本論文之目標為研究鈮酸鋰-矽異質晶圓對最新觀察到的自發性裂口癒合行為，探討鈮酸鋰-矽異質晶圓對接合界面裂口性質，並比較與矽-矽晶圓對界面裂口性質間的差異，同時也討論施加電場可能對鈮酸鋰-矽異質晶圓對或矽-矽晶圓對之接合界面裂口性質的影響，期望尋找與建立鈮酸鋰-矽異質晶圓對界面裂口自發性癒合行為之可能的物理機制。
利用電漿活化方法將鈮酸鋰晶圓與矽晶圓接合，可達到良好的接合效果及接合強度；刀刃法觀察發現鈮酸鋰-矽異質晶圓對界面裂口在室溫下經過一段時間的放置，有自發癒合現象，且晶圓對上X軸方向的裂口癒合程度較Z軸方向的裂口為佳；矽-矽晶圓對接合界面裂口則無自發癒合現象。利用施加正向電場(正極:矽晶圓；負極:鈮酸鋰晶圓)的方式，使鈮酸鋰-矽異質晶圓對經過刀刃法量測的界面能回復。曾否施加正向電場對於鈮酸鋰-矽異質晶圓對之首次經刀刃法量測之新區域的界面裂口，其癒合的程度並無顯著差異。推測矽晶圓內部的磷離子受鈮酸鋰晶圓自發極化吸引至接合界面，形成陽離子架橋讓晶圓對兩表面的OH-基團更加靠近，部分區域經過去水會有共價鍵結產生，使得鈮酸鋰-矽異質晶圓對有自發性裂口癒合的行為。

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