原子擴散方向相反的界面上，電遷移效應則會減緩介金屬生成相的成長速率。此外，實驗的結果亦顯示溫度的改變是影響電遷移驅動力強弱的重要因子。在此四個系統中，電遷移效應會隨著溫度的增加而減低其影響。

鉍/鎳系統則得到不同的結果。在電子流動方向與主要擴散原子鉍擴散方向相同與相反的界面上，介金屬生成相的成長皆受到加速的影響。顯示電流流經鉍/鎳界面時，並沒有引起明顯的電遷移效應，而是影響了原子的擴散行為。另外，實驗結果則發現電遷移效應對鋅/鎳界面反應生成相的成長並無明顯之影響。

本論文除了對實驗結果進行分析外，亦提出一個描述界面反應生成相在同時受到組成差異與電遷移效應影響時之成長模型。此模型對於錫/鎳、錫/銀與錫-3.5wt%銀/鎳等系統界面反應生成相成長之描述與實驗結果皆十分吻合。

本論文是第一個探討電子產品銲接點界面反應，在電遷移效應影響下之反應行為。實驗結果發現與傳統僅考慮組成差異之結果並不相同，電遷移效應證實是影響界面反應之一個重要因子。實驗的結果十分有趣，而此一開創性之課題，不僅在學術或是應用上皆具持續探究之價值。

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