現今的消費性電子產品以降低生產週期、大量生產和產品品質穩定為目標，同時為了因應電子元件趨向微小化，大量運用了表面黏著技術(SMT)，由於此過程中的錫膏材料、刮刀壓力與速度、鋼板開孔形狀等因素，在自動化的生產中產品難免會產生缺陷，若想增加自動檢測的穩健性就必須先將影像做強化處理，本研究針對四方平面無引腳封裝(QFN)底部的導熱片與印刷電路板之間的焊錫空洞缺陷檢驗發展穩健的影像強化法，以利於後續的檢測。
本研究分成兩個部分:第一部分是分析目前已應用於導熱片空洞缺陷檢測的適應性影像強化法，並提出改良，再以實驗結果驗證此改良確實能增強檢測的穩健性; 第二部分發展兩個更強健的適應性影像強化法，這兩個方法各有其適用條件，本研究將討論實驗結果並給出使用建議。

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