在半導體製造業中，晶圓製造之生產流程是最繁複且複雜的一環，其生產流程長約40至60天不等，而其迴流生產方式更使得生產管控更是不易，是故對於交期的掌控及生產週期時間的變異控制實為一大挑戰。在IC製造業的領域裡，競爭是越來越激烈，然而，IC製造廠必需在良率、速度、準時達交三方面有過人之處，方能脫穎而出。
本研究按晶圓廠生產部門之根本目標，展開其目標層級架構，並針對架構中之工具性目標做跨廠區、跨公司的比較，並回顧已發表的相關文獻，如晶圓廠績效指標、WIP管制方法、瓶頸機台管理、Cycle Time設定及改善等，探討所用之生產指標與各種生產管制手法的優缺點，並針對出貨管控、生產週期時間提出新的管制手法。最後針對整體生產管制提出管理架構，並以某一晶圓廠為例，檢視其生產管制架構之完備性，以供晶圓製造廠生產管制之參考模式。

The production flow of semiconductor manufacturing is the most complicated and inextricable one in the manufacturing industry. The production duration is 40-60 days, and the reentrant production flow is quite different from traditional manufacturing industry. Thus the adequate control over lead time and production cycle is the key challenge for the production management. Competition in IC manufacturing industry is getting more intense, the only way to survive is to be outstanding on Yield, Cycle Time and On Time Delivery.
After thorough review on cross-factories, cross-companies comparison of production control methodologies, and also goes through literatures, such as WIP management, bottleneck management, cycle time reduction, and so on. This research aims to clarify strength and weakness of every production control methods, to point out the mystification of production indices regularly seen in this industry and to provide some solutions to common questions always happened in Fab. In the end, the management structure of total production control will be brought up, in order to provide reference to production control in Fab.

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