現今攜帶式電子產品的發展是朝向更輕薄短小功能更多樣化的趨勢發展，封裝技術的演進也應此需求而往體積更小導線間距更細微的技術演進，也因此具有細微導線間距、加工方便、符合環保要求等優點的異向性導電膠膜封裝技術便越來越受到各方的重視與發展。
本論文使用真實具功能的IC晶片，藉由異向性導電膠膜，採用相同熱壓製程參數與PI軟膜接合，形成COF（chip-on-flex）封裝體，以探討此種封裝體的可撓曲特性。由於此種封裝體的可撓曲性為其設計應用上的一大特色，因此本論文研究主要經由實驗來探討其受環境影響下可撓曲特性的表現與變化。實驗主要分為兩大部分，第一部分為COF的電性可靠度與其撓曲行為變化，透過不同溫濕環境、熱循環、高溫老化等加速環境時效作用後，於常溫進行線路電阻值量測與四點彎矩抗彎測試；第二部分則是在不同溫濕環境，以不同頻率參數和位移控制方式進行整個COF封裝體結構的四點彎矩疲勞測試。
實驗結果發現，經過環境時效作用後的試片的線路電阻值並不會有改變，顯示其電性方面可靠度十方良好；而在四點彎矩測試方面，經過高溫高濕時效作用，其可彎曲程度下降，在接合面上有破壞面轉移的現象發生，而經過熱循環與高溫老化後，試片能承受較大彎曲變形而不失效。破壞面則始終發生於ACF膠材。在四點彎矩疲勞測試的結果上，我們可以發現隨溫濕環境的加劇，疲勞壽命值顯著的減少，表示試片無法承受長時間的反覆彎曲變形便失效，另外隨著測試頻率增加，疲勞壽命值增加，但ACF膠材遭受破壞的程度也有所提高。

Chip-on-flex (COF) with anisotropic conductive film (ACF) assemblies is widely used in recent years because of their smaller packaged volume and flexibility. In this study, four-point bending test method was chosen to observe the flexible performance of the specimens.
The experiments were divided into two parts. In the first part, the accelerated environmental tests including high humidity (85 %RH) at high temperature (85 oC), high temperature aging（150 oC）, and thermal cycling test (-40 oC~125 oC). After different storage time of accelerated environmental tests, the COF assemblies were took out and tested at room temperature. Bending fatigue behavior of the COF assemblies was investigated as the second part. The displacement controlled bending fatigue tests were performed at 80 oC/85 %RH and 60 oC/85 %RH conditions with different frequencies.
The results show that the daisy-chain resistance of COF specimens were almost invariant during accelerated environmental tests. The flexibility of the COF assemblies decreased progressively with increasing aging time of the humidity test and the fracture mode was originally cohesive fracture and translated into interface fracture between ACF layer and substrate after the effect of humidity. However, the flexibility increased slightly with high temperature aging and thermal cycling. The transition phenomenon of the fracture mode didn’t appear during the high temperature aging and thermal cycling tests.
In the bending fatigue experiments, with increasing the temperature of testing environment, fatigue life at low frequency test decay more apparently than that at high one. Finally, it is obtained that the ACF layer destroyed notably at high frequency than low frequency at high temperature and humidity environment.

1. 陳力俊, 謝宗雍, “微電子材料與製程”
2. P. T. Vianco, in: K. J. Puttlitz, K. A. Stalter (Eds.), “Handbook of Lead-free Solder Technology for Microelectronic Assemblies,” Marcel Dekker, Inc., New York, USA, 2004, pp. 167-210.
3. R. Tummala (Ed.), “Fundamentals of Microsystems Packaging,” McGraw-Hill, New York, 2001.
4. K. Gilleo, in: J.S. Hwang (Ed.), “Environment-friendly Electronics: Lead-free Technology,” Electrochemical Publications Ltd., Port Erin, UK, 2001 (Chapter 24).
5. Y. Li and C. P. Wong, “Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications,” Materials Science and Engineering, R: Reports, Vol. 51, pp. 1-35, 2006.
