TSV(Through-Silicon-Via)，中譯為直通矽晶穿孔，被視為是一個能夠實作三維度晶片(Three Dimensional Chip)，且有效解決global interconnection問題的一個方法。但是實際上TSV本身也是佔有面積的，若使用了過量的TSV可能會帶來反效果而使得繞線長增加。本篇研究中，將探討TSV有面積的前提下，TSV的使用數量與總繞線長(Total wirelength)的關係。

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