熱電致冷器(Thermoelectric Cooler, TEC)透過珀爾帖效應(Peltier Effect) 使得TEC試片在操作過程中存在溫度梯度，且因結構內部各個材料熱膨脹係數不匹配，造成電子元件間互相牽制，經過長時間反覆使用，容易導致元件破壞與損毀。
本研究利用電子光斑影像干涉術（Electronic Speckle Pattern Interferometry, ESPI）和數位影像相關（Digital Image Correlation, DIC）法兩種光學量測方法進行TEC變形量量測。本研究嘗試31對與127對兩種不同尺寸的TEC試片，以單邊夾持、中心支撐與雙面固定三種不同的夾持方式，研究獲得TEC試片在不同輸入電流造成之變形資訊。本研究結果顯示兩陶瓷板間的溫差與平面外位移關係為線性，且翹曲量（Warpage）不會因TEC試片不同的變形狀態（熱面膨脹冷面收縮狀態與冷面和熱面皆處於膨脹狀態）而有所改變，只與冷熱面的溫差有關。
本研究亦以有限元素法套裝軟體ANSYS 12.1建立31對TEC試片有限元素模型，搭配中心支撐之夾持方式，成功的比對了實驗與數值模擬結果，並藉由數值模擬瞭解TEC試片內部應力分佈的狀況。

[1] Wise Life Technologies, Corp., Taiwan, Republic of China.
[2] 林坤標, “熱電致冷器之三維暫態模擬分析”, 國立成功大學機械工程學系碩士論文, 2004.
[3] 朱旭山, “熱電材料與元件之原理與應用”, 電子與材料雜誌, Vol. 22, pp. 78-89, 2004.
[4] 洪宇均, “熱電晶片應用於LED 散熱之研究”, 國立臺灣大學工學院機械工程學研究所碩士論文, 2007.
[5] 鄭建明, “散熱器對熱電致冷器冷卻性能影響探討”, 國立中興大學機械工程研究所碩士論文, 2007.
[6] 卓孟樑, “利用熱電致冷器的醫用保溫箱之製作與性能測試”, 國立成功大學機械工程學系碩士論文, 2005.
[7] “ANSYS”, Revision 12.1, ANSYS, Inc., Canonsburg, PA, U. S. A., 2010.
[8] N. Butters, and J. A. Leendertz, “Holographic and Video Techniques Applied to Engineering Measurement”, Journal of Transactions of the Institute of Measurement and Control, Vol. 4, pp. 349-354, 1971.
[9] K. Biedermann and L. Erk, “A Recording and Display System for Hologram Interferometry with Low Resolution Imaging Devices”, Journal of Physics. E：Scientific Instruments, Vol. 8, pp. 571-576, 1975.
[10] O. J. L讧kberg and K. Hogmoen, “Vibration Phase Mapping Using Electronic Speckle Pattern Interferometry”, Applied Optics, Vol. 15, pp. 2701-2704, 1976.
[11] K. Creath, “Phase-Shifting Speckle Interferometry”, Applied Optics, Vol. 24, pp. 3053-3058, 1985.
[12] J. Moore and J. R. Tyrer, “Electronic Speckle Pattern Interferometer for Complete In-Plane Displacement Measurement”, Measurement Science and Technology, Vol. 1, pp. 1024-1030, 1990.
[13] A. K. Maji, J. L. Wang and J. Lovato, “Electronic Speckle Pattern Interferometry for Fracture Mechanics Testing”, Experimental Techniques, Vol. 15, pp. 19-23, 1991.
[14] E. A. Zaratea, E. Custodio, C. G. Trevino-Palacios, R. Rodrguez-Vera and H. J. Puga-Soberanes, “Defect Detection in Metals Using Electronic Speckle Pattern Interferometry”, Solar Energy Materials & Solar Cells, Vol. 88, pp. 217–225, 2005.
[15] R. Wang and M. Kido, “Using ESPI System to Measure High Temperature Fatigue Deformation of Ceramics Thermally Sprayed SUS304 Steel”, Journal of Materials Science, Vol. 39, pp. 1389-1395, 2004.
[16] K. S. Kim, W. S. Jang and M. S. Hong, “Thermal Strain Analysis of Composite Materials by Electronic Speckle Pattern Interferometry”, The Korean Society of Mechanical Engineers International Journal, Vol. 14, pp. 477-482, 2000.
[17] B. W. Lee, W. Jang, D. W. Kim, J. H. Jeong, J. W. Nah, K.W. Paik and D. Kwon, “Application of Electronic Speckle Pattern Interferometry to Measure In-plane Thermal Displacement in Flip-chip Packages”, Material Science and Engineering A, Vol. 380, pp. 231-236, 2004.
[18] D. Li, J. Tao, Q. Meng and H. Fang, “Indirect Measurement of Material Thermal and Mechanical Properties During Welding”, Journal of Materials Sciences & Technology, Vol. 19, pp. 173-175, 2003.
[19] C. Dudescu, J. Naumann, M. Stockmann and S. Nebel, “Characterisation of Thermal Expansion Coefficient Construction and Operation of a ESPI and Its Use in Measuring”, Strain, Vol. 42, pp. 197–205, 2006.
[20] K. M. Abedin, S.A. Jesmin and A.F.M.Y. Haider, “Construction and Operation of A Simple Electronic Speckle Pattern Interferometer and Its Use in Measuring Microscopic Deformations”, Optics & Laser Technology, Vol. 32, pp. 323-328, 2000.
[21] W. H. Peters and W. F. Ranson, “Digital Imaging Techniques in Experimental Stress Analysis”, Optical Engineering, Vol. 21, pp. 427-431, 1982.
[22] M. A. Sutton, W. J. Wolters, W. H. Peters, W. F. Ranson and S. R. McNeill, “Determination of Displacements Using an Improved Digital Correlation Method”, Image and Vision Computing, Vol. 1, pp. 133-139, 1983.
[23] W. H. Peters, W. F. Ranson, T. C. Chu and J. Anderson, “Application of Digital Correlation Methods to Rigid Body Mechanics”, Optical Engineering, Vol. 22, pp. 738-742, 1983.
[24] M. A. Sutton, Mingqi Cheng, W. H. Peters, Y. J. Chao and S. R. Mcneill, “Application of an Optimized Digital Correlation Method to Planar Deformation Analysis”, Image and Vision Computing, Vol.4, pp. 143-150, 1986.