6. M. J. Yim, J. Hwang and K. W. Paik, “Anisotropic conductive films (ACFs) for ultra-fine pitch Chip-On-Glass(COG) applications,” International Journal of Adhesion & Adhesives Vol. 27, pp. 77-84, 2006.
7. L. Jia, H. Ding, X. Sheng and B. Xie, “Evaluation of A Double-Layer Anisotropic Conductive film (ACF) for Fine Pitch Chip-on-Glass (COG) Interconnection,” Electronic Packaging Technology Conference, pp. 344-347, 2005.
8. M. J. Yim and K. W. Paik, “Recent advances on anisotropic conductive adhesives (ACAs) for flat panel displays and semiconductor packaging applications,” International Journal of Adhesion & Adhesives Vol. 27, pp. 304-313, 2006.
9. 張文珊, “驅動IC封裝方式特性比較,” 工研院 IEK-IT IS 計畫, 2006.
10. 楊景斌, “異方性導電膠膜覆晶結合技術之機械性質與環境可靠度測試,” 碩士論文-國立清華大學動力機械工程研究所, 2005.
11. P. Savolainen, “Display Driver Packaging：ACF Reaching the Limits？” 9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, pp. 7-10, 2004.
12. J. Liu and J. E. Morris, in: Proceedings of the American Society of Mechanical Engineers 27th Workshop on Polymeric Materials for Microelectronics and Photonics Applications: Mechanics, Physics, Reliability, Processing, pp.259–281, 1999.
13. A. Sepp□l□ and E. Ristolainen, “Study of adhesive flip chip bonding process and failure mechanisms of ACA joints,” Microelectronics Reliability, Vol. 44, pp. 639-648, 2004.
14. M. A. Uddin, M. O. Alam, Y. C. Chan and H. P. Chan, “Adhesion strength and contact resistance of flip chip on flex packages––effect of curing degree of anisotropic conductive film,” Microelectronics Reliability, Vol. 44, pp. 505-514, 2004.
15. X. Chen, J. Zhang, C. Jiao and Y. Liu, “Effects of different bonding parameters on the electrical performance and peeling strengths of ACF interconnection,” Microelectronics Reliability, Vol. 46, pp. 774-785, 2006.
16. Y. C. Chan and D. Y. Luk, “Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly I. Different bonding temperature,” Microelectronics Reliability, Vol. 42, pp. 1185-1194, 2002.
17. J. Liu, “Conductive Adhesives for Electronic Packaging.” Isle of Man Electrochemical Publications, 1999.
18. H. J. Kim, S. M. Hong, S. Y. Jang, Y. J. Moon and K. W. Paik, “Bubbles formation in rigid-flexible substrates bonding using anisotropic conductive films (ACFs) and their effects on ACFs joints reliability,” Proceedings of 7th Electronic Packaging Technology Conference, Vol. 2, pp. 734-739, 2005.
19. H. Kristiansen and J. Liu, “Overview of conductive adhesive interconnection technologies for LCDs,” IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, Vol. 21, No. 2, pp. 208-214, 1998.
20. K. W. Lee, H. J. Kim, M. J. Yim and K. W. Paik, “Curing and Bonding Behaviors of Anisotropic Conductive Films (ACFs) by Ultrasonic Vibration for Flip Chip Interconnection,” Electronic Components and Technology Conference, pp. 918-923, 2006.
21. G. J. Nam, M. H. Seo, K. H. Ryu and N. H. Kwak, “A new laser bonding method of anisotropic conductive films in flat panel display and in semiconductor packaging,” Proceedings of SPIE, Vol. SPIE-6107, pp. 1-15, 2006.
22. Y. P. Wu, M. O. Alam, Y. C. Chan and B. Y. Wu, “Dynamic strength of anisotropic conductive joints in flip chip on glass and flip chip on flex packages,” Microelectronics Reliability, Vol. 44, pp. 295-302, 2004.
