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研究生: 吳祐承
Wu, Yu Chen
論文名稱: 開發用於微型發光二極體組裝之微型吸取頭陣列
Development of Micro Pick-up Array for Micro LED Assembly
指導教授: 方維倫
Fang, Weileun
口試委員: 謝哲偉
Hsieh, Jerwei
傅建中
Fu, Chien Chung
學位類別: 碩士
Master
系所名稱: 工學院 - 動力機械工程學系
Department of Power Mechanical Engineering
論文出版年: 2016
畢業學年度: 104
語文別: 中文
論文頁數: 70
中文關鍵詞: 微型吸取頭陣列微型發光二極體批量轉移真空吸取
外文關鍵詞: Micro pick-up array, Micro LED, Batch transfer, Vacuum suction
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  • 目前廣泛使用的薄膜電晶體液晶顯示器,有著高功耗的缺點,因此開發節能的顯示器技術為近年的發展趨勢,其中極具發展潛力的為微型發光二極體顯示器,其具有自發光特性、低功耗、高發光效率等優點,但目前面臨到組裝效率不佳的問題,使得尚未能邁入商品化階段,並且限制了其相關的開發應用。

    本研究提出利用微機電技術將現有的真空吸取頭尺寸微小化,並採用陣列式的結構設計,來實現微型吸取頭陣列,將能夠用於微型發光二極體的批量轉移吸取,克服其受限於組裝效率之問題。所設計之微型吸取頭陣列結構是由陣列式真空孔、圓柱支撐、框架支撐及接觸表面所組成,其中的真空孔及圓柱支撐為主要的設計重點,分別用於抑制晶片變形和結構變形,以具有良好的吸取效果。


    The thin film transistor liquid crystal display is widely used, but it has high power consumption. Therefore, the development trend of the display technology is pursuing energy saving in recent years. The micro LED display has the great development potential and several advantages, for example, self-emission, low power consumption, and high light ultilization. However, the low assembly efficiency of the micro LED display is the main obstacle for commercialization and related applications.

    This study ultilizes MEMS technology to shrink the size of vacuum pick-up collects and uses the array structure design to implement the micro pick-up array. It can be applied to micro LED batch transfer to overcome the assembly efficiency problem. Structures of the presented micro pick-up array include arrays of vacuum holes, column supports, the frame support and contact surfaces. Among of them, vacuum holes and column supports are the key design for the deformation suppression of chips and structures in order to greatly aid the suction.

    中文摘要 I Abstract II 致謝 III 目錄 IV 圖目錄 VII 表目錄 X 第一章 緒論 1 1-1前言 1 1-2文獻回顧 4 1-2-1吸取過程分析 5 1-2-2吸取成功率改善方法 6 1-2-3吸取效率提升方法 7 1-3研究動機 7 第二章 設計與分析 14 2-1系統架構 14 2-2設計考量 16 2-3真空孔設計 18 2-3-1真空吸力 18 2-3-2吸取分析 19 2-4圓柱支撐設計 21 第三章 製程與結果 32 3-1製程流程 32 3-2製程問題與改善 35 3-3製程結果與討論 36 第四章 量測與結果 45 4-1吸取模組裝配 45 4-2特性量測 46 4-2-1真空吸力 46 4-2-2結構變形 47 4-2-3晶片變形 49 4-3吸取測試 50 4-3-1無黏著層吸取 50 4-3-2具有黏著層吸取 51 第五章 結論與未來工作 63 5-1結論 63 5-2未來工作 64 參考文獻 67

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