[25]

P. F. Luo, Y. J. Chao, M. A. Sutton and W. H. Peters, “Accurate Measurement of Three-dimensional Deformations in Deformable and Rigid Bodies Using Computer Vision”, Experimental Mechanics, Vol. 33, pp. 123-132, 1993.
[26] Y. Sun and J. H. L. Pang, “Digital Image Correlation For Solder Joint Fatigue Reliability in Microelectronics Packages”, Microelectronics Reliability, Vol. 48, pp. 310-318, 2008.
[27] N. Li, M.A. Sutton, X. Li and H.W. Schreier, “Full-field Thermal Deformation Measurements in A Scanning Electron Microscope by 2D Digital Image Correlation”, Experimental Mechanics, Vol. 48, pp. 635-646, 2008.
[28] M. A. Sutton, N. Li, D. C. Joy, A. P. Reynolds and X. Li, “Scanning Electron Microscopy for Quantitative Small and Large Deformation Measurements. Part II: Experimental Validation for Magnifications from 200 to 10,000”, Experimental Mechanics, Vol. 47, pp. 775-787, 2007.
[29] B. Pan, H. M. Xie, H. Tao and A. Asundi, “Measurement of Coefficient of Thermal Expansion of Films Using Digital Image Correlation Method”, Polymer Testing, Vol. 28, pp. 75-83, 2009.
[30] Y. M. Tan, W. Fan, K. M. Chua, Z. F. Shi and C. K. Wang, “Fabrication of Thermoelectric Cooler for Device Integration”, Proceedings of Electronics Packaging Technology Conference, pp.802-805, Grand Copthorne Waterfront, Singapore, 7-9 December, 2005.
[31] D. J. Yao and K. C. Yeh, “熱電致冷器熱應力模擬”, 中國機械工程學會第二十四屆全國學術研討會論文集, pp. 446, 2007.
[32] Y. L. Chang and W. C. Wang, “Thermal Deformation Measurement in Thermoelectric Coolers by ESPI”, Proceedings of SEM XI Congress on Experimental and Applied Mechanics, pp.162-171, Orlando, Florida, U. S. A., June 5-8, 2008.
[33] W. C. Wang and Y. L. Chang, “Experimental Investigation of Thermal Deformation in Thermoelectric Coolers”, Accepted for Publication in Strain, 2010.
[34] 張依琳, “均時電子光斑影像干涉術於振動量測之理論與實驗再探討”, 國立清華大學動力機械工程學系碩士論文, 2007.
[35] 洪雍淳, “電子斑點干涉術應用於振動模態之分析與研究”, 國立中興大學機械工程學系碩士論文, 2003.
[36] 計欣華, 鄧宗白, 魯陽, “工程實驗力學”, 機械工業出版社, 2005.

[37]

張雅欣, “TFT-LCD 背光模組於不同溫濕條件下之平面外位移場檢測暨數值分析”, 國立清華大學動力機械工程學系碩士論文, 2008.
[38] Website: http://www.tle.ntut.edu.tw/main/wdb2/go.php?xmlid=32
25&urlxmlid=3232
[39] 沈宏燦, “人工網膜於活體兔子之機械性質與變形之探討”, 國立清華大學動力機械工程學系碩士論文, 2007.
[40] 張廷宇, “應用數位影像相關法探討人工網膜與動物筋膜之變形與機械性質”, 國立清華大學動力機械工程學系碩士論文, 2008.
[41] 何義傑, “二階段式數位影像關係法”, 國立雲林科技大學機械工程系碩士論文, 2008.
[42] Website: http://www.correlatedsolutions.com/
[43] Website: http://www.matweb.com/index.aspx
[44] J.P. Holman, “Heat Transfer”, 8th Edition, The McGraw-Hill Companies, Inc., New York, 2000.
[45] Website: http://www.victrex.com/tc/
[46] "Intelliwave", Version 5.008, Engineering Synthesis Design, Inc., Tucson, AZ, U. S. A., 2006.
[47] Website: http://www.moritex.co.jp/home/english/
[48] Website: http://www.gwinstek.com/us/contact.asp

[49] Website: http://www.yscco.com.tw/index.htm

[50] Website: http://www.crocoil.com/
[51] Website: http://www.taiwan-manufacturers.com/company-profile.
htm
[52] Website: http://www.peltier-info.com/animation1.gif