23. J. H. Zhang, Y. C. Chan, Z. M. Zeng and Y. W. Chiu, “Research on the Interfacial Reaction between Anisotropic Conductive Film and Bumpless Die,” Electronic Components and Technology Conference, 2002.
24. Y. C. Chan and D. Y. Luk, “Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly II. Different bonding pressure,” Microelectronics Reliability, Vol. 42, pp. 1195-1204, 2002.
25. X. Chen, J. Zhang, C. Jiao and Y. Liu, “Effects of different bonding parameters on the electrical performance and peeling strengths of ACF interconnection,” Microelectronics Reliability, Vol. 46, pp. 774-785, 2006.
26. M. J. Yim and K. W. Paik, “The contact resistance and reliability of anisotropically conductive film (ACF),” IEEE Transactions on Advanced Packaging, Vol. 22, Issue 2, pp. 166-173, 1999.
27. L. Cao, Z. Lai and J. Liu, “Effect of curing condition of adhesion strength and ACA flip-chip contact resistance,” Proceedings of the 6th IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, pp. 254-258, 2004.
28. 吳丰順,吳懿平,鄔博□,陳力,“倒裝芯片各向異性導電膠互連的剪切結合強度,” 半導體學報, Vol. 25, No. 3, pp. 340-344, 2004.
29. C. M. L. Wu and M. L. Chau, “Degradation of flip-chip-on-glass interconnection with ACF under high humidity and thermal aging,” Soldering & Surface Mount Technology, Vol. 14, Issue 2, pp. 51-58, 2002.
30. C. W. Tan, Y. C. Chan and N. H. Yeung, “Behaviour of anisotropic conductive joints under mechanical loading,” Microelectronics Reliability, Vol. 43, pp. 481-486, 2003.
31. 黃建元, “異方性導電膜在覆晶軟膜接合技術之機械性質與可靠度測試之研究,” 碩士論文-國立清華大學動力機械工程研究所, 2006.
32. M. J. Yim and K. W. Paik, “Effect of nonconducting filler additions on ACA properties and the reliability of ACA flip-chip on organic substrates,” IEEE Transactions on Components and Packaging Technologies, Vol. 24, Issue 1, pp. 24-32, 2001.
33. M. J. Yim, J. S. Hwang, J. G. Kim, H. J. Kim, W. Kwon, K. W. Jang and K. W. Paik, “Anisotropic conductive adhesives with enhanced thermal conductivity for flip chip applications,” Proceedings of Electronic Components and Technology Conference, Vol. 1, pp. 159-164, 2004.
34. 張維倫, “異向性導電膠膜與黏晶膠的機械性質與可靠度測試,” 碩士論文-國立清華大學動力機械工程研究所, 2004.
35. C. M. L. Wu, N. H. Yeung, M. L. Chau and J. K. L. Lai, “Residual strength of OLB in a TAB assembly with ACF after thermal and mechanical loading.” Adhesive Joining and Coating Technology in Electronics Manufacturing, 1998.
36. M. Inoue, T. Miyamoto and K. Suganuma, “Relationship between curing conditions and interconnect properties of flexible printed circuit/glass substrate joints using anisotropic conductive films,” Proceeding of the 6th IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, pp. 248-253, 2004.
37. J. H. Constable, T. Kache, H. Teichmann, S. Muhle and M. A. Gaynes, “Continuous electrical resistance monitoring, pull strength, and fatigue life of isotropically conductive adhesive joints,” IEEE Transactions on Components and Packaging Technologies, Vol. 22, No. 2, pp. 191-199, 1999.
38. R. Gomatam, E. Sancaktar, D. Boismier, D. Schue and I. Malik, “Behavior of electronically conductive filled adhesive joints under cyclic loading. I. Experimental approach,” International Symposium on Advanced Packaging Materials, pp. 6-12, 2001.
39. M. Teo, S. G. Mhaisalkar, E. H. Wong, P. S. Teo, C. C. Wong, K. Ong and C. F. Goh, “Effects of anisotropic conductive adhesive (ACA) material properties on package reliability performance [flip-chip interconnects],” Electronics Packaging Technology Conference, pp. 718-725,2003.
40. W. Kwon, H. Kim, K. Paik, S. Jang and S. Hong,“Mechanical reliability and bump degradation of ACF flip chip packages using BCB (CycloteneTM) bumping dielectrics under temperature cycling,”J. Electronic Packaging, Vol. 126, pp. 202-207, 2004.
41. W. Kwon, M. Yim, K. Paik, S. Ham and S. Lee,“Thermal cycling reliability and delamination of anisotropic conductive adhesives flip chip on organic substrates with emphasis on the thermal deformation,”J. Electronic Packaging, Vol. 127, pp. 86-90, 2005.
42. E. Jokinen and E. Ristolainen, “Anisotropic conductive film flip chip joining using thin chips,” Microelectronics Reliability, Vol. 42, pp. 1913-1920, 2002.
43. Nagai, K. Takemura, K. Isaka, O. Watanabe, K. Kojima, K. Matsuda and I. Watanabe, in: Proceedings of the Second IEMT/IMC Symposium, pp. 353-357, 1998.
44. Watanabe, T. Fujinawa, M. Arifuku, M. Fujii and Y. Gotoh, in: Proceedings of 9th IEEE International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, pp. 11-16, 2004.
45. C. Lee and A. Yeo, “Resistance characterization of Au bump and anisotropic conductive adhesives under temperature and moisture conditions,” Proceedings of 6th Electronics Packaging Technology Conference, pp. 420-425, 2004.
46. L. Frisk and E. Ristolainen, “Flip chip attachment on flexible LCP substrate using an ACF,” Microelectronics Reliability, Vol. 45, pp. 583-588, 2005.
47. C. Y. Yin, M. O. Alam, Y. C. Chan, C. Bailey and H. Lu, “The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications,” Microelectronics Reliability, Vol. 43, pp. 625-633, 2003.
48. W. K. Chiang and Y. C. Chan, “Reliability of Anisotropic Conductive Film Joints Using Bumpless Chip—Influence of Reflow Soldering and Environmental Testing,” Journal of Electronic Packaging, Vol. 127, Issue 2, pp. 113-119, 2005.
49. J. H. Zhang, Y. C. Chan, M. O. Alam and S. Fu, “Contact resistance and adhesion performance of ACF interconnections to aluminum metallization.” Microelectronics Reliability, Vol. 43 pp. 1303-1310, 2003.
50. C. W. Tan, Y. W. Chiu and Y. C. Chan, “Corrosion study of anisotropic conductive joints on polyimide flexible circuits,” Materials Science and Engineering: B, Vol. 98, pp. 255-264, 2003.
51. J. Liu, “On the failure mechanism of anisotropically conductive adhesive joints on copper metallization,” International Journal of Adhesion & Adhesives Vol. 16, Issue 4, pp. 285-287, 1996.
52. L. L. Mercado, J. White, V. Sarihan and T. Y. T. Lee, “Failure mechanism study of anisotropic conductive film (ACF) packages,” IEEE Transactions on Components and Packaging Technologies, Vol. 26, Issue 3, pp. 509-516, 2003.
53. L. K. Teh, M. Teo, E. Anto, C. C. Wong, S. G. Mhaisalkar, P. S. Teo and E. H. Wong, “Moisture-induced failures of adhesive flip chip interconnects,” IEEE Transactions on Components and Packaging Technologies, Vol. 28, Issue 3, pp. 506-516, 2005.
54. Y. C. Lin, X. Chen, H. J. Zhang and Z. P. Wang, “Effects of hygrothermal aging on epoxy-based anisotropic conductive film,” Materials Letters, Vol. 20, Issue 24, pp.2958-2963, 2006.
55. JEDEC STANDARD - Temperature Humidity Bias Lifetest - JESD22-A101-B.
56. JEDEC STANDARD-Temperature Cycling-JESD22-A104-B.